JPH0462176B2 - - Google Patents

Info

Publication number
JPH0462176B2
JPH0462176B2 JP58060765A JP6076583A JPH0462176B2 JP H0462176 B2 JPH0462176 B2 JP H0462176B2 JP 58060765 A JP58060765 A JP 58060765A JP 6076583 A JP6076583 A JP 6076583A JP H0462176 B2 JPH0462176 B2 JP H0462176B2
Authority
JP
Japan
Prior art keywords
wiring
polyimide resin
layer
bonding pad
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58060765A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59188153A (ja
Inventor
Tooru Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58060765A priority Critical patent/JPS59188153A/ja
Publication of JPS59188153A publication Critical patent/JPS59188153A/ja
Publication of JPH0462176B2 publication Critical patent/JPH0462176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/07551—
    • H10W72/07553—
    • H10W72/29—
    • H10W72/50—
    • H10W72/531—
    • H10W72/536—
    • H10W72/59—
    • H10W72/923—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58060765A 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法 Granted JPS59188153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060765A JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060765A JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59188153A JPS59188153A (ja) 1984-10-25
JPH0462176B2 true JPH0462176B2 (cg-RX-API-DMAC10.html) 1992-10-05

Family

ID=13151694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060765A Granted JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59188153A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077783B2 (ja) * 1988-03-18 1995-01-30 株式会社東芝 電気的接続部に銅もしくは銅合金製金属細線を配置する半導体装置
TW480636B (en) 1996-12-04 2002-03-21 Seiko Epson Corp Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
TW459323B (en) 1996-12-04 2001-10-11 Seiko Epson Corp Manufacturing method for semiconductor device
JP5855361B2 (ja) * 2011-05-31 2016-02-09 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833705B2 (ja) * 1975-08-27 1983-07-21 株式会社日立製作所 タソウハイセンオ ユウスルハンドウタイソウチ

Also Published As

Publication number Publication date
JPS59188153A (ja) 1984-10-25

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