JPS59175148A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59175148A
JPS59175148A JP58047949A JP4794983A JPS59175148A JP S59175148 A JPS59175148 A JP S59175148A JP 58047949 A JP58047949 A JP 58047949A JP 4794983 A JP4794983 A JP 4794983A JP S59175148 A JPS59175148 A JP S59175148A
Authority
JP
Japan
Prior art keywords
power source
chip
power supply
vee
vcc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58047949A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0480534B2 (enExample
Inventor
Toshiaki Sakai
酒井　敏昭
Kazumasa Nawata
名和田　一正
Mitsuhisa Shimizu
光久 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58047949A priority Critical patent/JPS59175148A/ja
Publication of JPS59175148A publication Critical patent/JPS59175148A/ja
Publication of JPH0480534B2 publication Critical patent/JPH0480534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W72/90—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP58047949A 1983-03-24 1983-03-24 半導体装置 Granted JPS59175148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58047949A JPS59175148A (ja) 1983-03-24 1983-03-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58047949A JPS59175148A (ja) 1983-03-24 1983-03-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS59175148A true JPS59175148A (ja) 1984-10-03
JPH0480534B2 JPH0480534B2 (enExample) 1992-12-18

Family

ID=12789609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58047949A Granted JPS59175148A (ja) 1983-03-24 1983-03-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS59175148A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165086A (en) * 1985-02-20 1992-11-17 Hitachi, Ltd. Microprocessor chip using two-level metal lines technology
US5280450A (en) * 1990-05-14 1994-01-18 Hitachi, Ltd. High-speed semicondustor memory integrated circuit arrangement having power and signal lines with reduced resistance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165086A (en) * 1985-02-20 1992-11-17 Hitachi, Ltd. Microprocessor chip using two-level metal lines technology
US5280450A (en) * 1990-05-14 1994-01-18 Hitachi, Ltd. High-speed semicondustor memory integrated circuit arrangement having power and signal lines with reduced resistance

Also Published As

Publication number Publication date
JPH0480534B2 (enExample) 1992-12-18

Similar Documents

Publication Publication Date Title
KR920010982B1 (ko) 전원선들의 향상된 배열을 갖는 반도체 집적회로 장치
CN204720445U (zh) 半导体器件和io单元
US6114903A (en) Layout architecture for core I/O buffer
TWI667768B (zh) 具有介面電路系統的積體電路及用於此介面電路系統之介面單元
US6897555B1 (en) Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die
JPH05121548A (ja) クロツク供給回路及びクロツク供給回路を有する集積回路
US4894708A (en) LSI package having a multilayer ceramic substrate
JPS59175148A (ja) 半導体装置
JP3487989B2 (ja) 半導体装置
US7429703B2 (en) Methods and apparatus for integrated circuit device power distribution via internal wire bonds
US5185652A (en) Electrical connection between buses on a semiconductor integrated circuit
JPS59181041A (ja) 半導体集積回路装置
JPH01307243A (ja) 半導体集積回路装置
CN105322943B (zh) 具有接口电路的集成电路、和用于接口电路的接口单元
JPS63104363A (ja) 半導体集積回路装置
JPH03192759A (ja) 半導体装置
JP2009289917A (ja) 半導体装置
JPS6146050A (ja) 半導体集積回路装置
JPH0645566A (ja) 半導体集積回路装置
JPH01257348A (ja) スタンダード・セル集積回路装置
JPH0262062A (ja) マスタースライス型半導体装置
JPH01111342A (ja) 集積回路用パッケージ
JPS6021543A (ja) マスタスライスｉｃおよびその製造方法
JP2592691B2 (ja) 集積回路素子
JPS6295853A (ja) 半導体集積回路