JPS59168030A - 熱可塑性ポリエ−テルイミドの製造法 - Google Patents
熱可塑性ポリエ−テルイミドの製造法Info
- Publication number
- JPS59168030A JPS59168030A JP4398283A JP4398283A JPS59168030A JP S59168030 A JPS59168030 A JP S59168030A JP 4398283 A JP4398283 A JP 4398283A JP 4398283 A JP4398283 A JP 4398283A JP S59168030 A JPS59168030 A JP S59168030A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- bis
- polymer
- dicarboxyphenoxy
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001601 polyetherimide Polymers 0.000 title claims abstract description 13
- 239000004697 Polyetherimide Substances 0.000 title claims abstract description 12
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 9
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- CJPIDIRJSIUWRJ-UHFFFAOYSA-N benzene-1,2,4-tricarbonyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C(C(Cl)=O)=C1 CJPIDIRJSIUWRJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 6
- 150000002367 halogens Chemical class 0.000 claims abstract description 6
- 229920000642 polymer Polymers 0.000 claims description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 claims description 2
- -1 m-phenylene, p-phenylene Chemical group 0.000 abstract description 12
- 125000003118 aryl group Chemical group 0.000 abstract description 10
- 150000004984 aromatic diamines Chemical class 0.000 abstract description 8
- NJWZAJNQKJUEKC-UHFFFAOYSA-N 4-[4-[2-[4-[(1,3-dioxo-2-benzofuran-4-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C=1C=C(OC=2C=3C(=O)OC(=O)C=3C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC2=C1C(=O)OC2=O NJWZAJNQKJUEKC-UHFFFAOYSA-N 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 238000000921 elemental analysis Methods 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
- 238000000862 absorption spectrum Methods 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 235000010893 Bischofia javanica Nutrition 0.000 description 4
- 240000005220 Bischofia javanica Species 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 238000010533 azeotropic distillation Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- MRTAEHMRKDVKMS-UHFFFAOYSA-N 4-[4-[4-(3,4-dicarboxyphenoxy)phenyl]sulfanylphenoxy]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC(C=C1)=CC=C1SC(C=C1)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 MRTAEHMRKDVKMS-UHFFFAOYSA-N 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000004683 dihydrates Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4398283A JPS59168030A (ja) | 1983-03-15 | 1983-03-15 | 熱可塑性ポリエ−テルイミドの製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4398283A JPS59168030A (ja) | 1983-03-15 | 1983-03-15 | 熱可塑性ポリエ−テルイミドの製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59168030A true JPS59168030A (ja) | 1984-09-21 |
JPH0433809B2 JPH0433809B2 (enrdf_load_stackoverflow) | 1992-06-04 |
Family
ID=12678922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4398283A Granted JPS59168030A (ja) | 1983-03-15 | 1983-03-15 | 熱可塑性ポリエ−テルイミドの製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59168030A (enrdf_load_stackoverflow) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60156729A (ja) * | 1983-12-30 | 1985-08-16 | ゼネラル エレクトリツク カンパニイ | ポリエーテルイミド‐ポリエーテルスルホンイミドコポリマー |
JPS6134025A (ja) * | 1984-06-29 | 1986-02-18 | アモコ、コ−ポレ−ション | 新規なポリエ−テルイミド |
JPS6183230A (ja) * | 1984-09-04 | 1986-04-26 | ゼネラル・エレクトリツク・カンパニイ | 結晶性ポリエ−テルイミドおよびそのポリアミド酸前駆体 |
WO1987001378A1 (en) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides and heat-resistant adhesives comprising the same |
JPS62185715A (ja) * | 1986-02-13 | 1987-08-14 | Mitsui Toatsu Chem Inc | 無色ポリイミドフイルム |
WO1987006251A1 (en) * | 1986-04-09 | 1987-10-22 | Mitsui Toatsu Chemicals, Incorporated | Polyimide resin composition |
JPS638455A (ja) * | 1986-06-30 | 1988-01-14 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
JPS63128025A (ja) * | 1986-11-19 | 1988-05-31 | Mitsui Toatsu Chem Inc | ポリイミド |
JPH01502914A (ja) * | 1987-03-31 | 1989-10-05 | アモコ・コーポレーション | ポリアミドーイミド組成物 |
US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
JPH02219828A (ja) * | 1988-12-15 | 1990-09-03 | Ethyl Corp | 芳香族ポリイミドの製造法 |
US5028581A (en) * | 1988-08-15 | 1991-07-02 | Mitsui Toatsu Chemicals, Incorporated | Odorless multi-valent metal modified products of salicyclic acid copolymers, production processes thereof, and use thereof as color-developing agents for pressure-sensitive copying paper sheets |
US5028641A (en) * | 1987-05-06 | 1991-07-02 | Mitsui Toatsu Chemicals, Incorporated | Thermosetting resin composition |
JPH04320449A (ja) * | 1991-04-18 | 1992-11-11 | Mitsui Toatsu Chem Inc | ポリカーボネート樹脂組成物 |
US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
JPH07278393A (ja) * | 1995-04-17 | 1995-10-24 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
JPH07292247A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | 新規ポリイミド樹脂組成物 |
JPH07292249A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂の組成物 |
JPH07292246A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
JPH0841338A (ja) * | 1995-03-20 | 1996-02-13 | Mitsui Toatsu Chem Inc | ポリイミド樹脂用組成物 |
JPH08231714A (ja) * | 1996-01-24 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性の良好なポリイミド |
JPH08231715A (ja) * | 1996-03-08 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性良好なポリイミド |
JP2007505973A (ja) * | 2003-09-19 | 2007-03-15 | ブルーワー サイエンス アイ エヌ シー. | 高屈折率、薄膜材料として用いるポリイミド |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49120993A (enrdf_load_stackoverflow) * | 1973-03-23 | 1974-11-19 | ||
JPS5069196A (enrdf_load_stackoverflow) * | 1973-06-22 | 1975-06-09 | ||
JPS5176977A (ja) * | 1974-12-27 | 1976-07-03 | Hitachi Ltd | Handotaisoshinohyomenanteikashorihoho |
JPS5230319A (en) * | 1975-09-04 | 1977-03-08 | Nippon Hoso Kyokai <Nhk> | Compensation circuit of digital type gamma |
JPS56826A (en) * | 1979-05-09 | 1981-01-07 | Gen Electric | Manufacture of polyetheramide acid and imide |
JPS57180633A (en) * | 1981-04-30 | 1982-11-06 | Hitachi Ltd | Curable polyimide resin composition |
-
1983
- 1983-03-15 JP JP4398283A patent/JPS59168030A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49120993A (enrdf_load_stackoverflow) * | 1973-03-23 | 1974-11-19 | ||
JPS5069196A (enrdf_load_stackoverflow) * | 1973-06-22 | 1975-06-09 | ||
JPS5176977A (ja) * | 1974-12-27 | 1976-07-03 | Hitachi Ltd | Handotaisoshinohyomenanteikashorihoho |
JPS5230319A (en) * | 1975-09-04 | 1977-03-08 | Nippon Hoso Kyokai <Nhk> | Compensation circuit of digital type gamma |
JPS56826A (en) * | 1979-05-09 | 1981-01-07 | Gen Electric | Manufacture of polyetheramide acid and imide |
JPS57180633A (en) * | 1981-04-30 | 1982-11-06 | Hitachi Ltd | Curable polyimide resin composition |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60156729A (ja) * | 1983-12-30 | 1985-08-16 | ゼネラル エレクトリツク カンパニイ | ポリエーテルイミド‐ポリエーテルスルホンイミドコポリマー |
JPS6134025A (ja) * | 1984-06-29 | 1986-02-18 | アモコ、コ−ポレ−ション | 新規なポリエ−テルイミド |
JPS6183230A (ja) * | 1984-09-04 | 1986-04-26 | ゼネラル・エレクトリツク・カンパニイ | 結晶性ポリエ−テルイミドおよびそのポリアミド酸前駆体 |
US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
WO1987001378A1 (en) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides and heat-resistant adhesives comprising the same |
US5205894A (en) * | 1985-08-27 | 1993-04-27 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide |
US5087689A (en) * | 1985-08-27 | 1992-02-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines |
US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
EP0729995A1 (en) * | 1985-08-27 | 1996-09-04 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and high-temperature adhesive of polyimide |
US4847349A (en) * | 1985-08-27 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
JPS62185715A (ja) * | 1986-02-13 | 1987-08-14 | Mitsui Toatsu Chem Inc | 無色ポリイミドフイルム |
US4847311A (en) * | 1986-04-09 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide resin composition |
WO1987006251A1 (en) * | 1986-04-09 | 1987-10-22 | Mitsui Toatsu Chemicals, Incorporated | Polyimide resin composition |
JPS638455A (ja) * | 1986-06-30 | 1988-01-14 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
JPS63128025A (ja) * | 1986-11-19 | 1988-05-31 | Mitsui Toatsu Chem Inc | ポリイミド |
JPH01502914A (ja) * | 1987-03-31 | 1989-10-05 | アモコ・コーポレーション | ポリアミドーイミド組成物 |
US5028641A (en) * | 1987-05-06 | 1991-07-02 | Mitsui Toatsu Chemicals, Incorporated | Thermosetting resin composition |
US5028581A (en) * | 1988-08-15 | 1991-07-02 | Mitsui Toatsu Chemicals, Incorporated | Odorless multi-valent metal modified products of salicyclic acid copolymers, production processes thereof, and use thereof as color-developing agents for pressure-sensitive copying paper sheets |
JPH02219828A (ja) * | 1988-12-15 | 1990-09-03 | Ethyl Corp | 芳香族ポリイミドの製造法 |
JPH04320449A (ja) * | 1991-04-18 | 1992-11-11 | Mitsui Toatsu Chem Inc | ポリカーボネート樹脂組成物 |
JPH07292247A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | 新規ポリイミド樹脂組成物 |
JPH07292249A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂の組成物 |
JPH07292246A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
JPH0841338A (ja) * | 1995-03-20 | 1996-02-13 | Mitsui Toatsu Chem Inc | ポリイミド樹脂用組成物 |
JPH07278393A (ja) * | 1995-04-17 | 1995-10-24 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
JPH08231714A (ja) * | 1996-01-24 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性の良好なポリイミド |
JPH08231715A (ja) * | 1996-03-08 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性良好なポリイミド |
JP2007505973A (ja) * | 2003-09-19 | 2007-03-15 | ブルーワー サイエンス アイ エヌ シー. | 高屈折率、薄膜材料として用いるポリイミド |
Also Published As
Publication number | Publication date |
---|---|
JPH0433809B2 (enrdf_load_stackoverflow) | 1992-06-04 |
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