JPS59137341A - 結晶化ガラス体 - Google Patents
結晶化ガラス体Info
- Publication number
- JPS59137341A JPS59137341A JP58007686A JP768683A JPS59137341A JP S59137341 A JPS59137341 A JP S59137341A JP 58007686 A JP58007686 A JP 58007686A JP 768683 A JP768683 A JP 768683A JP S59137341 A JPS59137341 A JP S59137341A
- Authority
- JP
- Japan
- Prior art keywords
- crystallized glass
- glass
- crystallized
- amount
- glass body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 47
- 238000002425 crystallisation Methods 0.000 abstract description 17
- 230000008025 crystallization Effects 0.000 abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 8
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 5
- 238000001354 calcination Methods 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 2
- 238000010304 firing Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000280 densification Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002667 nucleating agent Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052878 cordierite Inorganic materials 0.000 description 2
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000500 β-quartz Inorganic materials 0.000 description 2
- 101100313164 Caenorhabditis elegans sea-1 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58007686A JPS59137341A (ja) | 1983-01-20 | 1983-01-20 | 結晶化ガラス体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58007686A JPS59137341A (ja) | 1983-01-20 | 1983-01-20 | 結晶化ガラス体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59137341A true JPS59137341A (ja) | 1984-08-07 |
| JPS636499B2 JPS636499B2 (enrdf_load_stackoverflow) | 1988-02-10 |
Family
ID=11672665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58007686A Granted JPS59137341A (ja) | 1983-01-20 | 1983-01-20 | 結晶化ガラス体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59137341A (enrdf_load_stackoverflow) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61142759A (ja) * | 1984-12-14 | 1986-06-30 | Ngk Spark Plug Co Ltd | Ｉｃパツケ−ジ用基板 |
| JPS61149336U (enrdf_load_stackoverflow) * | 1985-03-06 | 1986-09-16 | ||
| JPS62171943A (ja) * | 1986-01-23 | 1987-07-28 | Matsushita Electric Works Ltd | ガラス粉末焼結体 |
| US5352482A (en) * | 1987-01-22 | 1994-10-04 | Ngk Spark Plug Co., Ltd. | Process for making a high heat-conductive, thick film multi-layered circuit board |
| US5635301A (en) * | 1988-02-10 | 1997-06-03 | Ngk Spark Plug Co., Ltd. | Multilayered glass substrate |
| EP0941973A3 (en) * | 1998-03-13 | 2000-09-27 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| JP2003040668A (ja) * | 2000-08-28 | 2003-02-13 | Kyocera Corp | 低温焼成セラミック焼結体およびその製造方法、並びに配線基板 |
| US7264894B2 (en) | 1998-03-13 | 2007-09-04 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| WO2011132603A1 (ja) * | 2010-04-20 | 2011-10-27 | 旭硝子株式会社 | 半導体デバイス貫通電極形成用のガラス基板 |
| JP2018062461A (ja) * | 2016-10-13 | 2018-04-19 | ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ | コーディエライトガラスセラミック、その製造および使用 |
| WO2024253132A1 (ja) * | 2023-06-07 | 2024-12-12 | 日本板硝子株式会社 | ガラス組成物、ガラス繊維、及びガラスフィラー |
-
1983
- 1983-01-20 JP JP58007686A patent/JPS59137341A/ja active Granted
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61142759A (ja) * | 1984-12-14 | 1986-06-30 | Ngk Spark Plug Co Ltd | Ｉｃパツケ−ジ用基板 |
| JPS61149336U (enrdf_load_stackoverflow) * | 1985-03-06 | 1986-09-16 | ||
| JPS62171943A (ja) * | 1986-01-23 | 1987-07-28 | Matsushita Electric Works Ltd | ガラス粉末焼結体 |
| US5352482A (en) * | 1987-01-22 | 1994-10-04 | Ngk Spark Plug Co., Ltd. | Process for making a high heat-conductive, thick film multi-layered circuit board |
| US5635301A (en) * | 1988-02-10 | 1997-06-03 | Ngk Spark Plug Co., Ltd. | Multilayered glass substrate |
| US6569792B2 (en) | 1998-03-13 | 2003-05-27 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| US7264894B2 (en) | 1998-03-13 | 2007-09-04 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| EP2011770A3 (en) * | 1998-03-13 | 2009-03-18 | Hoya Corporation | Crystallized glass for information recording medium, cystallized glass substrate, and information recording medium using the crystallized glass |
| EP0941973A3 (en) * | 1998-03-13 | 2000-09-27 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| US6774072B2 (en) | 1998-03-13 | 2004-08-10 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| US6960399B2 (en) | 1998-03-13 | 2005-11-01 | Hoya Corporation | Crystalized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| EP1577275A3 (en) * | 1998-03-13 | 2005-12-14 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass |
| US6294490B1 (en) * | 1998-03-13 | 2001-09-25 | Hoya Corporation | Crystallized glass for information recording medium, crystallized glass substrate, and information recording medium using the crystallized glass substrate |
| JP2003040668A (ja) * | 2000-08-28 | 2003-02-13 | Kyocera Corp | 低温焼成セラミック焼結体およびその製造方法、並びに配線基板 |
| WO2011132603A1 (ja) * | 2010-04-20 | 2011-10-27 | 旭硝子株式会社 | 半導体デバイス貫通電極形成用のガラス基板 |
| CN102844858A (zh) * | 2010-04-20 | 2012-12-26 | 旭硝子株式会社 | 用于形成半导体器件贯通电极的玻璃基板 |
| JP2018062461A (ja) * | 2016-10-13 | 2018-04-19 | ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ | コーディエライトガラスセラミック、その製造および使用 |
| WO2024253132A1 (ja) * | 2023-06-07 | 2024-12-12 | 日本板硝子株式会社 | ガラス組成物、ガラス繊維、及びガラスフィラー |
| JP7659709B1 (ja) * | 2023-06-07 | 2025-04-09 | 日本板硝子株式会社 | ガラス組成物、ガラス繊維、及びガラスフィラー |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636499B2 (enrdf_load_stackoverflow) | 1988-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4540671A (en) | Glass-ceramic product | |
| CN101215157B (zh) | 掺氟硅铝玻璃基低温共烧陶瓷材料及其制备方法 | |
| JPS59137341A (ja) | 結晶化ガラス体 | |
| JPH04275975A (ja) | ガラス−セラミックス複合体 | |
| JP2624149B2 (ja) | 低温焼成ガラスセラミック基板用組成物 | |
| US5112777A (en) | Glass-ceramic-bonded ceramic composites | |
| JP3096136B2 (ja) | 低温焼成基板用ガラス組成物およびそれから得られる基板 | |
| JPS6331420B2 (enrdf_load_stackoverflow) | ||
| JPS63107838A (ja) | ガラスセラミツク焼結体 | |
| US3627547A (en) | High alumina bodies comprising anorthite gehlenite and spinel | |
| JPH0269335A (ja) | アルカリ土類金属アルミノホウ酸塩ガラスセラミックおよびその製造方法 | |
| JPS62278145A (ja) | ガラスセラミツク焼結体 | |
| JPS6210940B2 (enrdf_load_stackoverflow) | ||
| KR100479688B1 (ko) | 유전체 세라믹 조성물 및 이를 이용한 저온소성 유전체 세라믹의 제조방법 | |
| JPH01141837A (ja) | 回路基板用誘電体材料 | |
| JPS6350345A (ja) | ガラスセラミツク焼結体 | |
| GB2172282A (en) | Toughened glass-ceramics | |
| JPH01132194A (ja) | 配線基板 | |
| JPS6379739A (ja) | ガラスセラミツク焼結体 | |
| JPH05186243A (ja) | 結晶化ガラス−ガラス複合体及びその製造方法 | |
| RU2753522C1 (ru) | Низкотемпературный стеклокерамический материал для электронной техники | |
| JPH05500584A (ja) | 改良された複合誘電体 | |
| JPH07242439A (ja) | 低温焼成ガラスセラミック基板およびその製造方法 | |
| JP3226056B2 (ja) | 低誘電率高強度ガラスセラミックス組成物 | |
| JPS6227353A (ja) | ガラスセラミツク複合材 |