JPS61149336U - - Google Patents

Info

Publication number
JPS61149336U
JPS61149336U JP3261485U JP3261485U JPS61149336U JP S61149336 U JPS61149336 U JP S61149336U JP 3261485 U JP3261485 U JP 3261485U JP 3261485 U JP3261485 U JP 3261485U JP S61149336 U JPS61149336 U JP S61149336U
Authority
JP
Japan
Prior art keywords
semiconductor element
substrate
wiring pattern
expansion coefficient
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3261485U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3261485U priority Critical patent/JPS61149336U/ja
Publication of JPS61149336U publication Critical patent/JPS61149336U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP3261485U 1985-03-06 1985-03-06 Pending JPS61149336U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3261485U JPS61149336U (enrdf_load_stackoverflow) 1985-03-06 1985-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3261485U JPS61149336U (enrdf_load_stackoverflow) 1985-03-06 1985-03-06

Publications (1)

Publication Number Publication Date
JPS61149336U true JPS61149336U (enrdf_load_stackoverflow) 1986-09-16

Family

ID=30534291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3261485U Pending JPS61149336U (enrdf_load_stackoverflow) 1985-03-06 1985-03-06

Country Status (1)

Country Link
JP (1) JPS61149336U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649550A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor device
JPS5816596A (ja) * 1981-07-23 1983-01-31 日本電気株式会社 高密度多層配線基板
JPS59137341A (ja) * 1983-01-20 1984-08-07 Ngk Spark Plug Co Ltd 結晶化ガラス体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649550A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor device
JPS5816596A (ja) * 1981-07-23 1983-01-31 日本電気株式会社 高密度多層配線基板
JPS59137341A (ja) * 1983-01-20 1984-08-07 Ngk Spark Plug Co Ltd 結晶化ガラス体

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