JPS59110458A - はんだ槽 - Google Patents
はんだ槽Info
- Publication number
- JPS59110458A JPS59110458A JP22018982A JP22018982A JPS59110458A JP S59110458 A JPS59110458 A JP S59110458A JP 22018982 A JP22018982 A JP 22018982A JP 22018982 A JP22018982 A JP 22018982A JP S59110458 A JPS59110458 A JP S59110458A
- Authority
- JP
- Japan
- Prior art keywords
- jet
- arrow
- melt
- solder
- waves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 48
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims 2
- 239000000155 melt Substances 0.000 abstract 7
- 239000006260 foam Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22018982A JPS59110458A (ja) | 1982-12-17 | 1982-12-17 | はんだ槽 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22018982A JPS59110458A (ja) | 1982-12-17 | 1982-12-17 | はんだ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59110458A true JPS59110458A (ja) | 1984-06-26 |
JPS6235857B2 JPS6235857B2 (enrdf_load_stackoverflow) | 1987-08-04 |
Family
ID=16747271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22018982A Granted JPS59110458A (ja) | 1982-12-17 | 1982-12-17 | はんだ槽 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59110458A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60115669U (ja) * | 1984-01-13 | 1985-08-05 | 株式会社日立製作所 | はんだ付装置 |
JPS6187658U (enrdf_load_stackoverflow) * | 1984-11-15 | 1986-06-07 | ||
JP2007321791A (ja) * | 2006-05-30 | 2007-12-13 | Carrosser Co Ltd | デファレンシャル装置 |
CN101875143A (zh) * | 2010-03-14 | 2010-11-03 | 苏州明富自动化设备有限公司 | 一种波峰焊机叶轮装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5828892A (ja) * | 1981-08-12 | 1983-02-19 | 千住金属工業株式会社 | チップ部品搭載プリント基板のはんだ付け装置 |
JPS5858795A (ja) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | プリント基板のはんだ付け方法 |
-
1982
- 1982-12-17 JP JP22018982A patent/JPS59110458A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5828892A (ja) * | 1981-08-12 | 1983-02-19 | 千住金属工業株式会社 | チップ部品搭載プリント基板のはんだ付け装置 |
JPS5858795A (ja) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | プリント基板のはんだ付け方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60115669U (ja) * | 1984-01-13 | 1985-08-05 | 株式会社日立製作所 | はんだ付装置 |
JPS6187658U (enrdf_load_stackoverflow) * | 1984-11-15 | 1986-06-07 | ||
JP2007321791A (ja) * | 2006-05-30 | 2007-12-13 | Carrosser Co Ltd | デファレンシャル装置 |
CN101875143A (zh) * | 2010-03-14 | 2010-11-03 | 苏州明富自动化设备有限公司 | 一种波峰焊机叶轮装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6235857B2 (enrdf_load_stackoverflow) | 1987-08-04 |
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