JPS5910297A - 基板接続装置 - Google Patents
基板接続装置Info
- Publication number
- JPS5910297A JPS5910297A JP12004882A JP12004882A JPS5910297A JP S5910297 A JPS5910297 A JP S5910297A JP 12004882 A JP12004882 A JP 12004882A JP 12004882 A JP12004882 A JP 12004882A JP S5910297 A JPS5910297 A JP S5910297A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- hole
- electrodes
- mentioned
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12004882A JPS5910297A (ja) | 1982-07-09 | 1982-07-09 | 基板接続装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12004882A JPS5910297A (ja) | 1982-07-09 | 1982-07-09 | 基板接続装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5910297A true JPS5910297A (ja) | 1984-01-19 |
| JPS6330795B2 JPS6330795B2 (enrdf_load_stackoverflow) | 1988-06-21 |
Family
ID=14776599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12004882A Granted JPS5910297A (ja) | 1982-07-09 | 1982-07-09 | 基板接続装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910297A (enrdf_load_stackoverflow) |
-
1982
- 1982-07-09 JP JP12004882A patent/JPS5910297A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6330795B2 (enrdf_load_stackoverflow) | 1988-06-21 |
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