JPS5910297A - Substrate connecting device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention [d] relates to a board connecting device in which an electrode portion of two boards made of different materials is inserted into a through hole provided in one of the boards and the other is connected by soldering. be.

Structure of the conventional example and its problems As shown in FIG. 1, an electrode 2 made of silver and palladium is provided at the end of a ceramic substrate 1, and as shown in FIG. It is inserted into the through hole and soldered on the back side. This soldering is done by a half-expose method. In this case, there is a drawback that cracks occur in the soldered portion due to rapid thermal changes caused by the deep solder. This crack occurs because the coefficients of thermal expansion of the substrates 1 and 3 are different.

OBJECTS OF THE INVENTION The present invention aims to provide a board connecting device that does not cause cracks in the soldered portion even when boards having different coefficients of thermal expansion are connected.

Structure of the Invention The present invention provides electrodes at the ends of both sides of a first substrate, and forms a U-shaped insulating plate having heat resistance and elasticity so as to cover the portion where the electrodes are provided. A through-hole electrode is formed in a portion of the plate facing the above-mentioned electrode, and a metal having a higher melting temperature than the solder is provided on the portion of the through-hole electrode facing the above-mentioned electrode or on the above-mentioned electrode, and this metal allows the connection between the above-mentioned electrode and the above-mentioned electrode. a through-hole electrode, and insert the part of the first board to which the insulating plate is attached into the through hole of a second printed board made of a material different from that of the first board; The steel foil on the back of the printed circuit board and the above-mentioned through-hole electrode are soldered together, and the insulating plate acts as a cushioning material so that no cracks will occur in the soldered part even if there is a sudden change in heat. be.

Description of examples Embodiments of the present invention will be described below with reference to the drawings.

As shown in FIGS. 3 to 6, electrodes 62L made of silver-palladium or the like are provided at the ends of both sides of the ceramic substrate 4.

5b is provided. A heat-resistant and elastic insulating plate 6 made of polyimide or the like is formed in a U-shape to cover the electrodes 5a and 5b, and the electrode 5a of this insulating plate 6 is formed.

A through-hole electrode 7a is provided in a portion opposite to 5b.

7b is provided. A metal having a higher melting temperature than solder, such as tin, is provided at the portions of the through-hole electrodes 7a and 7b facing the electrodes 61L and 6b, and this is used to connect the electrodes 5a and 7b.
, 5b has a through-hole electrode &.

7b is thermocompressed. The structure thus constructed is inserted into a through hole 9 provided in a printed circuit board 8 such as a paper/phenol laminate, and connected to a copper foil 10 on the back surface of the printed circuit board 8 by solder 11.

With this configuration, the insulating material 6 serves as a cushioning material, so even if dip soldering is performed and sudden thermal changes occur, cracks will not occur in the soldered portion.

Still through-hole electrode 7a.

7b is electrode 5 made of tin etc. Since the electrodes 62L and 5b are connected to the electrodes L and 6b, the electrodes 62L and 5b and the electrodes 7a and 7b do not come off during soldering. Since the insulating plate 6 is made of heat-resistant material such as polyimide, the insulating plate 6 is
is indestructible.

Effects of the Invention As described above, according to the present invention, the first substrate is inserted into the through hole of the second substrate through the insulating plate serving as a cushioning material and soldered. No cracks will occur in the attached parts.

[Brief explanation of drawings]

FIG. 1 is a plan view of a board of a conventional board connecting device;
2 is a sectional side view of the same device, FIG. 3 1d is a sectional side view of a board of a board connecting device according to an embodiment of the present invention, FIG. 4 is a sectional side view of the same device, and FIG. 5 is a sectional side view of the same device. It is a top view of the board|substrate used. 4...First substrate, 5a, 5b...Electrode, 7a. 7b...Through-hole electrode, 6...River/insulation plate, 8...Second substrate, 9...Through hole, 1
0...Copper foil, 1°...Solder.

Claims (1)

[Claims] Electrodes are provided at the ends of both sides of the first substrate, and an insulating plate having heat resistance and elasticity is formed in a U-shape so as to cover the portion where the electrodes are provided, and the insulating plate faces the electrodes. A through-hole electrode is formed in the part of the through-hole electrode that faces the above-mentioned electrode, and a metal having a higher melting temperature than solder is provided on the part of the through-hole electrode that faces the above-mentioned electrode or on the above-mentioned electrode, and this metal fixes the above-mentioned electrode and the above-mentioned through-hole electrode. and inserting the part of the first board to which the insulating plate is attached into the through hole of a second printed board made of a material different from that of the first board, and A board connection device in which the copper foil and the above-mentioned through-hole electrode are soldered.