JPH0595177A - Electronic component and method for mounting it - Google Patents

Abstract

PURPOSE:To reduce area and height for mounting an electronic component and provide a method for mounting the electronic component which has excellent vibration resistance. CONSTITUTION:A printed board 1 is provided with a through hole 3, an electronic component 4 provided with electrodes 5 and 6 at the top and bottom is inserted into the through hole 3 and a part overhanging the side of the electrode 5 is connected by solder 7 and 7 to an electrode 2 provided on the printed board. The electrode 6 of the electronic component 4 is connected to the electrode 2' of the printed board 4 by solder 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method for electronic parts and the electronic parts.

[0002]

2. Description of the Related Art Electronic components for printed circuit boards are required to have a small mounting area and a small mounting height. Conventional electronic components have several components mounted in the same package. Or, these requirements have been dealt with by making parts into chips. However, all conventional electronic components have a problem that the components are located outside the printed circuit board, and thus there is a limit to reducing the mounting area and height. In addition, the electronic components soldered to the printed circuit board are vulnerable to vibration, and there is a risk of vibration during rocket launch or contact failure when used as an electric component of a vibrating device.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to obtain a method for mounting a vibration resistant structure type electronic component which is useful for downsizing electronic equipment.

[0004]

According to the present invention, contrary to the conventional general idea of mounting an electronic component on the outside of a printed circuit board, a through hole is provided in the printed circuit board, and the through hole is provided in the through hole. The above problem is solved by a completely new idea of mounting electronic parts.

Since the electronic component is mounted in the through hole of the printed circuit board, even if it is subjected to continuous vibration, the lead wire is repeatedly subjected to bending stress to cause peeling of solder, resulting in poor conduction. There is no such thing. Further, since the electrodes provided on the electronic component may have the minimum length or height required for connection by soldering or the like, the mounting height including the printed circuit board can be made lower than before.

[0005]

FIG. 1 shows a first embodiment, which is an embodiment in which an electronic component 4 having two electrodes such as a resistor, a capacitor and a crystal oscillator is mounted. This is when they are on different sides. In the figure, 1 is a printed circuit board, 2 and 2'are electrodes attached to the upper and lower surfaces of the circuit board, respectively, 3 is a through hole of the printed circuit board,
Here, the electronic component 4 according to the present invention is mounted. That is, the electronic component 4 is inserted into the through hole 3 of the printed circuit board,
The electrodes 5 of the electronic component 4 and the electrodes of the printed circuit board 2, the electrodes 6 of the electronic component and the electrodes 2 ′ of the printed circuit board are connected using solders 7 and 8, respectively, and used. Here, the electrode 5 is
A part of it has a shape projecting perpendicularly to the insertion direction, and has a structure that does not penetrate through the through hole 3 of the printed circuit board when the electronic component is inserted. FIG. 2 shows a second embodiment of the present invention. In this case, the electrode 12 of the electronic component 11 is used.
And 13 are on the same plane. To mount the electronic component 11 on the printed circuit board 1, the electronic component 11 is inserted into the through hole 10 of the printed circuit board 1, and the electrode 12 of the electronic component 11 and the electrode 9 of the printed circuit board 1 are connected to each other.
The electrode 13 of No. 1 and the electrode 9'of the printed circuit board 1 are soldered 1
Connect using 4 and 15 and use. Here, the electrode 12
And 13 are insulated from each other by an insulator 16, have a shape projecting perpendicularly to the insertion direction, and have a structure that does not penetrate through the substrate through hole at the time of component insertion. FIG. 3 shows a third embodiment in which an electronic component 19 having three electrodes such as a transistor is mounted. Two of the electrodes 20, 21, 25, that is, 20 and 21 in the figure are the same. In this case, the remaining one electrode 25 is exposed on the opposite surface. The electrodes are connected using the solders 22, 23 and 26 in the same manner as in the embodiment shown in FIGS. 1 and 2. In this case as well, the electrodes 20 and 21 are insulated from each other by the insulator 24, each has a shape protruding perpendicularly to the insertion direction, and has a structure that does not penetrate the substrate through hole at the time of component insertion.

[0006]

According to the present invention, an electronic component having a mounting area as small as a through hole of a printed circuit board and a mounting height as small as a minimum required for soldering can be realized. In addition, since the electronic components are stored in the through-holes of the printed circuit board, they are resistant to vibration, and are therefore extremely useful as a hardware technology for devices such as vibrations and rockets that have a serious impact on poor connection of one electronic component. It is a useful invention.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a sectional view of a second embodiment of the present invention.

FIG. 2 is a sectional view of a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2, 2'Electrode attached to printed circuit board 3 Through hole 4 Electronic component 5,6 Electrode of electronic component 7,8 Solder

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[Procedure amendment]

[Submission date] September 28, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Brief explanation of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a sectional view of a second embodiment of the present invention.

FIG. 3 is a sectional view of a third embodiment of the present invention.

[Explanation of reference numerals] 1 printed circuit board 2, 2'electrode attached to printed circuit board 3 through hole 4 electronic component 5,6 electrode of electronic component 7,8 solder

Claims (3)

[Claims] 1. A printed circuit board is provided with a through hole for storing an electronic component, the electronic component is inserted into the through hole, and an electrode of the electronic component is electrically connected to an electrode of the printed circuit board by soldering or the like. Electronic component mounting method. 2. An electronic component for mounting a printed circuit board, wherein the main body has a shape that can be inserted into a through hole of the printed circuit board, and electrodes provided on both sides or one side of the printed circuit board are provided. 3. The electronic component for mounting on a printed circuit board according to claim 2, wherein a part of the electrode is projected perpendicularly to a direction of insertion into the printed circuit board.