JPS5877238A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5877238A
JPS5877238A JP56174644A JP17464481A JPS5877238A JP S5877238 A JPS5877238 A JP S5877238A JP 56174644 A JP56174644 A JP 56174644A JP 17464481 A JP17464481 A JP 17464481A JP S5877238 A JPS5877238 A JP S5877238A
Authority
JP
Japan
Prior art keywords
thickness
wire
plating film
bonding
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56174644A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249731B2 (cg-RX-API-DMAC10.html
Inventor
Masahiro Koizumi
小泉　正博
Hitoshi Onuki
仁 大貫
Tateo Tamamura
玉村　建雄
Tomio Iizuka
飯塚　富雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56174644A priority Critical patent/JPS5877238A/ja
Publication of JPS5877238A publication Critical patent/JPS5877238A/ja
Publication of JPS6249731B2 publication Critical patent/JPS6249731B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP56174644A 1981-11-02 1981-11-02 半導体装置 Granted JPS5877238A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56174644A JPS5877238A (ja) 1981-11-02 1981-11-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56174644A JPS5877238A (ja) 1981-11-02 1981-11-02 半導体装置

Publications (2)

Publication Number Publication Date
JPS5877238A true JPS5877238A (ja) 1983-05-10
JPS6249731B2 JPS6249731B2 (cg-RX-API-DMAC10.html) 1987-10-21

Family

ID=15982192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56174644A Granted JPS5877238A (ja) 1981-11-02 1981-11-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS5877238A (cg-RX-API-DMAC10.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111041A (en) * 1980-12-26 1982-07-10 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111041A (en) * 1980-12-26 1982-07-10 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6249731B2 (cg-RX-API-DMAC10.html) 1987-10-21

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