JPS6257257B2 - - Google Patents

Info

Publication number
JPS6257257B2
JPS6257257B2 JP56134026A JP13402681A JPS6257257B2 JP S6257257 B2 JPS6257257 B2 JP S6257257B2 JP 56134026 A JP56134026 A JP 56134026A JP 13402681 A JP13402681 A JP 13402681A JP S6257257 B2 JPS6257257 B2 JP S6257257B2
Authority
JP
Japan
Prior art keywords
roughness
lead frame
film
plated
plated film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56134026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5835950A (ja
Inventor
Masahiro Koizumi
Hitoshi Oonuki
Tateo Tamamura
Tomio Iizuka
Susumu Okikawa
Hiroshi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56134026A priority Critical patent/JPS5835950A/ja
Publication of JPS5835950A publication Critical patent/JPS5835950A/ja
Publication of JPS6257257B2 publication Critical patent/JPS6257257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/041—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56134026A 1981-08-28 1981-08-28 半導体装置 Granted JPS5835950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56134026A JPS5835950A (ja) 1981-08-28 1981-08-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56134026A JPS5835950A (ja) 1981-08-28 1981-08-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS5835950A JPS5835950A (ja) 1983-03-02
JPS6257257B2 true JPS6257257B2 (cg-RX-API-DMAC10.html) 1987-11-30

Family

ID=15118634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56134026A Granted JPS5835950A (ja) 1981-08-28 1981-08-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS5835950A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6412563A (en) * 1987-07-07 1989-01-17 Sumitomo Metal Mining Co Nickel plating of lead frame
US5277356A (en) * 1992-06-17 1994-01-11 Rohm Co., Ltd. Wire bonding method
JP5603600B2 (ja) * 2010-01-13 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ

Also Published As

Publication number Publication date
JPS5835950A (ja) 1983-03-02

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