JPS5835950A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5835950A
JPS5835950A JP56134026A JP13402681A JPS5835950A JP S5835950 A JPS5835950 A JP S5835950A JP 56134026 A JP56134026 A JP 56134026A JP 13402681 A JP13402681 A JP 13402681A JP S5835950 A JPS5835950 A JP S5835950A
Authority
JP
Japan
Prior art keywords
roughness
film
lead frame
wire
plated film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56134026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257257B2 (cg-RX-API-DMAC10.html
Inventor
Masahiro Koizumi
小泉　正博
Hitoshi Onuki
仁 大貫
Tateo Tamamura
玉村　建雄
Tomio Iizuka
飯塚　富雄
Susumu Okikawa
進 沖川
Hiroshi Kato
弘 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56134026A priority Critical patent/JPS5835950A/ja
Publication of JPS5835950A publication Critical patent/JPS5835950A/ja
Publication of JPS6257257B2 publication Critical patent/JPS6257257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/041—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56134026A 1981-08-28 1981-08-28 半導体装置 Granted JPS5835950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56134026A JPS5835950A (ja) 1981-08-28 1981-08-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56134026A JPS5835950A (ja) 1981-08-28 1981-08-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS5835950A true JPS5835950A (ja) 1983-03-02
JPS6257257B2 JPS6257257B2 (cg-RX-API-DMAC10.html) 1987-11-30

Family

ID=15118634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56134026A Granted JPS5835950A (ja) 1981-08-28 1981-08-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS5835950A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6412563A (en) * 1987-07-07 1989-01-17 Sumitomo Metal Mining Co Nickel plating of lead frame
US5277356A (en) * 1992-06-17 1994-01-11 Rohm Co., Ltd. Wire bonding method
JP2011146477A (ja) * 2010-01-13 2011-07-28 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、並びに半導体パッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6412563A (en) * 1987-07-07 1989-01-17 Sumitomo Metal Mining Co Nickel plating of lead frame
US5277356A (en) * 1992-06-17 1994-01-11 Rohm Co., Ltd. Wire bonding method
JP2011146477A (ja) * 2010-01-13 2011-07-28 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、並びに半導体パッケージ
US8673744B2 (en) 2010-01-13 2014-03-18 Shinko Electric Industries Co., Ltd. Wiring substrate, manufacturing method thereof, and semiconductor package

Also Published As

Publication number Publication date
JPS6257257B2 (cg-RX-API-DMAC10.html) 1987-11-30

Similar Documents

Publication Publication Date Title
JPH02187042A (ja) 半導体装置の製造方法
CN100430176C (zh) 使第一装置与第二装置电连接的方法及电连接件
US5229646A (en) Semiconductor device with a copper wires ball bonded to aluminum electrodes
US4558346A (en) Highly reliable hermetically sealed package for a semiconductor device
JPS5835950A (ja) 半導体装置
US3383757A (en) Thermo-compression bonding of metals to semiconductor, metallic, or nonmetallic surfaces
US11270971B2 (en) Semiconductor device and method of manufacturing the same
JPH02114545A (ja) ワイヤボンディング接続方法
JP7383057B2 (ja) 密着性評価試験用の試験片の製造方法および密着性評価方法
JPH0345542B2 (cg-RX-API-DMAC10.html)
JP3193100B2 (ja) 半導体装置
TWI290761B (en) Semiconductor device and a method of manufacturing the same
JPS5948947A (ja) 半導体装置
KR20030081178A (ko) 도선에 연결된 패드전극을 갖는 반도체장치
JPS6249731B2 (cg-RX-API-DMAC10.html)
JPH0412620B2 (cg-RX-API-DMAC10.html)
JP2999639B2 (ja) 樹脂封止型半導体装置およびその製造方法
JP2000332150A (ja) 半導体装置の製造方法
JPS5835949A (ja) 半導体装置
JPH03208355A (ja) 半導体装置及びその製造方法
JP2533675B2 (ja) 半導体装置及びその製造方法
JPH0637221A (ja) 樹脂封止型半導体装置
JPH053277A (ja) 半導体装置
JP2929885B2 (ja) 複合リードフレーム，及びその製造方法
JPS611031A (ja) Ａｌボ−ルボンデイング方法