JPS5867473A - サ−マルヘツド - Google Patents

サ−マルヘツド

Info

Publication number
JPS5867473A
JPS5867473A JP56165718A JP16571881A JPS5867473A JP S5867473 A JPS5867473 A JP S5867473A JP 56165718 A JP56165718 A JP 56165718A JP 16571881 A JP16571881 A JP 16571881A JP S5867473 A JPS5867473 A JP S5867473A
Authority
JP
Japan
Prior art keywords
adhesive
ceramic substrate
bonded
mounting plate
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56165718A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0115385B2 (enExample
Inventor
Toyokazu Inaba
稲葉　豊和
Takemi Maruyama
丸山　威美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP56165718A priority Critical patent/JPS5867473A/ja
Publication of JPS5867473A publication Critical patent/JPS5867473A/ja
Publication of JPH0115385B2 publication Critical patent/JPH0115385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP56165718A 1981-10-19 1981-10-19 サ−マルヘツド Granted JPS5867473A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56165718A JPS5867473A (ja) 1981-10-19 1981-10-19 サ−マルヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56165718A JPS5867473A (ja) 1981-10-19 1981-10-19 サ−マルヘツド

Publications (2)

Publication Number Publication Date
JPS5867473A true JPS5867473A (ja) 1983-04-22
JPH0115385B2 JPH0115385B2 (enExample) 1989-03-16

Family

ID=15817740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56165718A Granted JPS5867473A (ja) 1981-10-19 1981-10-19 サ−マルヘツド

Country Status (1)

Country Link
JP (1) JPS5867473A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176555U (ja) * 1983-05-13 1984-11-26 ティーディーケイ株式会社 サ−マルヘツド

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125775A (en) * 1976-04-14 1977-10-21 Fujitsu Ten Ltd Htbrid integrated circuit unit
JPS52146644A (en) * 1976-05-31 1977-12-06 Matsushita Electric Ind Co Ltd Thermal head
JPS5329564A (en) * 1976-08-31 1978-03-18 Fujitsu Ltd Method of fixing ceramic substrate
JPS54141948U (enExample) * 1978-03-24 1979-10-02

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125775A (en) * 1976-04-14 1977-10-21 Fujitsu Ten Ltd Htbrid integrated circuit unit
JPS52146644A (en) * 1976-05-31 1977-12-06 Matsushita Electric Ind Co Ltd Thermal head
JPS5329564A (en) * 1976-08-31 1978-03-18 Fujitsu Ltd Method of fixing ceramic substrate
JPS54141948U (enExample) * 1978-03-24 1979-10-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176555U (ja) * 1983-05-13 1984-11-26 ティーディーケイ株式会社 サ−マルヘツド

Also Published As

Publication number Publication date
JPH0115385B2 (enExample) 1989-03-16

Similar Documents

Publication Publication Date Title
JPH05217121A (ja) 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
GB2055508A (en) Molded resin type semiconductor device container
JPH0868699A (ja) サーミスタセンサ
JPS6019555A (ja) サ−マルヘツド
JPS5863473A (ja) サ−マルヘツド
JPS5867473A (ja) サ−マルヘツド
JPS5938075A (ja) サ−マルヘツド
JP2998484B2 (ja) 半導体装置用リードフレーム
JPH1148513A (ja) サーマルプリントヘッド
JPS59124859A (ja) マルチスタイラスヘツド
JPS5864787A (ja) 布製採暖具の発熱体ユニツト
JPH0433868A (ja) サーマルヘッドの製造方法
JPH0737147B2 (ja) サーマルヘッド及びその製造方法
JPS60250583A (ja) 発熱体
JPS60154590A (ja) フレキシブル電気回路基板
JPS59171669A (ja) サ−マルヘツド
JP2000043305A (ja) サーマルヘッドおよびその製造方法
JPH02175260A (ja) サーマルヘツド
JP2581164B2 (ja) 印字ヘッド
JPS59228384A (ja) 面状ヒ−タユニツト
JPS60201967A (ja) サ−マルヘツド
JPS62128469A (ja) ヒ−タユニツトの製造方法
JP2001301216A (ja) サーマルプリントヘッド
JPS5933161A (ja) サ−マルヘツド
JPS58173666A (ja) 多針電極