JPS5860553A - 縦型自動プラズマ処理装置 - Google Patents

縦型自動プラズマ処理装置

Info

Publication number
JPS5860553A
JPS5860553A JP56159282A JP15928281A JPS5860553A JP S5860553 A JPS5860553 A JP S5860553A JP 56159282 A JP56159282 A JP 56159282A JP 15928281 A JP15928281 A JP 15928281A JP S5860553 A JPS5860553 A JP S5860553A
Authority
JP
Japan
Prior art keywords
cassette
wafers
holder
chamber
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56159282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0557736B2 (cg-RX-API-DMAC10.html
Inventor
Akira Uehara
植原　晃
Isamu Hijikata
土方　勇
Hisashi Nakane
中根　久
Muneo Nakayama
中山　宗雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO DENSHI KAGAKU KABUSHIKI
Tokyo Denshi Kagaku KK
Original Assignee
TOKYO DENSHI KAGAKU KABUSHIKI
Tokyo Denshi Kagaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO DENSHI KAGAKU KABUSHIKI, Tokyo Denshi Kagaku KK filed Critical TOKYO DENSHI KAGAKU KABUSHIKI
Priority to JP56159282A priority Critical patent/JPS5860553A/ja
Priority to US06/424,287 priority patent/US4550242A/en
Publication of JPS5860553A publication Critical patent/JPS5860553A/ja
Publication of JPH0557736B2 publication Critical patent/JPH0557736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/3412—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP56159282A 1981-10-05 1981-10-05 縦型自動プラズマ処理装置 Granted JPS5860553A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56159282A JPS5860553A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置
US06/424,287 US4550242A (en) 1981-10-05 1982-09-27 Automatic plasma processing device and heat treatment device for batch treatment of workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56159282A JPS5860553A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPS5860553A true JPS5860553A (ja) 1983-04-11
JPH0557736B2 JPH0557736B2 (cg-RX-API-DMAC10.html) 1993-08-24

Family

ID=15690383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56159282A Granted JPS5860553A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS5860553A (cg-RX-API-DMAC10.html)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258459A (ja) * 1984-06-04 1985-12-20 Deisuko Saiyaa Japan:Kk 縦型熱処理装置
JPS61291335A (ja) * 1985-06-19 1986-12-22 Denkoo:Kk 半導体移換え装置
JPS6265843A (ja) * 1985-09-12 1987-03-25 Denkoo:Kk 半導体ウエハ取出し装置
JPS62136439A (ja) * 1985-12-04 1987-06-19 Denkoo:Kk 板状体取出し装置
JPS62204543A (ja) * 1986-03-04 1987-09-09 Koyo Rindobaagu Kk ウエハ移載装置
JPS63102236U (cg-RX-API-DMAC10.html) * 1986-12-23 1988-07-02
JPH02139948A (ja) * 1988-11-18 1990-05-29 Tel Sagami Ltd 基板の移載方法
JPH03212951A (ja) * 1990-01-18 1991-09-18 Tokyo Electron Sagami Ltd 基板移載装置及び処理装置
US5822498A (en) * 1995-06-22 1998-10-13 Tokyo Electron Limited Teaching method for loading arm for objects to be processed
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626427A (en) * 1979-08-09 1981-03-14 Nec Kyushu Ltd Transfering device for semiconductor wafer
JPS5633149U (cg-RX-API-DMAC10.html) * 1979-08-17 1981-04-01
JPS5691417A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Heating treatment device for wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626427A (en) * 1979-08-09 1981-03-14 Nec Kyushu Ltd Transfering device for semiconductor wafer
JPS5633149U (cg-RX-API-DMAC10.html) * 1979-08-17 1981-04-01
JPS5691417A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Heating treatment device for wafer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258459A (ja) * 1984-06-04 1985-12-20 Deisuko Saiyaa Japan:Kk 縦型熱処理装置
JPS61291335A (ja) * 1985-06-19 1986-12-22 Denkoo:Kk 半導体移換え装置
JPS6265843A (ja) * 1985-09-12 1987-03-25 Denkoo:Kk 半導体ウエハ取出し装置
JPS62136439A (ja) * 1985-12-04 1987-06-19 Denkoo:Kk 板状体取出し装置
JPS62204543A (ja) * 1986-03-04 1987-09-09 Koyo Rindobaagu Kk ウエハ移載装置
JPS63102236U (cg-RX-API-DMAC10.html) * 1986-12-23 1988-07-02
JPH02139948A (ja) * 1988-11-18 1990-05-29 Tel Sagami Ltd 基板の移載方法
JPH03212951A (ja) * 1990-01-18 1991-09-18 Tokyo Electron Sagami Ltd 基板移載装置及び処理装置
US5822498A (en) * 1995-06-22 1998-10-13 Tokyo Electron Limited Teaching method for loading arm for objects to be processed
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system

Also Published As

Publication number Publication date
JPH0557736B2 (cg-RX-API-DMAC10.html) 1993-08-24

Similar Documents

Publication Publication Date Title
CN110010533A (zh) 基板处理装置以及基板处理方法
JPS5860553A (ja) 縦型自動プラズマ処理装置
JP2009071235A (ja) 基板処理装置
JPH0666295B2 (ja) 多段プラズマ処理装置
JPS6325500B2 (cg-RX-API-DMAC10.html)
JP2947380B2 (ja) プラズマ処理装置
JP2003257945A (ja) 基板処理装置
JPS63208223A (ja) ウエハ処理装置
JP2000111254A (ja) ディスク用カセットの乾燥装置
JP6426499B2 (ja) 基板処理装置、基板処理システムおよび基板処理方法
JPH0735393Y2 (ja) 縦型プラズマ処理機のウエハー搬送装置
JP2000036527A (ja) 基板搬送処理装置及び基板搬送処理方法
JPH02178945A (ja) 搬送方法
JPH03209822A (ja) 半導体ウェーハーの薬液処理槽及び自動洗浄処理装置
JPH11150170A (ja) 基板搬送装置
JPH11238783A (ja) 基板処理装置および方法
JP4050180B2 (ja) 基板処理方法
JPH06252120A (ja) ウェーハの湿式洗浄装置および洗浄方法
JP3628864B2 (ja) 基板処理装置
JPS5940773Y2 (ja) 半導体ウエハの移し替え装置
JP4004260B2 (ja) 基板処理装置
JPH036581Y2 (cg-RX-API-DMAC10.html)
JP3899289B2 (ja) 真空乾燥装置
JP2024079114A (ja) 処理チャンバの洗浄方法および基板処理システム
JPH11165865A (ja) 基板位置決め装置および基板位置決め方法