JPS5853838A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5853838A
JPS5853838A JP56152632A JP15263281A JPS5853838A JP S5853838 A JPS5853838 A JP S5853838A JP 56152632 A JP56152632 A JP 56152632A JP 15263281 A JP15263281 A JP 15263281A JP S5853838 A JPS5853838 A JP S5853838A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor element
supporter
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56152632A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6360533B2 (enrdf_load_stackoverflow
Inventor
Takashi Kondo
隆 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56152632A priority Critical patent/JPS5853838A/ja
Publication of JPS5853838A publication Critical patent/JPS5853838A/ja
Publication of JPS6360533B2 publication Critical patent/JPS6360533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56152632A 1981-09-26 1981-09-26 半導体装置 Granted JPS5853838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56152632A JPS5853838A (ja) 1981-09-26 1981-09-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56152632A JPS5853838A (ja) 1981-09-26 1981-09-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS5853838A true JPS5853838A (ja) 1983-03-30
JPS6360533B2 JPS6360533B2 (enrdf_load_stackoverflow) 1988-11-24

Family

ID=15544626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56152632A Granted JPS5853838A (ja) 1981-09-26 1981-09-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS5853838A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122460U (ja) * 1991-04-15 1992-11-04 三菱自動車工業株式会社 工作物固定装置
JP2002270634A (ja) * 2001-03-08 2002-09-20 Rohm Co Ltd 半導体装置
JP2007318182A (ja) * 2007-09-03 2007-12-06 Rohm Co Ltd 半導体装置
JP2011044755A (ja) * 2010-12-03 2011-03-03 Rohm Co Ltd 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101085A (enrdf_load_stackoverflow) * 1972-03-31 1973-12-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101085A (enrdf_load_stackoverflow) * 1972-03-31 1973-12-20

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122460U (ja) * 1991-04-15 1992-11-04 三菱自動車工業株式会社 工作物固定装置
JP2002270634A (ja) * 2001-03-08 2002-09-20 Rohm Co Ltd 半導体装置
JP2007318182A (ja) * 2007-09-03 2007-12-06 Rohm Co Ltd 半導体装置
JP2011044755A (ja) * 2010-12-03 2011-03-03 Rohm Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6360533B2 (enrdf_load_stackoverflow) 1988-11-24

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