JPS5848445A - 金属リ−ドと電極の接続方法 - Google Patents

金属リ−ドと電極の接続方法

Info

Publication number
JPS5848445A
JPS5848445A JP56147680A JP14768081A JPS5848445A JP S5848445 A JPS5848445 A JP S5848445A JP 56147680 A JP56147680 A JP 56147680A JP 14768081 A JP14768081 A JP 14768081A JP S5848445 A JPS5848445 A JP S5848445A
Authority
JP
Japan
Prior art keywords
electrode
film carrier
recess
electrodes
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56147680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234142B2 (enrdf_load_stackoverflow
Inventor
Isamu Kitahiro
北廣　勇
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56147680A priority Critical patent/JPS5848445A/ja
Publication of JPS5848445A publication Critical patent/JPS5848445A/ja
Publication of JPS6234142B2 publication Critical patent/JPS6234142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56147680A 1981-09-17 1981-09-17 金属リ−ドと電極の接続方法 Granted JPS5848445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56147680A JPS5848445A (ja) 1981-09-17 1981-09-17 金属リ−ドと電極の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56147680A JPS5848445A (ja) 1981-09-17 1981-09-17 金属リ−ドと電極の接続方法

Publications (2)

Publication Number Publication Date
JPS5848445A true JPS5848445A (ja) 1983-03-22
JPS6234142B2 JPS6234142B2 (enrdf_load_stackoverflow) 1987-07-24

Family

ID=15435845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56147680A Granted JPS5848445A (ja) 1981-09-17 1981-09-17 金属リ−ドと電極の接続方法

Country Status (1)

Country Link
JP (1) JPS5848445A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5999095U (ja) * 1982-12-23 1984-07-04 三菱重工業株式会社 プレス
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices
JPH08241914A (ja) * 1996-02-13 1996-09-17 Kyushu Hitachi Maxell Ltd 電鋳金属体
US7197817B2 (en) 2003-01-17 2007-04-03 Nec Electronics Corporation Method for forming contact bumps for circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (enrdf_load_stackoverflow) * 1971-12-22 1973-09-20
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (enrdf_load_stackoverflow) * 1971-12-22 1973-09-20
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5999095U (ja) * 1982-12-23 1984-07-04 三菱重工業株式会社 プレス
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices
JPH08241914A (ja) * 1996-02-13 1996-09-17 Kyushu Hitachi Maxell Ltd 電鋳金属体
US7197817B2 (en) 2003-01-17 2007-04-03 Nec Electronics Corporation Method for forming contact bumps for circuit board

Also Published As

Publication number Publication date
JPS6234142B2 (enrdf_load_stackoverflow) 1987-07-24

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