JPS58429U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58429U
JPS58429U JP1981093958U JP9395881U JPS58429U JP S58429 U JPS58429 U JP S58429U JP 1981093958 U JP1981093958 U JP 1981093958U JP 9395881 U JP9395881 U JP 9395881U JP S58429 U JPS58429 U JP S58429U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
tin
alloy
ground chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981093958U
Other languages
English (en)
Japanese (ja)
Other versions
JPS638136Y2 (online.php
Inventor
田中　俊範
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981093958U priority Critical patent/JPS58429U/ja
Publication of JPS58429U publication Critical patent/JPS58429U/ja
Application granted granted Critical
Publication of JPS638136Y2 publication Critical patent/JPS638136Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/682—
    • H10W72/5363—
    • H10W72/5449—

Landscapes

  • Wire Bonding (AREA)
JP1981093958U 1981-06-25 1981-06-25 半導体装置 Granted JPS58429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981093958U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981093958U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS58429U true JPS58429U (ja) 1983-01-05
JPS638136Y2 JPS638136Y2 (online.php) 1988-03-10

Family

ID=29888914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981093958U Granted JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS58429U (online.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS638136Y2 (online.php) 1988-03-10

Similar Documents

Publication Publication Date Title
JPS58429U (ja) 半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS58106947U (ja) 半導体の実装構造
JPS59145047U (ja) 半導体装置
JPS5881942U (ja) 半導体装置
JPS58111958U (ja) 半導体装置のリ−ドフレ−ム
JPS5883157U (ja) 樹脂封止半導体装置
JPH0310540U (online.php)
JPS5996849U (ja) 半導体装置
JPS588952U (ja) 半導体装置
JPS60106342U (ja) 半導体装置用セラミツクパツケ−ジキヤツプ
JPS58140645U (ja) Ｉｃリ−ドフレ−ム
JPS5877061U (ja) 半導体装置
JPS60136340A (ja) 炭化ケイ素と低融点ガラスの接合構造
JPS6142843U (ja) 半導体装置
JPS602849U (ja) 集積回路装置
JPS59192854U (ja) 光半導体装置
JPS58177947U (ja) 半導体装置
JPS58111943U (ja) 樹脂封止型半導体装置
JPS5999447U (ja) 半導体用パツケ−ジ
JPS60141148U (ja) 半導体装置
JPS58155852U (ja) 半導体装置
JPS58184840U (ja) 半導体装置
JPS58140636U (ja) 半導体装置
JPS5948047U (ja) 半導体装置