JPS5829836U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5829836U JPS5829836U JP1981123497U JP12349781U JPS5829836U JP S5829836 U JPS5829836 U JP S5829836U JP 1981123497 U JP1981123497 U JP 1981123497U JP 12349781 U JP12349781 U JP 12349781U JP S5829836 U JPS5829836 U JP S5829836U
- Authority
- JP
- Japan
- Prior art keywords
- pad part
- metal wire
- thin metal
- bonding pad
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
-
- H10W72/5449—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981123497U JPS5829836U (ja) | 1981-08-19 | 1981-08-19 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981123497U JPS5829836U (ja) | 1981-08-19 | 1981-08-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5829836U true JPS5829836U (ja) | 1983-02-26 |
| JPS6244531Y2 JPS6244531Y2 (enExample) | 1987-11-25 |
Family
ID=29917398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981123497U Granted JPS5829836U (ja) | 1981-08-19 | 1981-08-19 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5829836U (enExample) |
-
1981
- 1981-08-19 JP JP1981123497U patent/JPS5829836U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6244531Y2 (enExample) | 1987-11-25 |
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