JPS58217184A - ウエハ乾燥装置 - Google Patents
ウエハ乾燥装置Info
- Publication number
- JPS58217184A JPS58217184A JP10026082A JP10026082A JPS58217184A JP S58217184 A JPS58217184 A JP S58217184A JP 10026082 A JP10026082 A JP 10026082A JP 10026082 A JP10026082 A JP 10026082A JP S58217184 A JPS58217184 A JP S58217184A
- Authority
- JP
- Japan
- Prior art keywords
- bowl
- wafer
- rotor
- semiconductor wafer
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000001035 drying Methods 0.000 claims description 21
- 238000009423 ventilation Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000011109 contamination Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026082A JPS58217184A (ja) | 1982-06-09 | 1982-06-09 | ウエハ乾燥装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026082A JPS58217184A (ja) | 1982-06-09 | 1982-06-09 | ウエハ乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58217184A true JPS58217184A (ja) | 1983-12-17 |
| JPS6253942B2 JPS6253942B2 (enrdf_load_stackoverflow) | 1987-11-12 |
Family
ID=14269237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10026082A Granted JPS58217184A (ja) | 1982-06-09 | 1982-06-09 | ウエハ乾燥装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58217184A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02721U (enrdf_load_stackoverflow) * | 1988-06-14 | 1990-01-05 | ||
| JPH0224537U (enrdf_load_stackoverflow) * | 1988-08-01 | 1990-02-19 | ||
| JP2010065858A (ja) * | 2008-09-08 | 2010-03-25 | Kuroda Kazunari | 物品搬送用容器の脱水乾燥装置 |
| JP2010247282A (ja) * | 2009-04-16 | 2010-11-04 | Disco Abrasive Syst Ltd | 研削装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508858U (enrdf_load_stackoverflow) * | 1973-05-21 | 1975-01-29 | ||
| JPS5036534A (enrdf_load_stackoverflow) * | 1973-08-06 | 1975-04-05 |
-
1982
- 1982-06-09 JP JP10026082A patent/JPS58217184A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508858U (enrdf_load_stackoverflow) * | 1973-05-21 | 1975-01-29 | ||
| JPS5036534A (enrdf_load_stackoverflow) * | 1973-08-06 | 1975-04-05 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02721U (enrdf_load_stackoverflow) * | 1988-06-14 | 1990-01-05 | ||
| JPH0224537U (enrdf_load_stackoverflow) * | 1988-08-01 | 1990-02-19 | ||
| JP2010065858A (ja) * | 2008-09-08 | 2010-03-25 | Kuroda Kazunari | 物品搬送用容器の脱水乾燥装置 |
| JP2010247282A (ja) * | 2009-04-16 | 2010-11-04 | Disco Abrasive Syst Ltd | 研削装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6253942B2 (enrdf_load_stackoverflow) | 1987-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6062239A (en) | Cross flow centrifugal processor | |
| JPS6064436A (ja) | スピンドライヤ | |
| JP4933945B2 (ja) | 液処理装置 | |
| JPS58217184A (ja) | ウエハ乾燥装置 | |
| KR100757846B1 (ko) | 기판 처리 장치 | |
| JP4567178B2 (ja) | スピン処理装置 | |
| JP4369022B2 (ja) | スピン処理装置 | |
| JP2000114219A (ja) | 基板処理装置 | |
| JP4912020B2 (ja) | 液処理装置 | |
| JP3948963B2 (ja) | スピン処理装置 | |
| JPH03238819A (ja) | 半導体材料の乾燥方法および装置 | |
| JP4358410B2 (ja) | スピン処理装置 | |
| JP6513159B2 (ja) | ウエハチャック補助具 | |
| JP3548976B2 (ja) | 減圧化状態を利用した半導体ウェハーのエッチング処理方法およびその装置 | |
| JP3559987B2 (ja) | 回転処理装置 | |
| JPS627133A (ja) | 洗浄乾燥装置 | |
| JPS60154624A (ja) | ウエ−ハ乾燥装置 | |
| JPH06224173A (ja) | 回転式基板処理装置 | |
| JP2001276714A (ja) | スピン処理装置 | |
| JPH0441977Y2 (enrdf_load_stackoverflow) | ||
| JPS5818927A (ja) | 水切乾燥装置 | |
| JP3636605B2 (ja) | 回転式塗布装置 | |
| JPH069497Y2 (ja) | 半導体材料乾燥装置 | |
| KR20010065675A (ko) | 초음파 진동 건조장치 | |
| JPH0513008Y2 (enrdf_load_stackoverflow) |