JPS58204599A - セラミツク多層回路基板の製造方法 - Google Patents
セラミツク多層回路基板の製造方法Info
- Publication number
- JPS58204599A JPS58204599A JP8842782A JP8842782A JPS58204599A JP S58204599 A JPS58204599 A JP S58204599A JP 8842782 A JP8842782 A JP 8842782A JP 8842782 A JP8842782 A JP 8842782A JP S58204599 A JPS58204599 A JP S58204599A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- flux
- conductor
- ceramic
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims description 37
- 230000004907 flux Effects 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000007423 decrease Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- AJAKLDUGVSKVDG-LEAGNCFPSA-N (7r,11r)-3,7,11,15-tetramethylhexadecan-1-ol Chemical compound CC(C)CCC[C@@H](C)CCC[C@@H](C)CCCC(C)CCO AJAKLDUGVSKVDG-LEAGNCFPSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 phthalic acid ester Chemical class 0.000 description 1
- AJAKLDUGVSKVDG-UHFFFAOYSA-N phytanyl alcohol Natural products CC(C)CCCC(C)CCCC(C)CCCC(C)CCO AJAKLDUGVSKVDG-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 244000144977 poultry Species 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8842782A JPS58204599A (ja) | 1982-05-25 | 1982-05-25 | セラミツク多層回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8842782A JPS58204599A (ja) | 1982-05-25 | 1982-05-25 | セラミツク多層回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58204599A true JPS58204599A (ja) | 1983-11-29 |
| JPS6238878B2 JPS6238878B2 (enrdf_load_stackoverflow) | 1987-08-20 |
Family
ID=13942481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8842782A Granted JPS58204599A (ja) | 1982-05-25 | 1982-05-25 | セラミツク多層回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58204599A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5696794A (en) * | 1979-12-29 | 1981-08-05 | Matsushita Electric Ind Co Ltd | Metalizing composition |
| JPS5782188A (en) * | 1980-11-07 | 1982-05-22 | Hitachi Ltd | Metallizing paste |
-
1982
- 1982-05-25 JP JP8842782A patent/JPS58204599A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5696794A (en) * | 1979-12-29 | 1981-08-05 | Matsushita Electric Ind Co Ltd | Metalizing composition |
| JPS5782188A (en) * | 1980-11-07 | 1982-05-22 | Hitachi Ltd | Metallizing paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238878B2 (enrdf_load_stackoverflow) | 1987-08-20 |
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