JPS58204599A - Method of producing ceramic multialyer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method for manufacturing a ceramic multilayer circuit board.

Traditionally, the lamic multi-layer board company uses pre-sintered ceramic plates to print out the lζ conductor paste.

This method was then stamped with color paste, then repeated and cut together to form a multi-layer circuit, and was then made into a mold with a bit of craftsmanship. The Roku layer shrinks more than the substrate, so cracks may occur.

There was a drawback that warping occurred.

In order to compensate for this drawback, attempts were made to form a multilayer circuit using a conductive paste and an insulating paste as described above on ceramic greennute (hereinafter referred to as "greennut"), and to simultaneously fire the multilayer circuit. There is a drawback that cracks and warpage occur when the printed insulation paste is sintered.

Furthermore, in order to overcome the above-mentioned drawbacks, the inventors of the present invention have conducted extensive studies and found that a coupled paste containing the same flux as the slack contained in the insulating paste was used.
A ceramic multilayer circuit board was completely manufactured by forming and firing at the same time.

We were able to prevent the occurrence of cracks, warping, etc. However, on the other hand, the adhesive strength of the metallized part of the outermost conductor layer decreases, and the Vi
There was a lack of soldered chips, etc., which resulted in the failure of soldered chips. It is an object of the present invention to provide a method for manufacturing a ceramic multilayer circuit board that does not cause a decrease in performance.

The present inventors further investigated the above-mentioned drawbacks and found that the conductor paste forming the outermost conductor layer does not contain a flux component, and the conductor paste forming the inner conductor layer (
When a conductive paste containing a flux component was used to form conductive pastes (through-holes and circuit parts), no cracks or warping occurred, and soldered chips such as silver-brazed 11-dobins and terminals did not occur. We were able to manufacture a complete ceramic multilayer circuit board in which carriers and other components do not peel off.

In the present invention, conductor paste 17'9 and ceramic insulation paste are printed multiple times on a green sheet.

In the method of manufacturing a ceramic multilayer circuit board by co-firing, the conductor paste that forms the outermost conductor layer does not contain a flux component, and the conductor paste that forms the inner conductor layer contains a flux component. Ceramic $ layer times v! that uses conductor paste to do! r Concerning how to envy a straw board.

In the present invention, the ceramic material is not limited in any way, and for example, alumina is often used. , and the thickness and material of the green sheet.

There are no restrictions on flux etc.

In the present invention, it is necessary to use a conductor paste that does not contain gold as a flux component for the conductor paste that forms the outermost conductor layer, and a one-piece paste that contains a flux component for the conductor paste that forms the inner conductor layer. , the conductor paste that forms the entire outermost conductor layer) If flux is included, the adhesive strength of the metallized part will decrease, and the conductor paste that forms the inner four layers will contain a flux component. If this is not done, it will not be possible to eliminate the sintering failure of the insulation/-, and the purpose of the invention will not be achieved8. It is preferable to use the same flux as the flux contained in the seven-color paste.

The content is not limited in any way.

It is preferable that the paste contains 20 parts by weight or less (not including 0 parts by weight).

The type of conductive paste used in the present invention, the printing thickness, etc. are not limited at all.

The present invention '6L: tax man will be described below with reference to examples.

Example 1 High purity alumina with an average particle size of 2 μm (alumina purity 99.
54 or more) 96.2 parts by weight of flux 2 shown in Table 1
3.8 parts by weight was added and mixed uniformly to obtain raw material powder A.

To 100 parts by weight of this raw material powder A were added 4L+W 8 parts by weight of polyvinyl butyral as an inder, 1 part of phthalic acid ester 4x as a plasticizer, 20 parts by weight of phytanol and 50 parts by weight of trichlorethylene as a thickening agent, and then milled in a ball mill. After 50 hours of uniform mixing to form a ceramic slip, 4.0.8
I asked about AT's Green Seat Try.

On the other hand, the ceramic slip described above was used as is as an insulating paste.

Next, W (tungsten) conductor paste (Asahi Kagaku Ura,
10 parts by weight of the flux shown in Table 1 was added to 90 parts by weight of the product (trade name 3TW-1000) and mixed uniformly with a pestle to prepare a flux-containing conductor paste.

After forming a straight i0.3-φ) through hole in the aforementioned green sheet, apply flux-cored conductive paste K1M cloth to the through hole, and apply flux to each of the front and back sides of the &C green sheet. Form a circuit with the conductive paste (in this state, the front and back sides of the conductive sheet are conductive), and the above-mentioned iron paste is placed on top of it) T: 30 μm
1 thickness, and repeat this process 4 times on the front side and 111 times on the back side.
After repeating 9 times 12 times to form 6 layers of the same name, the outermost 1
This is a W4 body paste that does not contain a lot of flux components (
Asahi chemical type, trade name 3TW-1000) was made into poultry cloth.

Then in air 301)'C5')'C-'-
＃Pulling υ rise, - rare speed, -0 wedge.

From 30 θ°C, the temperature was increased to 39°C/hour in the air with a temperature of 1.10°C, and the flux (conductor Pace E, flux composition 4+-free to VJ main paste, and official paste were simultaneously formed to obtain a ceramic material with a volume of 1 tsubo.

The external appearance of the ceramic multi-circuit board was inspected, but no cracks or warping were found in the insulating layer. A lead bottle was attached to the terminal of the metallized part using wax, but no peeling of the 11-dopino occurred.

Table 1 Comparative Example 1 Green Note used in Me1 Collapse Example 1, 7) W-4 paste that does not contain flux/+ all in the through hole (
Asahi'hi Gakutsu, Product 63T'V-1,))・])Shi1
Cloth 4 Then, the same W conductor paste that does not contain the flux component as described above and the insulating paste used in Example 1 were used on the front and back sides of the green notebook, respectively, and the other methods were as in Example 1 and the method of colleagues 6. The layers formed a multilayer circuit. This product was fired under the same conditions as in Example 1 to obtain a ceramic multilayer circuit board.

When the appearance of this ceramic multilayer circuit board was observed, microcracks, warping, etc. occurred in the insulating layer above the through holes. However, although the lead bin'r% solder was used to adhere the terminal on the metallized portion, the lead bin did not peel off.

Comparative Example 2 A ceramic multilayer circuit board was obtained using the Franks-containing conductor paste used in Example 1 for the outermost conductor layer and using the same method and conditions as in Example 1.

When we observed the appearance of this ceramic multilayer board, we found that there were no microcracks or warping in the holes on the through-holes, but there was no evidence of any microcracks or warping on the terminals of the metallized parts.・Opposite tζkorori - “゛bi/
ノ): I was raped, I was about 504', and I was a little bit seduced, :) - I was a little bit of a pressure officer, but I just let go of this invention, and I didn't hire one. The conductor paste that forms the conductor layer of the rule uses conductor paste gold that does not contain any flux components, and the conductor paste that forms the four internal layers uses conductor paste that contains flux components. The lack of bonding is eliminated and the occurrence of cracks, warping, etc. is prevented, and the adhesive strength of the metallized part of the outermost conductor layer does not decrease, so lead bottles, terminals, chip carriers, etc. do not peel off. It is possible to manufacture plugging plates.

Claims (1)

[Claims] 1.41-<- In a method of printing a ceramic insulating paste several times on a ceramic green notebook and simultaneously firing it to produce a complete ceramic multilayer appositional board,
A ceramic multilayer circuit characterized in that the conductor paste for forming the entire outermost conductor layer is a conductor paste containing no flux component, and the conductor paste for forming the entire inner conductor layer is a four-paste paste containing all flux components. Substrate manufacturing method.