JPS58199534A - 半導体素子のリ−ド部材の接続方法 - Google Patents

半導体素子のリ−ド部材の接続方法

Info

Publication number
JPS58199534A
JPS58199534A JP57082583A JP8258382A JPS58199534A JP S58199534 A JPS58199534 A JP S58199534A JP 57082583 A JP57082583 A JP 57082583A JP 8258382 A JP8258382 A JP 8258382A JP S58199534 A JPS58199534 A JP S58199534A
Authority
JP
Japan
Prior art keywords
lead member
solder
piece
chip
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57082583A
Other languages
English (en)
Other versions
JPH0136702B2 (ja
Inventor
Shigemi Ono
小野　重美
Susumu Akiyama
進 秋山
Shigeo Shimada
島田　繁夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP57082583A priority Critical patent/JPS58199534A/ja
Publication of JPS58199534A publication Critical patent/JPS58199534A/ja
Publication of JPH0136702B2 publication Critical patent/JPH0136702B2/ja
Granted legal-status Critical Current

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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は、帯流素子等の半導体素子のリード部材を量産
性を有して接続する方法に関するものである。
トランジスタやダイオードの内部リードの接続はワイヤ
ボンディング法によって一般に行われている。しかし、
ワイヤボンディング法で使用するボンダーは同時に１箇
所しか接続できない。また、太いリー、ド線の接続には
適していない。この種の問題を解決するため、本願出願
人は、特開昭５６−９４７５４号公報に開示されている
方法を提案した。この方法によれば、電力用半導体素子
の量産化が可能になる。しかし、内部リードの半導体チ
ップへのろう接、半導体チップの基板へのろう接、及び
内部リードの外部リードへのろう接を独立に行わなけれ
ばならない。また、先にろう接した部分が後のろう接に
よって悪形善ヲ受けないよ・うにろう材を組み合せを工
夫しなければならない。
また、ろう材の組み合せを工夫してもろう接の温度管理
が不充分であれば、前のろう接部分が劣化する恐れがあ
った。更にリードフレームを使用して例、ｔばセンター
タップ型整流素子を製造する場合に、半導体チップ部分
を樹脂モールドした後に１、外部リードにＰｂ　−８ｎ
共晶半田デツプ法等で半田被覆を行うと、既にろう接さ
れている部分のろう材が再び融けるという問題が生じた
。
上記欠点を解決するために、本願出願人は、特願昭５７
−１２１２３号で、第１図〜第３図に示す新規な内部リ
ード線の接続方法を提案した。この方法では、まず、基
板１１１及び外部リード部材（２）＋３１　＋４１を有
する銅にニッケルメッキしたリードフレームを用意する
。また上下に電極を有するシリコンダイオードチップ（
５）を用意する。また銅にニッケルメッキした外部リー
ド部材接続用金属片（６）全用意する。更に、ｌ’ｂ９
５重童％＋８ｎ　５重蓋％から成る固相線温度３０４Ｃ
，液相一温度３１４Ｃ１ の半田片（７１＋８１　Ｆ９）α０）を用意する。また
、直径０．５１ｔｌｌのニッケルメッキした銅線から成
る丸棒状の内部材（１１１を用意する。
次圧、カーボン製の治具にリードフレーム金セットし、
第１図に示す如く外部リード部材（２）の上に半田片Ｕ
Ｄを介してディスク状金属片（６）を配し、この金属片
（６）の上に半田片（９）を配す。次に、基板（１）の
上に半田片（７）ヲ介してダイオードチップ（５）ヲ配
す。次に、チップ（５）の上に半田片（８）を配す。し
かる後、丸棒状内部リード部材ｔｔｎの一端部（ｌｌａ
）をチップ（５）の上に半田片（８）ヲ介して配し、ま
たその他端部（ｌｌｂ）　’！ｉ外部リード部材（２）
の上に半田片（９）（ｌαと金属片（６）とを介して配
す。金属片（６）はチップ（５）と同じ厚さに形成され
ているので、内部リード部材旧）はチップ（５）の表面
と同一方向に伸びた状態即ち水平方向に伸びた状態とな
る。尚第１図には、センタタップ整流素子の一方のダイ
オード部分のみが示されているが、他方のダイオード部
分も同様に構成する。また、リードフレームには多数の
整流素子形成部分が設けられているので、同様に各部材
を配す。
しかる後、第１図に示すもの？：、、Ｈｔ等の還元性ガ
ス又はＮ１等の不活性ガス雰囲気の加熱炉の中に入れ、
半田片（７）　ｔ８）　ｔ９）　（１０）を同時に融か
し、第２図に示す半田（７ａ）（８ａ）（９ａ）（１０
ａ）　Ｋよって、基板ｉｌｌトチツブ（５）との間、チ
ップ（５）と内部リード部材側との間、内部リード部材
側と外部リード部材の一部となる金属片（６）との間、
金属片（６）と外部リード部材（２）との間を同時にろ
う接する。
次に、第３図で点線で示す部分を合成樹脂圓でモールド
する。また合成樹脂Ｑ２＋でモールドされなかった部分
を半田浴に浸漬して外部リード部材（２）（３１（４１
を半田被覆する。またリードフレームから外部リード部
材ｔ２＋　＋３１　（４１を分離する。
上述の如き方法によれば、合成樹脂Ｑ’２）でモールド
される内部の各部分を同時にろう接することが可能にな
るので、量産性が大幅に向上する。また各ろう接部分に
融点の高いろう材を使用することが可能になるので、外
部リード部材１２＋　［３）　（４１の露出部分を半田
浸漬する場合等圧於いて、内部の半田が融けたり、軟化
することが少なくなる。しかし、リード線＋１０とチッ
プ（５）の側面との間に半田（８ａ）Ｏたれた部分（８
ｂ）が生じ、ＰＮ接合の短絡が生じることがあった。
そこで、本発明の目的は、半田のだれを阻止して信頼性
の高い半導体素子を量産することが可能な内部リード部
材の接続方法を提供することにある。
上記目的全達成するための本発明は、導電性基□板の上
にろう材片を介して半導体チップを載置し、棒状の内部
リード部材の一端部を前記半導体チップの上に配し、前
記内部リード部材の他端部を外部リード部材の上に配し
、前記内部リード部材の一端部及び他端部の下又はその
近傍にろう材片を置き、且つ前記半導体チップの表面と
同一方向に伸びるように前記内部リード部材を水平に保
持したものを加熱炉に入れ、前記基板と前記半導体チッ
プとの間、前記半導体チップと前記内部リード部材との
間、及び前記内部リード部材と前記外部リード部材との
間を同時にろう接する半導体素子１１１・′　１ のり−ド部材の接続方法に於いて、前記内部リード部材
として少なくとも一端部に鍔状ｍｋ有するものを使用し
、前記鍔状部を前記半導体チップの上面の縁から離れた
前記上面の中央部上に配置することを特徴とする半導体
素子のリード部材の接続方法に係わるものである。
上記発明によれば、内部リード部材として端部に鍔状部
を有するものを使用し、この鍔状部をチップ上面の中央
部上に配置するのでリード部材の水平に伸びる部分とチ
ップ上面との間に間隔が生じ、溶融ろう材をこの部分に
保持することが可能になり、チップ側面にろう材がたれ
るのを防止することが可能になる。
次に、第４図〜第７図を参照して本発明の実施例につい
て述べる。但し、第４図〜第７図に於いて符号（１）〜
ａ４で示すものは第１図〜第３図で同一符号で示すもの
と同一であるので、その説明を省略する。
本実施例では、第４図に示す如（、内部リード部材（Ｉ
ｌｌが直径約０．５１１１１の水平部分（１３１と先端
に於いて水平部分Ｑ３）から半径方向に突出している鍔
状部分側とで形成されている。尚鍔状部分Ｉはリード部
材ｔｔｎの端を押しつぶすことによって形成され、その
最大径を約０．７　ａｌｌとしたものである。従って水
平部分（１３１と鍔状部分α力の最大径周縁部との間に
約０．２１１１１の段差が生じ、この段差が半田片（力
の厚さＱ、ｌ　Ｉｌｍよりも大きく設定されている。
第４図に示すように配置したものを加熱すれば、半田片
（７）　（８）　ｆ９）　ｕＯ）が溶融し、第５図に示
す如く半田（７，）（Ｂａ）（９ａ）（１０ａ）にて各
部が接着される。この際、内部リード部材（１１）Ｋは
鍔状部分Ｉが設けられているので、鍔状部分Ｈの高さに
相当した隙間が水平部分αＪとチップ（５）の上面との
間に生じ、半田（８ａ）はこの隙間に保持され、チップ
（５）の側面に殆んどたれない。また、チップ（５）の
直径は約２．６〜３＋ｍであり、この中央部に第７図に
示す鍔状部分αａを配すので、水平部分（１３）に直交
する面方向に於いても半田（８ａ）のだれが生じない。
従って、本実施例によれば、第１図〜第３図と同一の作
用効果を得ることができるのみでなく、半田（８ａ）の
だれを防止して歩留りを向上させることが可能になる。
以上、本発明の実施例について述べたが、本発明はこれ
に限定されるものではなく、更に変形可能なものである
。例えば、第８図に示す如く、鍔状部分ａ夷ヲ円板状に
形成してもよい。またリード部材側の他端部（ｌｌｂ）
　Ｋ大きな鍔状部分を設け、これにより、金属片（６）
を省く構成としてもよい。
また鍔状部分（１４１の形状を外周縁が六角形等の多角
形となるようにしてもよい。また、近接させて２つの鍔
状部分（Ｉ４１′ｔ−設け、いずれもチップ（５）上に
置くようにしてもよい。また、リードフレームを使用し
ない場合にも適用可能である。
【図面の簡単な説明】
第１図〜第３図は従来の整流素子の製造を示すものであ
り、第１図は整流素子の各部の配ｔｉ示す第３図のＩ−
Ｉ線に相当する断面図、第２図はろう接後の整流素子を
示す断面図、第３図はＩＪ　−ドフレームから切断前の
整流素子の平面図である。 第４図〜第７図は本発明の実施例に係わる整流素、■′
１ 子の製造を示すものであり、第４図は各部の配置を示す
第６図のＩＶ−ＩＶ線に相当する部分の断面図、第５図
はろう接後の整流素子の断面図、第６図はリードフレー
ムの状態の平面図、第７図は第４図の左側面の一部に相
当する側面図である。第８図は内部リード部材の変形例
を示す正面図である。 尚図面に用いられている符号に於いて、（１）は基板、
１２１　Ｆ３）　ｆ４１は外部リード部材、（５）はダ
イオードチップ、（６）は金属片、（７１ｆ８）　（９
）　（１０１は半田片、Ｕは内部リード部材、（１２１
は合成樹脂、α３）は水平部分、■は鍔状部分である。 代理人　高野副次 ３１ 第１図 第２図 １ 第３図 １　　１１　ゝ１２　９

Claims (1)

    【特許請求の範囲】
  1. （１）導電性基板の上にろう材片を介して半導体チップ
    を載置し、棒状の内部リード部材の一端部を前記半導体
    チップの上に配し、前記内部リード部材の他端部を外部
    リード部材の上に配し、前記内部リード部材の一端部及
    び他端部の下又はその近傍にろう材片を置き、且つ前記
    半導体チップの表面と同一方向に伸びるように前記内部
    リード部材を水平に保持したものを加熱炉に入れ、前記
    基板と前記半導体チップとの間、前記半導体チップと前
    記内部リード部材との間、及び前記内部ＩＪ　−ド部材
    と前記外部リード部材との間を同時にろう接する半導体
    素子のリード部材の接続方法に於いて、 ｔＩＩ記内部リード部材として少なくとも一端部に鍔状
    部を有するものを使用し、前記鍔状部を前記半導体チッ
    プの上面の縁から離れた前記上面の中央部上に配置する
    ことを特徴とする半導体素子のリード部材の接続方法。
JP57082583A 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法 Granted JPS58199534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57082583A JPS58199534A (ja) 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57082583A JPS58199534A (ja) 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法

Publications (2)

Publication Number Publication Date
JPS58199534A true JPS58199534A (ja) 1983-11-19
JPH0136702B2 JPH0136702B2 (ja) 1989-08-02

Family

ID=13778498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57082583A Granted JPS58199534A (ja) 1982-05-17 1982-05-17 半導体素子のリ−ド部材の接続方法

Country Status (1)

Country Link
JP (1) JPS58199534A (ja)

Also Published As

Publication number Publication date
JPH0136702B2 (ja) 1989-08-02

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