JPS58198526A - 耐熱性エポキシ樹脂組成物 - Google Patents

耐熱性エポキシ樹脂組成物

Info

Publication number
JPS58198526A
JPS58198526A JP8268782A JP8268782A JPS58198526A JP S58198526 A JPS58198526 A JP S58198526A JP 8268782 A JP8268782 A JP 8268782A JP 8268782 A JP8268782 A JP 8268782A JP S58198526 A JPS58198526 A JP S58198526A
Authority
JP
Japan
Prior art keywords
epoxy resin
parts
trisphenol
heat
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8268782A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160168B2 (enrdf_load_stackoverflow
Inventor
Takaaki Fukai
深井　孝彰
Shuichi Ebihara
海老原　秀一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP8268782A priority Critical patent/JPS58198526A/ja
Publication of JPS58198526A publication Critical patent/JPS58198526A/ja
Publication of JPH0160168B2 publication Critical patent/JPH0160168B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP8268782A 1982-05-17 1982-05-17 耐熱性エポキシ樹脂組成物 Granted JPS58198526A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8268782A JPS58198526A (ja) 1982-05-17 1982-05-17 耐熱性エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8268782A JPS58198526A (ja) 1982-05-17 1982-05-17 耐熱性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58198526A true JPS58198526A (ja) 1983-11-18
JPH0160168B2 JPH0160168B2 (enrdf_load_stackoverflow) 1989-12-21

Family

ID=13781324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8268782A Granted JPS58198526A (ja) 1982-05-17 1982-05-17 耐熱性エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58198526A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61200118A (ja) * 1985-03-01 1986-09-04 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物
JPS63183918A (ja) * 1987-01-27 1988-07-29 Ube Ind Ltd エポキシ樹脂組成物
JPS644615A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Thermosetting resin composition and its application
JPH01101658A (ja) * 1987-10-15 1989-04-19 Nitto Denko Corp 半導体装置
JPH01249826A (ja) * 1988-03-31 1989-10-05 Toshiba Corp 半導体封止用エポキシ樹脂成形材料
JPH0294654A (ja) * 1988-09-30 1990-04-05 Nitto Denko Corp 半導体装置
US6034185A (en) * 1997-04-09 2000-03-07 Chang Chun Plastics Co., Ltd. Epoxy resin composition containing polyalkyl phenol resins and/or polyalkyl phenol epoxy resins
WO2001055277A1 (fr) * 2000-01-19 2001-08-02 Hitachi Chemical Co., Ltd. Film adhesif pour semi-conducteurs grille de connexion a film adhesif pour semi-conducteurs et dispositif semi-conducteur les utilisant
JP2022060909A (ja) * 2020-10-05 2022-04-15 日東シンコー株式会社 樹脂組成物、及び、熱伝導性シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830799A (enrdf_load_stackoverflow) * 1971-08-19 1973-04-23
JPS5734122A (en) * 1980-08-11 1982-02-24 Mitsubishi Petrochem Co Ltd Thermosetting resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830799A (enrdf_load_stackoverflow) * 1971-08-19 1973-04-23
JPS5734122A (en) * 1980-08-11 1982-02-24 Mitsubishi Petrochem Co Ltd Thermosetting resin composition

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61200118A (ja) * 1985-03-01 1986-09-04 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物
JPS63183918A (ja) * 1987-01-27 1988-07-29 Ube Ind Ltd エポキシ樹脂組成物
JPS644615A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Thermosetting resin composition and its application
JPH01101658A (ja) * 1987-10-15 1989-04-19 Nitto Denko Corp 半導体装置
JPH01249826A (ja) * 1988-03-31 1989-10-05 Toshiba Corp 半導体封止用エポキシ樹脂成形材料
JPH0294654A (ja) * 1988-09-30 1990-04-05 Nitto Denko Corp 半導体装置
US6034185A (en) * 1997-04-09 2000-03-07 Chang Chun Plastics Co., Ltd. Epoxy resin composition containing polyalkyl phenol resins and/or polyalkyl phenol epoxy resins
WO2001055277A1 (fr) * 2000-01-19 2001-08-02 Hitachi Chemical Co., Ltd. Film adhesif pour semi-conducteurs grille de connexion a film adhesif pour semi-conducteurs et dispositif semi-conducteur les utilisant
US6733880B2 (en) 2000-01-19 2004-05-11 Hitachi Chemical Co., Ltd. Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same
JP2022060909A (ja) * 2020-10-05 2022-04-15 日東シンコー株式会社 樹脂組成物、及び、熱伝導性シート

Also Published As

Publication number Publication date
JPH0160168B2 (enrdf_load_stackoverflow) 1989-12-21

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