JPS6331103B2 - - Google Patents

Info

Publication number
JPS6331103B2
JPS6331103B2 JP56002094A JP209481A JPS6331103B2 JP S6331103 B2 JPS6331103 B2 JP S6331103B2 JP 56002094 A JP56002094 A JP 56002094A JP 209481 A JP209481 A JP 209481A JP S6331103 B2 JPS6331103 B2 JP S6331103B2
Authority
JP
Japan
Prior art keywords
weight
powder
filler
silicon carbide
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56002094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57115853A (en
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Kosuke Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56002094A priority Critical patent/JPS57115853A/ja
Publication of JPS57115853A publication Critical patent/JPS57115853A/ja
Publication of JPS6331103B2 publication Critical patent/JPS6331103B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56002094A 1981-01-12 1981-01-12 Resin-sealed semiconductor device Granted JPS57115853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56002094A JPS57115853A (en) 1981-01-12 1981-01-12 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56002094A JPS57115853A (en) 1981-01-12 1981-01-12 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS57115853A JPS57115853A (en) 1982-07-19
JPS6331103B2 true JPS6331103B2 (enrdf_load_stackoverflow) 1988-06-22

Family

ID=11519756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56002094A Granted JPS57115853A (en) 1981-01-12 1981-01-12 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS57115853A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081279U (ja) * 1991-07-29 1996-08-13 株式会社ホクコン タンクピット

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101523A (ja) * 1984-10-25 1986-05-20 Toshiba Chem Corp 封止用樹脂組成物
JPS62223246A (ja) * 1986-03-25 1987-10-01 Mitsubishi Electric Corp 半導体封止用高熱伝導性樹脂組成物
JPS63142025A (ja) * 1986-12-05 1988-06-14 Toshiba Chem Corp 封止用樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081279U (ja) * 1991-07-29 1996-08-13 株式会社ホクコン タンクピット

Also Published As

Publication number Publication date
JPS57115853A (en) 1982-07-19

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