JPS58196238A - 無電解メツキ方法 - Google Patents

無電解メツキ方法

Info

Publication number
JPS58196238A
JPS58196238A JP7923282A JP7923282A JPS58196238A JP S58196238 A JPS58196238 A JP S58196238A JP 7923282 A JP7923282 A JP 7923282A JP 7923282 A JP7923282 A JP 7923282A JP S58196238 A JPS58196238 A JP S58196238A
Authority
JP
Japan
Prior art keywords
base material
film
electroless plating
plating
radically polymerizable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7923282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH036225B2 (enrdf_load_html_response
Inventor
Tadashi Ishibashi
正 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Artience Co Ltd
Original Assignee
Toyo Ink SC Holdings Co Ltd
Toyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink SC Holdings Co Ltd, Toyo Ink Mfg Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Priority to JP7923282A priority Critical patent/JPS58196238A/ja
Publication of JPS58196238A publication Critical patent/JPS58196238A/ja
Publication of JPH036225B2 publication Critical patent/JPH036225B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
JP7923282A 1982-05-13 1982-05-13 無電解メツキ方法 Granted JPS58196238A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7923282A JPS58196238A (ja) 1982-05-13 1982-05-13 無電解メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7923282A JPS58196238A (ja) 1982-05-13 1982-05-13 無電解メツキ方法

Publications (2)

Publication Number Publication Date
JPS58196238A true JPS58196238A (ja) 1983-11-15
JPH036225B2 JPH036225B2 (enrdf_load_html_response) 1991-01-29

Family

ID=13684130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7923282A Granted JPS58196238A (ja) 1982-05-13 1982-05-13 無電解メツキ方法

Country Status (1)

Country Link
JP (1) JPS58196238A (enrdf_load_html_response)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5912942A (ja) * 1982-07-09 1984-01-23 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ポリエステル基板に金属層を付着させる方法
US5087524A (en) * 1988-09-22 1992-02-11 Mobay Corporation Article molded from a polycarbonate composition having improved platability
FR2699927A1 (fr) * 1992-12-30 1994-07-01 Hispano Suiza Sa Procédé d'assemblage d'une première pièce en matériau composite réalisé en un polymère du type polyamide ou polyimide avec une deuxième pièce grâce à un adhésif approprié.
JPH09214140A (ja) * 1995-11-29 1997-08-15 Toppan Printing Co Ltd 多層プリント配線板及びその製造方法
US5718981A (en) * 1996-02-02 1998-02-17 Eastman Kodak Company Polyester photographic film support
EP1331285A3 (en) * 2002-01-25 2004-06-09 Fuji Photo Film Co., Ltd. Thin-layer metal film
US6783895B2 (en) * 2000-02-21 2004-08-31 Mitsubishi Materials Corporation Collector for alkaline secondary battery, method for making the same, and alkaline secondary battery using the same
WO2005090454A1 (en) * 2004-03-24 2005-09-29 Fuji Photo Film Co., Ltd. Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material
JP2005272961A (ja) * 2004-03-25 2005-10-06 Fuji Photo Film Co Ltd 導電性パターン材料、金属微粒子パターン材料及びパターン形成方法
JP2005347424A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 多層配線板及びその製造方法
WO2006075796A1 (en) * 2005-01-13 2006-07-20 Fujifilm Corporation Metal film and formation method of metal film
JP2006316296A (ja) * 2005-05-10 2006-11-24 Fuji Photo Film Co Ltd 金属膜形成方法、それを用いた金属パターン形成方法及び金属膜
WO2007052660A1 (ja) * 2005-11-07 2007-05-10 Fujifilm Corporation プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
JP2007154306A (ja) * 2005-11-14 2007-06-21 Fujifilm Corp 金属膜形成方法、金属膜形成用基板、金属膜、金属パターン形成方法、金属パターン形成用基板、金属パターン、及びポリマー層形成用組成物
JP2007197798A (ja) * 2006-01-27 2007-08-09 Taiyo Ink Mfg Ltd 無電解めっきプライマー用熱硬化性樹脂組成物及びそれを用いた無電解めっき処理方法
WO2007123022A1 (ja) 2006-04-18 2007-11-01 Fujifilm Corporation 金属パターン形成方法、金属パターン、及びプリント配線板
JP2007283808A (ja) * 2006-04-13 2007-11-01 Toyota Industries Corp 車両用シート転回装置
JP2008103622A (ja) * 2006-10-20 2008-05-01 Fujifilm Corp プリント配線板作製用積層体及びそれを用いたプリント配線板の作製方法
WO2008050715A1 (en) * 2006-10-23 2008-05-02 Fujifilm Corporation Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product
US7438950B2 (en) 2004-06-01 2008-10-21 Fujifilm Corporation Metallic pattern forming method and conductive pattern material
WO2008126426A1 (ja) 2007-03-30 2008-10-23 Fujifilm Corporation 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法
JP2009007662A (ja) * 2006-10-23 2009-01-15 Fujifilm Corp 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物
EP1580595A3 (en) * 2004-03-26 2009-05-06 FUJIFILM Corporation Pattern forming method, graft polymer-based pattern material, conductive pattern forming method and conductive pattern material
JP2010100671A (ja) * 2008-10-21 2010-05-06 Toyobo Co Ltd ポリイミドフィルム及びその製造方法
US8187664B2 (en) 2005-02-08 2012-05-29 Fujifilm Corporation Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same
US8202576B2 (en) 2008-09-30 2012-06-19 Fujifilm Corporation Method of forming metal film
JP2015527428A (ja) * 2012-06-29 2015-09-17 ポリマーズ シーアールシー リミテッドＰｏｌｙｍｅｒｓ ＣＲＣ Ｌｔｄ． ポリマー表面を改質する方法
JP2016180025A (ja) * 2015-03-23 2016-10-13 倉敷紡績株式会社 表面親水化基材の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100668A (ja) * 1981-12-09 1983-06-15 Okuno Seiyaku Kogyo Kk 化学メツキ用組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100668A (ja) * 1981-12-09 1983-06-15 Okuno Seiyaku Kogyo Kk 化学メツキ用組成物

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5912942A (ja) * 1982-07-09 1984-01-23 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ポリエステル基板に金属層を付着させる方法
US5087524A (en) * 1988-09-22 1992-02-11 Mobay Corporation Article molded from a polycarbonate composition having improved platability
FR2699927A1 (fr) * 1992-12-30 1994-07-01 Hispano Suiza Sa Procédé d'assemblage d'une première pièce en matériau composite réalisé en un polymère du type polyamide ou polyimide avec une deuxième pièce grâce à un adhésif approprié.
JPH09214140A (ja) * 1995-11-29 1997-08-15 Toppan Printing Co Ltd 多層プリント配線板及びその製造方法
US5718981A (en) * 1996-02-02 1998-02-17 Eastman Kodak Company Polyester photographic film support
US6783895B2 (en) * 2000-02-21 2004-08-31 Mitsubishi Materials Corporation Collector for alkaline secondary battery, method for making the same, and alkaline secondary battery using the same
EP1331285A3 (en) * 2002-01-25 2004-06-09 Fuji Photo Film Co., Ltd. Thin-layer metal film
WO2005090454A1 (en) * 2004-03-24 2005-09-29 Fuji Photo Film Co., Ltd. Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material
US7739789B2 (en) 2004-03-24 2010-06-22 Fujifilm Corporation Method for forming surface graft, conductive film and metal patterns
KR100796248B1 (ko) * 2004-03-24 2008-01-21 후지필름 가부시키가이샤 표면 그래프트 형성 방법, 도전성막 형성 방법, 금속 패턴형성 방법, 다층 배선판 형성 방법, 표면 그래프트 재료,및 도전성 재료
JP2005272961A (ja) * 2004-03-25 2005-10-06 Fuji Photo Film Co Ltd 導電性パターン材料、金属微粒子パターン材料及びパターン形成方法
EP1580595A3 (en) * 2004-03-26 2009-05-06 FUJIFILM Corporation Pattern forming method, graft polymer-based pattern material, conductive pattern forming method and conductive pattern material
US7879535B2 (en) 2004-03-26 2011-02-01 Fujifilm Corporation Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material
JP2005347424A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 多層配線板及びその製造方法
US7438950B2 (en) 2004-06-01 2008-10-21 Fujifilm Corporation Metallic pattern forming method and conductive pattern material
WO2006075796A1 (en) * 2005-01-13 2006-07-20 Fujifilm Corporation Metal film and formation method of metal film
JP2006193780A (ja) * 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 金属膜及び金属膜の形成方法
US8187664B2 (en) 2005-02-08 2012-05-29 Fujifilm Corporation Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same
JP2006316296A (ja) * 2005-05-10 2006-11-24 Fuji Photo Film Co Ltd 金属膜形成方法、それを用いた金属パターン形成方法及び金属膜
JP2007125862A (ja) * 2005-11-07 2007-05-24 Fujifilm Corp プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
WO2007052660A1 (ja) * 2005-11-07 2007-05-10 Fujifilm Corporation プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
JP2007154306A (ja) * 2005-11-14 2007-06-21 Fujifilm Corp 金属膜形成方法、金属膜形成用基板、金属膜、金属パターン形成方法、金属パターン形成用基板、金属パターン、及びポリマー層形成用組成物
JP2007197798A (ja) * 2006-01-27 2007-08-09 Taiyo Ink Mfg Ltd 無電解めっきプライマー用熱硬化性樹脂組成物及びそれを用いた無電解めっき処理方法
JP2007283808A (ja) * 2006-04-13 2007-11-01 Toyota Industries Corp 車両用シート転回装置
US20090277672A1 (en) * 2006-04-18 2009-11-12 Fujifilm Corporation Method for forming metal pattern, metal pattern and printed wiring board
US8261438B2 (en) 2006-04-18 2012-09-11 Fujifilm Corporation Method for forming metal pattern, metal pattern and printed wiring board
WO2007123022A1 (ja) 2006-04-18 2007-11-01 Fujifilm Corporation 金属パターン形成方法、金属パターン、及びプリント配線板
JP2008103622A (ja) * 2006-10-20 2008-05-01 Fujifilm Corp プリント配線板作製用積層体及びそれを用いたプリント配線板の作製方法
JP2009007662A (ja) * 2006-10-23 2009-01-15 Fujifilm Corp 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物
WO2008050715A1 (en) * 2006-10-23 2008-05-02 Fujifilm Corporation Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product
US8084564B2 (en) 2006-10-23 2011-12-27 Fujifilm Corporation Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate
WO2008126426A1 (ja) 2007-03-30 2008-10-23 Fujifilm Corporation 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法
US8076264B2 (en) 2007-03-30 2011-12-13 Fujifilm Corporation Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, metal layer-coated resin film using the same, and method for producing metal layer-coated resin film
US8202576B2 (en) 2008-09-30 2012-06-19 Fujifilm Corporation Method of forming metal film
JP2010100671A (ja) * 2008-10-21 2010-05-06 Toyobo Co Ltd ポリイミドフィルム及びその製造方法
JP2015527428A (ja) * 2012-06-29 2015-09-17 ポリマーズ シーアールシー リミテッドＰｏｌｙｍｅｒｓ ＣＲＣ Ｌｔｄ． ポリマー表面を改質する方法
JP2016180025A (ja) * 2015-03-23 2016-10-13 倉敷紡績株式会社 表面親水化基材の製造方法

Also Published As

Publication number Publication date
JPH036225B2 (enrdf_load_html_response) 1991-01-29

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