JPS58194363A - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS58194363A
JPS58194363A JP7543882A JP7543882A JPS58194363A JP S58194363 A JPS58194363 A JP S58194363A JP 7543882 A JP7543882 A JP 7543882A JP 7543882 A JP7543882 A JP 7543882A JP S58194363 A JPS58194363 A JP S58194363A
Authority
JP
Japan
Prior art keywords
circuits
power supply
input
output
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7543882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416945B2 (US06486227-20021126-C00005.png
Inventor
Yoji Nishio
洋二 西尾
Shigeo Kuboki
茂雄 久保木
Ikuro Masuda
郁朗 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7543882A priority Critical patent/JPS58194363A/ja
Publication of JPS58194363A publication Critical patent/JPS58194363A/ja
Publication of JPH0416945B2 publication Critical patent/JPH0416945B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP7543882A 1982-05-07 1982-05-07 半導体集積回路装置 Granted JPS58194363A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7543882A JPS58194363A (ja) 1982-05-07 1982-05-07 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7543882A JPS58194363A (ja) 1982-05-07 1982-05-07 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS58194363A true JPS58194363A (ja) 1983-11-12
JPH0416945B2 JPH0416945B2 (US06486227-20021126-C00005.png) 1992-03-25

Family

ID=13576233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7543882A Granted JPS58194363A (ja) 1982-05-07 1982-05-07 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS58194363A (US06486227-20021126-C00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169464A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 半導体集積回路装置
JPH08236590A (ja) * 1995-02-22 1996-09-13 Nec Corp 半導体集積回路

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (US06486227-20021126-C00005.png) * 1972-09-18 1974-05-17
JPS52119802A (en) * 1976-04-01 1977-10-07 Matsushita Electronics Corp Semiconductor ic device
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (US06486227-20021126-C00005.png) * 1972-09-18 1974-05-17
JPS52119802A (en) * 1976-04-01 1977-10-07 Matsushita Electronics Corp Semiconductor ic device
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169464A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 半導体集積回路装置
JPH08236590A (ja) * 1995-02-22 1996-09-13 Nec Corp 半導体集積回路

Also Published As

Publication number Publication date
JPH0416945B2 (US06486227-20021126-C00005.png) 1992-03-25

Similar Documents

Publication Publication Date Title
US5077595A (en) Semiconductor device
CA1257342A (en) Integrated logic circuit incorporating a module which generates a control signal that cancels switching noise
US7136269B2 (en) Inverted circuit overcurrent protection device and hybrid integrated circuit device with the same incorporated
US6828842B2 (en) Semiconductor integrated circuit device
JPH08304515A (ja) パッケージ状態で直流電圧テスト可能な半導体メモリ装置
JP3505558B2 (ja) 漏電遮断器
JPH08148650A (ja) 半導体集積回路装置
JPS58194363A (ja) 半導体集積回路装置
JP3913603B2 (ja) 過電流保護回路を組み込んだ混成集積回路装置
US6239998B1 (en) Inverter circuit
JP2917703B2 (ja) 半導体集積回路装置
JP3191743B2 (ja) 機能変更可能な半導体装置
JPH048949B2 (US06486227-20021126-C00005.png)
JP2937619B2 (ja) 半導体集積回路装置
JPS6085625A (ja) デジタル−アナログ変換回路配置
JP2005159111A (ja) マルチチップ型半導体装置
JPS61284953A (ja) 半導体集積回路装置
JPH04336812A (ja) デジタル回路装置
JPH08288460A (ja) 半導体装置の外部制御可能なボンディング方法
JPS60154644A (ja) 半導体装置
JPH07503357A (ja) 信号発生器から電圧供給するための装置
JPS62265809A (ja) 基準電圧発生回路
JP2715593B2 (ja) 半導体集積回路
JP2872079B2 (ja) 半導体装置
JPS594234A (ja) 半導体集積回路装置