JPS58190092A - フレキシブル配線基板の製造法 - Google Patents

フレキシブル配線基板の製造法

Info

Publication number
JPS58190092A
JPS58190092A JP7154782A JP7154782A JPS58190092A JP S58190092 A JPS58190092 A JP S58190092A JP 7154782 A JP7154782 A JP 7154782A JP 7154782 A JP7154782 A JP 7154782A JP S58190092 A JPS58190092 A JP S58190092A
Authority
JP
Japan
Prior art keywords
polyimide
flexible wiring
solvent
aromatic
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7154782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS645476B2 (enrdf_load_stackoverflow
Inventor
稲池　稔弘
牛見　勝彦
修二 山本
俊宏 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP7154782A priority Critical patent/JPS58190092A/ja
Publication of JPS58190092A publication Critical patent/JPS58190092A/ja
Publication of JPS645476B2 publication Critical patent/JPS645476B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
JP7154782A 1982-04-30 1982-04-30 フレキシブル配線基板の製造法 Granted JPS58190092A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7154782A JPS58190092A (ja) 1982-04-30 1982-04-30 フレキシブル配線基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7154782A JPS58190092A (ja) 1982-04-30 1982-04-30 フレキシブル配線基板の製造法

Publications (2)

Publication Number Publication Date
JPS58190092A true JPS58190092A (ja) 1983-11-05
JPS645476B2 JPS645476B2 (enrdf_load_stackoverflow) 1989-01-30

Family

ID=13463866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7154782A Granted JPS58190092A (ja) 1982-04-30 1982-04-30 フレキシブル配線基板の製造法

Country Status (1)

Country Link
JP (1) JPS58190092A (enrdf_load_stackoverflow)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
JPS6119352A (ja) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー 可撓性多層ラミネート及びその製法
JPS61245868A (ja) * 1985-04-24 1986-11-01 Hitachi Chem Co Ltd フレキシブルプリント基板の製造法
WO1987002620A1 (en) 1985-10-31 1987-05-07 Mitsui Toatsu Chemicals, Incorporated Flexible printed circuit board and process for its production
JPS62208690A (ja) * 1985-10-31 1987-09-12 三井東圧化学株式会社 フレキシブルプリント回路基板及びその製法
JPS62242391A (ja) * 1986-04-14 1987-10-22 旭化成株式会社 フレキシブル配線板の製造方法
JPS62242392A (ja) * 1986-04-14 1987-10-22 旭化成株式会社 フレキシブル配線板の製造方法
WO1988000428A1 (en) * 1986-06-30 1988-01-14 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit board
JPS6448492A (en) * 1987-08-19 1989-02-22 Sumitomo Electric Industries Manufacture of flexible printed wiring board
JPH01245587A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板の製造法
US4883718A (en) * 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
US5087689A (en) * 1985-08-27 1992-02-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines
US5167985A (en) * 1989-11-17 1992-12-01 Kanegafuchi Kagaku Kogyo K.K. Process for producing flexible printed circuit board
US5278276A (en) * 1985-08-27 1994-01-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and high-temperature adhesive of polyimide
JPH0774443A (ja) * 1994-07-06 1995-03-17 Mitsui Toatsu Chem Inc フレキシブル銅張回路基板
JP2001316579A (ja) * 2000-05-08 2001-11-16 Teijin Ltd ポリアリレート／ポリイミド組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52146489A (en) * 1976-05-31 1977-12-06 Mitsubishi Rayon Co Ltd Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof
JPS5516489A (en) * 1978-07-24 1980-02-05 Nippon Telegr & Teleph Corp <Ntt> Semiconductor resistance device
JPS56118204A (en) * 1980-02-25 1981-09-17 Ube Industries Polyimide insulating member
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52146489A (en) * 1976-05-31 1977-12-06 Mitsubishi Rayon Co Ltd Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof
JPS5516489A (en) * 1978-07-24 1980-02-05 Nippon Telegr & Teleph Corp <Ntt> Semiconductor resistance device
JPS56118204A (en) * 1980-02-25 1981-09-17 Ube Industries Polyimide insulating member
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
JPS6119352A (ja) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー 可撓性多層ラミネート及びその製法
US4883718A (en) * 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
JPS61245868A (ja) * 1985-04-24 1986-11-01 Hitachi Chem Co Ltd フレキシブルプリント基板の製造法
US5278276A (en) * 1985-08-27 1994-01-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and high-temperature adhesive of polyimide
US5205894A (en) * 1985-08-27 1993-04-27 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide
US5087689A (en) * 1985-08-27 1992-02-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines
JPS62208690A (ja) * 1985-10-31 1987-09-12 三井東圧化学株式会社 フレキシブルプリント回路基板及びその製法
US4839232A (en) * 1985-10-31 1989-06-13 Mitsui Toatsu Chemicals, Incorporated Flexible laminate printed-circuit board and methods of making same
WO1987002620A1 (en) 1985-10-31 1987-05-07 Mitsui Toatsu Chemicals, Incorporated Flexible printed circuit board and process for its production
JPS62242392A (ja) * 1986-04-14 1987-10-22 旭化成株式会社 フレキシブル配線板の製造方法
JPS62242391A (ja) * 1986-04-14 1987-10-22 旭化成株式会社 フレキシブル配線板の製造方法
WO1988000428A1 (en) * 1986-06-30 1988-01-14 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit board
JPS6448492A (en) * 1987-08-19 1989-02-22 Sumitomo Electric Industries Manufacture of flexible printed wiring board
JPH01245587A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板の製造法
US5167985A (en) * 1989-11-17 1992-12-01 Kanegafuchi Kagaku Kogyo K.K. Process for producing flexible printed circuit board
JPH0774443A (ja) * 1994-07-06 1995-03-17 Mitsui Toatsu Chem Inc フレキシブル銅張回路基板
JP2001316579A (ja) * 2000-05-08 2001-11-16 Teijin Ltd ポリアリレート／ポリイミド組成物

Also Published As

Publication number Publication date
JPS645476B2 (enrdf_load_stackoverflow) 1989-01-30

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