JPS52146489A - Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof - Google Patents

Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof

Info

Publication number
JPS52146489A
JPS52146489A JP6317976A JP6317976A JPS52146489A JP S52146489 A JPS52146489 A JP S52146489A JP 6317976 A JP6317976 A JP 6317976A JP 6317976 A JP6317976 A JP 6317976A JP S52146489 A JPS52146489 A JP S52146489A
Authority
JP
Japan
Prior art keywords
copolyimide
laminated
flexible
preparation
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6317976A
Other languages
Japanese (ja)
Inventor
Koji Takahashi
Mitsuhide Kotake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP6317976A priority Critical patent/JPS52146489A/en
Publication of JPS52146489A publication Critical patent/JPS52146489A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE: Title sheet composed of a copper foil, inorganic fibers, and soluble aromatic polyimide having excellent heat resistance, flame resistance, adhesivity with the copper foil, break-down voltage, and temperature characteristics of dielectric properties, prepared by a stable and highly productive process.
COPYRIGHT: (C)1977,JPO&Japio
JP6317976A 1976-05-31 1976-05-31 Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof Pending JPS52146489A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6317976A JPS52146489A (en) 1976-05-31 1976-05-31 Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6317976A JPS52146489A (en) 1976-05-31 1976-05-31 Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof

Publications (1)

Publication Number Publication Date
JPS52146489A true JPS52146489A (en) 1977-12-06

Family

ID=13221749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6317976A Pending JPS52146489A (en) 1976-05-31 1976-05-31 Laminated copolyimide composite sheet for flexible or rigid printed circuit board and preparation thereof

Country Status (1)

Country Link
JP (1) JPS52146489A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190092A (en) * 1982-04-30 1983-11-05 宇部興産株式会社 Method of producing flexible circuit board
JPS59158578A (en) * 1983-02-26 1984-09-08 日本メクトロン株式会社 Flexible circuit board sheet material
US5288542A (en) * 1992-07-14 1994-02-22 International Business Machines Corporation Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190092A (en) * 1982-04-30 1983-11-05 宇部興産株式会社 Method of producing flexible circuit board
JPS59158578A (en) * 1983-02-26 1984-09-08 日本メクトロン株式会社 Flexible circuit board sheet material
US5288542A (en) * 1992-07-14 1994-02-22 International Business Machines Corporation Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
US5378306A (en) * 1992-07-14 1995-01-03 International Business Machines Corporation Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof

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