JPS5474883A - Preparation of copper-clad laminate - Google Patents

Preparation of copper-clad laminate

Info

Publication number
JPS5474883A
JPS5474883A JP14215577A JP14215577A JPS5474883A JP S5474883 A JPS5474883 A JP S5474883A JP 14215577 A JP14215577 A JP 14215577A JP 14215577 A JP14215577 A JP 14215577A JP S5474883 A JPS5474883 A JP S5474883A
Authority
JP
Japan
Prior art keywords
modified
copper foil
polybutadiene
copper
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14215577A
Other languages
Japanese (ja)
Inventor
Norio Saruwatari
Katsura Adachi
Takenori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14215577A priority Critical patent/JPS5474883A/en
Publication of JPS5474883A publication Critical patent/JPS5474883A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To prepare a copper-clad laminate having high heat resistance and adhesivity of copper foil, by laminating a prepreg sheet with a copper foil coated with a maleic acid-modified or epoxy-modified 1,2-polybutadiene.
CONSTITUTION: A prepreg sheet obtained by impregnating a sheet substrate such as glass cloth, non-woven mat of synthetic fiber, etc., with a thermosetting resin, is laminated with a copper foil coated with a maleic acid-modified 1,2-polybutadiene having a number average molecular weight of 1000W3000 or an epoxy-modified 1,2-polybutadiene having a number average molecular weight of 1000W2000 in a thickness of 5W100μ, and pressed under proper temperature and pressure.
EFFECT: The peeling strength of the copper foil is remarkably improved while keeping the original dielectric properties of the base.
USE: Printed circuit board for electronic apparatus.
COPYRIGHT: (C)1979,JPO&Japio
JP14215577A 1977-11-29 1977-11-29 Preparation of copper-clad laminate Pending JPS5474883A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14215577A JPS5474883A (en) 1977-11-29 1977-11-29 Preparation of copper-clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14215577A JPS5474883A (en) 1977-11-29 1977-11-29 Preparation of copper-clad laminate

Publications (1)

Publication Number Publication Date
JPS5474883A true JPS5474883A (en) 1979-06-15

Family

ID=15308632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14215577A Pending JPS5474883A (en) 1977-11-29 1977-11-29 Preparation of copper-clad laminate

Country Status (1)

Country Link
JP (1) JPS5474883A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007021763A (en) * 2005-07-12 2007-02-01 Hitachi Chem Co Ltd Metal foil with adhesive layer and metal clad laminated sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007021763A (en) * 2005-07-12 2007-02-01 Hitachi Chem Co Ltd Metal foil with adhesive layer and metal clad laminated sheet

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