JPS54125283A - Manufacturing of flexible printed circuit board - Google Patents

Manufacturing of flexible printed circuit board

Info

Publication number
JPS54125283A
JPS54125283A JP3343778A JP3343778A JPS54125283A JP S54125283 A JPS54125283 A JP S54125283A JP 3343778 A JP3343778 A JP 3343778A JP 3343778 A JP3343778 A JP 3343778A JP S54125283 A JPS54125283 A JP S54125283A
Authority
JP
Japan
Prior art keywords
circuit board
flexible printed
printed circuit
metal foil
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3343778A
Other languages
Japanese (ja)
Inventor
Masaji Iwashita
Hiroshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP3343778A priority Critical patent/JPS54125283A/en
Publication of JPS54125283A publication Critical patent/JPS54125283A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To manufacture a flexible printed circuit board having excellent circuit processability, by laminating a metal foil to an insulating plastic sheet with an adhesive, and heating and curing the laminate in an atmosphere which is less oxidative than air.
CONSTITUTION: A metal foil is continuously laminated to an insulating plastic sheet with an adhesive by passing through a pair of hot rolls, and cured by heating in an atmosphere which is less oxidative than air, e.g. in vacuum (102 W 10-1 mmHg) or in an inert gas atmosphere.
EFFECT: Suppressed rusting of metal foil: Improved circuit printability and accuracy.
COPYRIGHT: (C)1979,JPO&Japio
JP3343778A 1978-03-23 1978-03-23 Manufacturing of flexible printed circuit board Pending JPS54125283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3343778A JPS54125283A (en) 1978-03-23 1978-03-23 Manufacturing of flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3343778A JPS54125283A (en) 1978-03-23 1978-03-23 Manufacturing of flexible printed circuit board

Publications (1)

Publication Number Publication Date
JPS54125283A true JPS54125283A (en) 1979-09-28

Family

ID=12386503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3343778A Pending JPS54125283A (en) 1978-03-23 1978-03-23 Manufacturing of flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS54125283A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710294A (en) * 1980-06-23 1982-01-19 Furukawa Electric Co Ltd Method of producing flexible printed circuit board
JPS58118238A (en) * 1981-12-30 1983-07-14 日本メクトロン株式会社 Manufacture of flexible copper lined laminated board
JPS6070791A (en) * 1983-09-27 1985-04-22 東芝ケミカル株式会社 Method of producing copper-lined laminated board
JPS60182793A (en) * 1984-02-29 1985-09-18 東芝ケミカル株式会社 Method of producing substrate for flexible printed circuit
US4959116A (en) * 1988-03-24 1990-09-25 Alps Electric Co., Ltd. Production of metal base laminate plate including applying an insulator film by powder coating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52138668A (en) * 1975-11-14 1977-11-18 Matsushita Electric Works Ltd Method of producing multilayer printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52138668A (en) * 1975-11-14 1977-11-18 Matsushita Electric Works Ltd Method of producing multilayer printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710294A (en) * 1980-06-23 1982-01-19 Furukawa Electric Co Ltd Method of producing flexible printed circuit board
JPS6225090B2 (en) * 1980-06-23 1987-06-01 Furukawa Electric Co Ltd
JPS58118238A (en) * 1981-12-30 1983-07-14 日本メクトロン株式会社 Manufacture of flexible copper lined laminated board
JPS6070791A (en) * 1983-09-27 1985-04-22 東芝ケミカル株式会社 Method of producing copper-lined laminated board
JPS60182793A (en) * 1984-02-29 1985-09-18 東芝ケミカル株式会社 Method of producing substrate for flexible printed circuit
US4959116A (en) * 1988-03-24 1990-09-25 Alps Electric Co., Ltd. Production of metal base laminate plate including applying an insulator film by powder coating

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