JPH0673943B2 - Laminate - Google Patents
LaminateInfo
- Publication number
- JPH0673943B2 JPH0673943B2 JP61138985A JP13898586A JPH0673943B2 JP H0673943 B2 JPH0673943 B2 JP H0673943B2 JP 61138985 A JP61138985 A JP 61138985A JP 13898586 A JP13898586 A JP 13898586A JP H0673943 B2 JPH0673943 B2 JP H0673943B2
- Authority
- JP
- Japan
- Prior art keywords
- impregnated
- resin
- fluororesin fiber
- thermosetting resin
- resin varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Description
【発明の詳細な説明】 〔技術分野〕 本発明はプリント配線板用の積層板に関する。Description: TECHNICAL FIELD The present invention relates to a laminated board for a printed wiring board.
従来より、ガラス布基材にエポキシ樹脂あるいはポリイ
ミド樹脂を含浸させ乾燥させて形成した樹脂含浸ガラス
布を積層成形してプリント配線板用の積層板が製造され
ているが、この積層板の誘電率はガラス／エポキシ系の
樹脂含浸基材を採用した場合には4.5で、ガラス／ポリ
イミド系で4.0と比較的大きく、従って、プリント配線
板として使用した場合には、高周波に対する特性が不充
分で、高周波クロックを用いた高周波演算回路の実装と
か、通信機器回路の実装には制約を受けていた。Conventionally, a resin-impregnated glass cloth formed by impregnating a glass cloth base material with an epoxy resin or a polyimide resin and drying it is laminated to form a laminated board for a printed wiring board. Is 4.5 when glass / epoxy resin-impregnated base material is adopted, and relatively large at 4.0 when glass / polyimide resin is used. Therefore, when used as a printed wiring board, the characteristics for high frequencies are insufficient. The implementation of a high frequency arithmetic circuit using a high frequency clock and the implementation of a communication device circuit are restricted.
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、誘電率が小さく、高周波特性が良好
となり、プリント配線板として使用した場合に高周波演
算回路、通信機回路の実装が可能で絶縁特性に優れ、し
かも耐熱性及び耐スミア性に優れる積層板を提供するこ
とにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a high-frequency arithmetic circuit and a communication device circuit when used as a printed wiring board because the dielectric constant is small and the high-frequency characteristics are good. It is possible to provide a laminated plate having excellent heat resistance and smear resistance, which has excellent insulation properties.
〔発明の開示〕 本発明の積層板は、ガラス布に樹脂ワニスを含浸して乾
燥させて形成した樹脂含浸ガラス布１を複数枚積み重
ね、この積層体２の両面にフッ素樹脂繊維布に熱硬化性
樹脂ワニスを含浸して乾燥させて形成した熱硬化性樹脂
含浸フッ素樹脂繊維布３を複数枚積層して成るものであ
り、この構成により上記目的を達成できたものである。DISCLOSURE OF THE INVENTION In the laminated plate of the present invention, a plurality of resin-impregnated glass cloths 1 formed by impregnating a glass cloth with a resin varnish and drying are stacked, and a fluororesin fiber cloth is thermoset on both surfaces of this laminated body 2. The thermosetting resin-impregnated fluororesin fiber cloth 3 formed by impregnating a resinous resin varnish and drying is laminated, and the above object can be achieved by this constitution.
以下本発明を添付の図面を参照して詳細に説明する。樹
脂含浸ガラス布１は従来から周知のものであり、ガラス
布にエポキシ樹脂とかポリイミド樹脂を含浸して乾燥さ
せて形成されている。本発明におけるフッ素樹脂繊維布
を形成しているフッ素樹脂としては、三フッ化塩化エチ
レン樹脂（融点210〜212℃）、四フッ化エチレン（融点
327℃）、四フッ化エチレン−六フッ化プロピレン共重
合体樹脂（融点270℃）、四フッ化エチレン−パーフル
オロビニルエーテル共重合体樹脂（融点302〜310℃）な
どのような融点が200℃以上のものが好ましい。熱硬化
性樹脂含浸フッ素樹脂繊維布３はこのフッ素樹脂繊維布
にフェノール樹脂、不飽和ポリエステル樹脂、ポリイミ
ド樹脂、エポキシ樹脂等の熱硬化性樹脂ワニスを含浸さ
せ、乾燥させて形成される。この場合、絶縁性に優れ、
誘電率の小さいポリイミド樹脂ワニス、又はエポキシ樹
脂ワニスを採用するのが好ましい。本発明の積層板Ａ
は、樹脂含浸ガラス布１を複数枚積み重ねた積層体２の
両面に熱硬化性樹脂含浸フッ素樹脂繊維布３を複数枚積
み重ねて配置し、このものを一組みとして成形プレート
を介して複数組み熱盤間に配置し、200℃以上、20〜150
kg/cm2、40〜100分で加熱加圧して積層一体化させて得
られる。この場合、その最上面及び／又は最下面に金属
箔４を配置しておいて金属箔４を貼着させて金属箔張り
積層板としてもよい。金属箔４としては銅箔、アルミニ
ウム箔、真ちゅう箔、鉄箔、ステンレス鋼箔、ニッケル
箔、ケイ素鋼箔などいずれをも採用できる。又、フッ素
樹脂繊維布は接着性が低いので、フッ素樹脂表面処理
剤、たとえばテトラエッチ（商品名、株式会社潤工社
製）により表面を粗化させて接着性を高め、熱硬化性樹
脂含浸フッ素樹脂繊維布３間にエポキシ樹脂接着剤など
を介在させて接着力を確保しておいてもよい。Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The resin-impregnated glass cloth 1 is conventionally well known, and is formed by impregnating a glass cloth with an epoxy resin or a polyimide resin and drying it. The fluororesin forming the fluororesin fiber cloth in the present invention includes trifluoroethylene chloride resin (melting point 210 to 212 ° C.), tetrafluoroethylene (melting point).
327 ° C), tetrafluoroethylene-hexafluoropropylene copolymer resin (melting point 270 ° C), tetrafluoroethylene-perfluorovinyl ether copolymer resin (melting point 302-310 ° C), etc. The above is preferable. The thermosetting resin-impregnated fluororesin fiber cloth 3 is formed by impregnating this fluororesin fiber cloth with a thermosetting resin varnish such as a phenol resin, an unsaturated polyester resin, a polyimide resin, or an epoxy resin, and drying. In this case, excellent insulation,
It is preferable to use a polyimide resin varnish or an epoxy resin varnish having a small dielectric constant. Laminate A of the present invention
Is a laminated body 2 in which a plurality of resin-impregnated glass cloths 1 are stacked, and a plurality of thermosetting resin-impregnated fluororesin fiber cloths 3 are stacked and arranged on both surfaces. Placed between panels, 200 ℃ or higher, 20-150
It is obtained by heating and pressurizing at kg / cm 2 for 40 to 100 minutes to laminate and integrate. In this case, the metal foil 4 may be arranged on the uppermost surface and / or the lowermost surface and the metal foil 4 may be adhered to form a metal foil-clad laminate. As the metal foil 4, any of copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil and the like can be adopted. Further, since the fluororesin fiber cloth has low adhesiveness, the surface is roughened with a fluororesin surface treatment agent such as Tetra Etch (trade name, manufactured by Junkosha Co., Ltd.) to enhance the adhesiveness, and the thermosetting resin-impregnated fluororesin is used. The adhesive force may be secured by interposing an epoxy resin adhesive or the like between the fiber cloths 3.
次に、本発明の実施例を具体的に説明する。Next, examples of the present invention will be specifically described.
（実施例１） フッ素樹脂繊維布に固形分40〜80重量％のポリイミド樹
脂ワニス（ケルイミド601）を含浸させ、150〜200℃で
乾燥させて熱硬化性樹脂含浸フッ素樹脂繊維布を製造し
た。フッ素樹脂とポリイミドの容積比は1:1であった。
この熱硬化性樹脂含浸フッ素樹脂繊維布を、ガラス布に
ポリイミド樹脂を含浸させ乾燥させて製造した５枚の樹
脂含浸ガラス布の両面に２枚積み重ね、その最上面及び
最下面にそれぞれ18μ厚の銅箔を配置し、このものを一
組として熱盤間に複数組み配置して加熱加圧成形して銅
箔張り積層板Ａを形成した。加熱加圧条件は、200℃、3
0kg/cm2、120分であった。キュアリングの後、誘電率を
測定した（JSI C 6481による）。誘電率は3.4であっ
た。(Example 1) A fluororesin fiber cloth was impregnated with a polyimide resin varnish (Kelimide 601) having a solid content of 40 to 80% by weight and dried at 150 to 200 ° C to produce a thermosetting resin-impregnated fluororesin fiber cloth. The volume ratio of the fluororesin to the polyimide was 1: 1.
Two pieces of this thermosetting resin-impregnated fluororesin fiber cloth were stacked on both sides of five resin-impregnated glass cloths made by impregnating glass cloth with polyimide resin and drying, and each of the top and bottom surfaces had a thickness of 18μ. Copper foils were arranged, and a plurality of copper foils were arranged between the hot plates as one set and heat-pressed to form a copper foil-clad laminate A. Heating and pressurizing conditions are 200 ℃, 3
It was 0 kg / cm 2 and 120 minutes. After curing, the dielectric constant was measured (according to JSI C 6481). The dielectric constant was 3.4.
（実施例２） フッ素樹脂繊維布にエポキシ樹脂ワニスを含浸させ、15
0〜200℃で乾燥させて熱硬化性樹脂含浸フッ素樹脂繊維
布を製造し、170℃で加熱加圧成形した以外は実施例１
と同様にして銅箔張り積層板Ａを製造した。この積層板
の誘電率は3.6であった。(Example 2) A fluororesin fiber cloth was impregnated with an epoxy resin varnish, and
Example 1 except that a thermosetting resin-impregnated fluororesin fiber cloth was produced by drying at 0 to 200 ° C. and heat-pressed at 170 ° C.
A copper foil-clad laminate A was manufactured in the same manner as in. The dielectric constant of this laminate was 3.6.
本発明にあっては、ガラス布に樹脂ワニスを含浸して乾
燥させて形成した樹脂含浸ガラス布を複数枚積層し、こ
の積層体の両面にフッ素樹脂繊維布に熱硬化性樹脂ワニ
スを含浸して乾燥させて形成した熱硬化性樹脂含浸フッ
素樹脂繊維布を複数枚積層しているので、誘電率が小さ
く、高周波特性が良好となり、プリント配線板として使
用した場合に高周波クロックを用いた高周波演算回路、
通信機回路の実装が可能となるものであり、しかも熱可
塑性であるフッ素樹脂繊維布に熱硬化性樹脂ワニスを含
浸して乾燥させて熱硬化性樹脂含浸フッ素樹脂繊維布を
形成しているので、耐熱性及び耐スミア性に優れるもの
である。In the present invention, a plurality of resin-impregnated glass cloths formed by impregnating a glass cloth with a resin varnish and drying are laminated, and a fluororesin fiber cloth is impregnated with a thermosetting resin varnish on both surfaces of this laminated body. Since multiple thermosetting resin-impregnated fluororesin fiber cloths that have been dried and formed are laminated, the dielectric constant is small and the high-frequency characteristics are good. When used as a printed wiring board, high-frequency operation using a high-frequency clock is performed. circuit,
It is possible to mount a communication device circuit, and since the fluororesin fiber cloth that is thermoplastic is impregnated with the thermosetting resin varnish and dried, the thermosetting resin-impregnated fluororesin fiber cloth is formed. It has excellent heat resistance and smear resistance.
第１図は本発明の一実施例を示す概略分解断面図であっ
て、Ａは積層板、１は樹脂含浸ガラス布、２は積層体、
３は熱硬化性樹脂含浸フッ素樹脂繊維布、４は金属箔で
ある。FIG. 1 is a schematic exploded sectional view showing an embodiment of the present invention, in which A is a laminated plate, 1 is a resin-impregnated glass cloth, 2 is a laminated body,
Reference numeral 3 is a thermosetting resin-impregnated fluororesin fiber cloth, and 4 is a metal foil.
フロントページの続き (72)発明者 平川 勝利 大阪府門真市大字門真1048番地 松下電工 株式会社内 (56)参考文献 特開 昭60−235844（ＪＰ，Ａ)Front Page Continuation (72) Inventor Satoshi Hirakawa 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) Reference JP-A-60-235844 (JP, A)
Claims (2)
て形成した樹脂含浸ガラス布を複数枚積層し、この積層
体の両面にフッ素樹脂繊維布に熱硬化性樹脂ワニスを含
浸して乾燥させて形成した熱硬化性樹脂含浸フッ素樹脂
繊維布を複数枚積層して成ることを特徴とする積層板。1. A plurality of resin-impregnated glass cloths, which are formed by impregnating a glass cloth with a resin varnish and drying the same, and impregnating a fluororesin fiber cloth with a thermosetting resin varnish on both surfaces of the laminated body to dry. A laminated board comprising a plurality of thermosetting resin-impregnated fluororesin fiber cloths laminated together.
ス又はエポキシ樹脂ワニスであることを特徴とする特許
請求の範囲第１項記載の積層板。2. The laminate according to claim 1, wherein the thermosetting resin varnish is a polyimide resin varnish or an epoxy resin varnish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61138985A JPH0673943B2 (en) | 1986-06-14 | 1986-06-14 | Laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61138985A JPH0673943B2 (en) | 1986-06-14 | 1986-06-14 | Laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62294546A JPS62294546A (en) | 1987-12-22 |
| JPH0673943B2 true JPH0673943B2 (en) | 1994-09-21 |
Family
ID=15234783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61138985A Expired - Fee Related JPH0673943B2 (en) | 1986-06-14 | 1986-06-14 | Laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0673943B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2900400B2 (en) * | 1988-04-30 | 1999-06-02 | ダイキン工業株式会社 | Composite sheet and laminate |
| JPH0716089B2 (en) * | 1989-08-25 | 1995-02-22 | 松下電工株式会社 | Electric laminate |
| US6488198B1 (en) | 1999-07-01 | 2002-12-03 | International Business Machines Corporation | Wire bonding method and apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60235844A (en) * | 1984-05-08 | 1985-11-22 | Hitachi Ltd | Prepreg sheet and laminate thereof |
-
1986
- 1986-06-14 JP JP61138985A patent/JPH0673943B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62294546A (en) | 1987-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |