JPS62294545A - Laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 3. Detailed description of the invention [Technical field] The present invention relates to a laminate for printed wiring boards.

[Background Art 1] Conventionally, laminates for printed wiring boards have been manufactured by laminating and molding epoxy 43 (fat or polyimide) on a glass cloth base material and drying it. However, the dielectric constant of this laminate is relatively large (3 for glass/epoxy type (4.5 when oil-impregnated material is used, and 4.0 for lath/polyimide type). Its characteristics against high frequencies were insufficient, and there were restrictions on the implementation of high-frequency arithmetic circuits using high-frequency clocks and communication equipment circuits.

[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to provide a low dielectric constant, good high frequency characteristics, and a high frequency arithmetic circuit when used as a printed wiring board or IA. The object of the present invention is to provide a laminated board with excellent insulation properties on which a communication device circuit can be mounted.

[Disclosure of the Invention] The laminate of the present invention is formed by laminating and integrating a fluorine-containing fat-impregnated aromatic polyamide fiber cloth 1 with finger fins 2 on both sides. With this configuration, the above objectives were achieved.

The present invention will be described in detail below with reference to the accompanying drawings. ! I: Two explanations. Aromatic polyamide in the present invention! ;What is do l?
)-p-7x Nirentele 7y Ruamide LI! , Polyben X amide + hm)"j fj group polyamide fibers, polyshin-phenylene terre 7 talamide fibers.

For example, Kevler (product name, manufactured by DuPont), H
It is commercially available as omex (trade name, manufactured by DuPont). Aromatic polyamide AM fabric is a concept that includes nonwoven fabrics, and also includes fabrics blended with glass #a accent. This aromatic polyamide cloth was impregnated with Ifft 7 varnish and dried to form a 7-strand resin-impregnated aromatic polyamide fiber cloth 1. The fluorinated (fluorinated) fat film 2 is laminated and integrated on both sides of the fluorinated (fat-impregnated aromatic polyamide fiber cloth 1) to form the product R'J board A of the present invention.Fluorine i in the present invention:; Examples of fats include 27-fluorinated ethylene chloride resin (melting point 210-212°C), tetrafluoroethylene resin (Flli point 327°C), 47-fluorinated ethylene-67-propylene copolymer (J (fat) Melting point 270°C
), ethylene-perfluorovinyl ether copolymer resin (100°C to 310°C) and the like are preferred. The laminate l\ of the present invention is made by stacking several sheets of fluorine (k1 fat film 2) on both sides of the fat-impregnated aromatic polyamide fiber cloth 1, and then layering the aromatic polyamide on both sides or one side of the stack. Fiber cloths are stacked, and a 7-strand resin film is further layered on top of the 7-strand resin film, and a desired number of fluororesin-impregnated aromatic polyamide fiber fabrics, 7-strand resin films, and a stack of resin films are assembled together and passed through a molding plate. Place multiple sets between heating plates, 200°C or higher, 20-150kg/am
2. Obtained by heating and pressurizing for 40-100 minutes to integrate the layers.

In this case, the metal foil 3 is arranged on the uppermost surface and/or the lowermost surface of the stacked claw body, and the metal foil 3 is attached to the gold 174 layer.
It may also be a 5-layer laminate. Metal foil 3 is W4 foil, aluminum foil, brass foil, iron foil, stainless steel W4
M, nickel foil, silicon tAm, etc. can be used. After attaching metal foil 3 to this laminate, a printed wiring board is manufactured by a conventional method.

Next, one specific embodiment of the present invention will be explained.

('y!, Example 1) Fluorine 8 (fat-impregnated aromatic 6-polyamide Ia cloth (K(!V
Three sheets of fluorine a (l1ff film (Teflon FEP-120. Mitsui DuPont 70 Rochemical Co., Ltd.) are stacked on both sides of the ICr$120), and fluorine film (fatty group 6 polyamide fiber cloth) is layered on the bottom surface of this stack. On top of that, three sheets of #77 cable (fi film) were layered, and copper foil with a thickness of 18μ was layered on the top and bottom surfaces. A copper foil-clad laminate A was formed by pressure forming.Heating and pressing conditions were 3°O°C.
It was 120 kg/cm2.60 minutes. After curing, the dielectric T-section was measured (according to JIS C6481)
However, it was 2.2.

(Example 2) A foil-covered laminate was produced in the same manner as in Example 1, except that a blend of aramid fiber cloth and lath fiber was used as the aromatic polyamide fiber cloth. The dielectric thickness was 2.3 It was J).

The dielectric loss tangent was also small in all of the examples.

['2 Light effect 1] In the present invention, 7-layer tA (I blind impregnated polyamide #λ, H [7) strands on both sides of the cloth are laminated and integrated. , conductivity +5 is small, high frequency characteristics are good, and when used as a printed wiring board, high frequency arithmetic circuits and communication device circuits using high frequency clocks can be mounted.

[Brief explanation of the drawing]

FIG. 1 is an exploded schematic cross-sectional view showing one embodiment of the present invention, where A is a laminate, 1 is a 7-strand +j (jll'?) impregnated aromatic polyamide fiber cloth, and 2 is a 7-strand laminate (oil). It's a film.

Claims (2)

[Claims] (1) A laminate made by laminating fluororesin films on both sides of a fluororesin-impregnated aromatic polyamide fiber cloth. (2) A laminate according to claim 1, characterized in that it is made by blending glass fiber with aromatic polyamide fiber cloth.