JPS62295930A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPS62295930A JPS62295930A JP13898686A JP13898686A JPS62295930A JP S62295930 A JPS62295930 A JP S62295930A JP 13898686 A JP13898686 A JP 13898686A JP 13898686 A JP13898686 A JP 13898686A JP S62295930 A JPS62295930 A JP S62295930A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated
- impregnated base
- fluororesin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000004744 fabric Substances 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000002966 varnish Substances 0.000 claims abstract description 14
- 229920001721 polyimide Polymers 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000000835 fiber Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 6
- 239000009719 polyimide resin Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000012756 surface treatment agent Substances 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 239000011888 foil Substances 0.000 abstract description 6
- 239000004642 Polyimide Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 4
- 229920006026 co-polymeric resin Polymers 0.000 abstract description 3
- 230000032798 delamination Effects 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 abstract 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 abstract 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- -1 ethylene trisulfate chloride Chemical compound 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 101150115304 cls-2 gene Proteins 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
［技術分野］
本発明はプリント配線板用の積層板の製造方法に関する
。Detailed Description of the Invention 3. Detailed Description of the Invention [Technical Field] The present invention relates to a method of manufacturing a laminate for a printed wiring board.
［背景技術］
従来より、〃ラス布基材にエポキシ樹脂あるいはポリイ
ミド樹脂を含浸させ乾燥させて形成した樹脂含浸基材を
積Ｒ成形してプリント配線板用の積層板が製造されてい
るが、この積層板の誘電率はガラス／エポキシ系の樹脂
含浸基材を採用した場合には４．５で、〃ラス／ポリイ
ミド系で４．０と比較的大きく、従って、プリント配線
板として使用した場合には高周波に対する特性が不充分
で、高周波クロックを用いた高周波演算回路の実装とが
、通信機器回路の実装には制約を受けていた。このため
本発明者らは既に基材としてフッ素樹脂繊維布を用いて
誘電率が小さく、高周波特性が良好な積層板を開発して
いるが、フッ素樹脂の接着性が悪く、眉間剥離を生じる
という問題が新たに発生している。[Background Art] Conventionally, laminates for printed wiring boards have been manufactured by R-molding a resin-impregnated base material formed by impregnating a lath cloth base material with an epoxy resin or polyimide resin and drying it. The dielectric constant of this laminate is 4.5 when a glass/epoxy resin-impregnated base material is used, and 4.0 when a glass/polyimide base material is used, which is relatively high. Therefore, when used as a printed wiring board However, the high-frequency characteristics of the high-frequency circuits are insufficient, and the implementation of high-frequency arithmetic circuits using high-frequency clocks has been restricted in the implementation of communication equipment circuits. For this reason, the present inventors have already developed a laminate that uses fluororesin fiber cloth as a base material and has a low dielectric constant and good high frequency characteristics, but it has been reported that the fluororesin has poor adhesion and causes peeling between the eyebrows. A new problem has arisen.
［発明の目的１
本発明は上記＄情に鑑みて為されたものであり、その目
的とするところは、誘電率が小さく、高周波特性が良好
となり、プリント配線板としで使用した場合に高周波演
算回路、通信機回路の実装が可能な絶縁特性に優れ、し
かも層間剥離のない積層板を製造することにある。[Objective of the Invention 1 The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a small dielectric constant, good high frequency characteristics, and a high frequency calculation capability when used as a printed wiring board. The purpose of the present invention is to manufacture a laminated board that has excellent insulation properties and is free from delamination, allowing mounting of circuits and communication circuits.
［発明の開示］
本発明の積層板の製造方法は、フッ素樹脂繊維布の表面
を表面処理剤で粗化した後に樹脂ワニスを含浸し乾燥し
て樹脂含浸基材１を形成し、この樹脂含浸基材を複数枚
積層することを特徴とするものであり、この構成により
上記目的を達成できたものである。[Disclosure of the Invention] In the method for manufacturing a laminate of the present invention, the surface of a fluororesin fiber cloth is roughened with a surface treatment agent, and then impregnated with a resin varnish and dried to form a resin-impregnated base material 1. It is characterized by laminating a plurality of base materials, and with this configuration, the above object can be achieved.
以下本発明を添付の図面を参照して詳細に説明する。本
発明におけるフッ素樹脂＃＆維布を形成しているフッ素
樹脂としては、三７ツ化塩化エチレン樹脂（融点２１０
〜２１２°Ｃ）、四７フ化エチレン樹脂（融点３２７℃
）、四７ツ化エチレンー六７フ化プロピレン共重合体樹
脂（融点２７０℃）、四７ツ化エチレンーパーフルオロ
ビニルエーテル共ｍ合体ｍ脂（融点３０２〜３１０°Ｃ
）などのような融点が２００℃以上のものが好ましい、
＊ず、この７ツＸｔｌ脂ａｍ布を表面処理剤で粗化させ
る。表面処理剤としては金属ナトリフム・アンモニアと
か金属ナトリウム混合・テトラヒドロ７ランとか、ある
いはテトラエッチ（商品名、潤工社株式会社′！ｉ）な
どを挙げることができる。テトラエッチ１：よる処理を
説明すると、まず７ツ素樹Ｊ１１ｔｗ＆維布の表面の汚
れをアセシンなどでおとし、乾燥させる。この後フッ素
樹脂繊維布をテトラエッチに浸すか、金属又はポリエチ
レンのへらで塗布する。処理時開は７ツ索樹脂の種類に
より異なるが５〜１０秒程度である０次いで、この７ツ
素樹ｍｗａ維布にフェノールυ（脂、不飽和ポリエステ
ル樹脂、ポリイミド樹脂、エポキシ樹脂等の熱硬化性団
脂ワニスを含浸させ、乾燥させて樹脂含浸基材１を形成
する。この場合、絶縁性に優れたポリイミドワニス、エ
ポキシ樹脂ワニスを採用するのが好ましい。この後、樹
脂含浸基材１を複数枚積み重ねて配置し、このものを−
組みとして成形プレートを介して複数組み熱盤間に配置
し、２００℃以上、２０〜１５０ｋｇ／ａｍ２．４０〜
１００分で加熱加圧して積層一体化させて積層板Ａを製
造する。この場合、第２図に示すように樹脂含浸基材１
と従来の樹脂含浸基材１′とを積み重ねてもよく、又、
樹脂含浸基材１を複数枚積み重ねたその最上面及び／又
は最下面に金属ｆｆ１２を配置しておいて金属箔２を貼
着させて金属箔張り積層板としでもよい。金属箔２とし
ては銅箔、アルミニウム箔、真ちゅう箔、鉄箔、ステン
レス鋼箔、ニッケル箔、ケイ素ａｍなどいずれをも採用
できる。The present invention will now be described in detail with reference to the accompanying drawings. As the fluororesin forming the fluororesin #&fiber cloth in the present invention, ethylene trisulfate chloride resin (melting point 210
~212°C), tetra7fluoroethylene resin (melting point 327°C)
), tetra7tethylene-propylene hexafluoride copolymer resin (melting point 270°C), tetra7tethylene-perfluorovinyl ether copolymer resin (melting point 302-310°C)
) with a melting point of 200°C or higher, such as
*First, roughen this 7 XTL am cloth with a surface treatment agent. Examples of the surface treatment agent include metal sodium/ammonia, metal sodium mixture/tetrahydro7ran, and Tetraetch (trade name, Junkosha Co., Ltd.'!i). Tetra Etch 1: To explain the treatment, first remove dirt on the surface of the 7-piece J11tw & cloth using Acecin, etc., and dry. After this, the fluororesin fiber cloth is soaked in Tetra-etch or applied with a metal or polyethylene spatula. The opening time during treatment varies depending on the type of 7-strand resin, but it takes about 5 to 10 seconds.Next, this 7-strand resin MWA fiber is coated with phenol υ (thermally cured resin, unsaturated polyester resin, polyimide resin, epoxy resin, etc.). The resin-impregnated base material 1 is formed by impregnating the resin-impregnated resin varnish and drying it. In this case, it is preferable to use polyimide varnish or epoxy resin varnish that has excellent insulation properties. After this, the resin-impregnated base material 1 is Stack and arrange multiple sheets, and make this one -
As a set, multiple sets are placed between heating platens via molded plates, 200℃ or higher, 20 to 150 kg/am2.40 to
The laminate A is manufactured by heating and pressurizing the laminate for 100 minutes to integrate the laminate. In this case, as shown in FIG.
and a conventional resin-impregnated base material 1' may be stacked, or
A metal foil-clad laminate may be obtained by placing a metal ff 12 on the uppermost and/or lowermost surfaces of a plurality of resin-impregnated substrates 1 stacked and pasting the metal foil 2 thereon. As the metal foil 2, any of copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon am, etc. can be used.
この積層板Ａから通常の工程によりプリント配線板が製
造される。A printed wiring board is manufactured from this laminate A by a normal process.
次に、本発明の実施例を具体的に説明する。Next, examples of the present invention will be specifically described.
（実施例１）
フッ素樹脂繊維布をテトラエッチに７秒間浸漬して表面
処理を施した後、固形分４０〜８０重量％のポリイミド
ワニスＮ４Ｎ＜ケルイミド６０１）を含浸させ、１５０
〜２００℃で乾燥させて樹脂含浸基材１を製造した。フ
ッ素樹脂とポリイミド樹脂の容積比は１：１であった。(Example 1) After immersing a fluororesin fiber cloth in Tetra Etch for 7 seconds to perform surface treatment, it was impregnated with polyimide varnish N4N<Kelimide 601) having a solid content of 40 to 80% by weight.
Resin-impregnated base material 1 was manufactured by drying at ~200°C. The volume ratio of fluororesin and polyimide resin was 1:1.
この樹脂含浸基材１を複数枚積み重ね、その最上面及Ｖ
Ｒ下面にそれぞれ１８μ厚の銅箔２を配置し、このもの
を−組として熱盤間に複数組み配置して加熱加圧成形し
て＃！箔張ワ積層板Ａを形成した（ｔｊＳ１図参照）。A plurality of these resin-impregnated base materials 1 are stacked, and the top surface and V
Copper foils 2 with a thickness of 18 μm are placed on the lower surface of each R, and multiple sets of these are placed between hot platens and heated and press-formed to form #! A foil-clad laminate A was formed (see Figure tjS1).
加熱加圧条件は、２００°Ｃ、３０ｋｇ／ｃａ＋２．１
２０分であった。キユアリングの後、誘電率を測定した
（ＪＩＳ Ｃ６４８１による）。誘電率はＺ、Ｓであっ
た。又、樹脂含浸基材１同士の引きはがし強度は４．Ｏ
ｋｇ／ｃｌＳ２であった。The heating and pressurizing conditions are 200°C, 30kg/ca+2.1
It was 20 minutes. After curing, the dielectric constant was measured (according to JIS C6481). The dielectric constants were Z and S. Moreover, the peel strength of the resin-impregnated base materials 1 is 4. O
kg/clS2.
（実施例２）
樹脂ワニスとしてエポキシ樹脂ワニスを用い、１７０℃
で加熱加圧成形した以外は実施例１と同様にしてａ４Ｍ
張り積層板Ａを製造した。この積層板の誘を率は３．０
であった。樹脂含浸基材１同士の引きはがし強度は３．
９であった。(Example 2) Epoxy resin varnish was used as the resin varnish, and the temperature was 170°C.
A4M was prepared in the same manner as in Example 1 except that it was heated and press-molded.
A stretched laminate A was manufactured. The dielectric constant of this laminate is 3.0
Met. The peel strength of the resin-impregnated base materials 1 is 3.
It was 9.
（実施例３）
ガラス布にポリイミド樹脂を含浸させ乾燥させて製造し
た複数枚の樹脂含浸基材１′の両面に実施例１の樹脂含
浸基材１を配置した以外は実施例１と同様にしてｉｎ張
り積層板Ａを製造した（第２図参照）、この積層板の誘
電率は３．４であった。(Example 3) The procedure was the same as in Example 1 except that the resin-impregnated base material 1 of Example 1 was placed on both sides of a plurality of resin-impregnated base materials 1' produced by impregnating glass cloth with polyimide resin and drying. An in-line laminate A was produced (see FIG. 2), and the dielectric constant of this laminate was 3.4.
樹脂含浸基材１．１′同士の引きはがし強度は４゜５ｋ
ｇ／ａｍ”であった。The peel strength between resin-impregnated base materials 1.1' is 4°5k.
g/am”.
（実施例４）
ガラス布にポリイミド樹脂を含浸させ乾燥させて製造し
た複数枚の樹脂含浸基材１′の両面に実施例１の樹脂含
浸基材１を配置した以外は実施例２と同様にしてｇａｔ
ｉ張り積層板Ａを製造した。この積層板の誘電率は３．
６であった。樹脂含浸基材１．１′同士の引きはがし強
度は４．７ ｋｇ／ａｍ”であった。(Example 4) The same procedure as in Example 2 was carried out except that the resin-impregnated base material 1 of Example 1 was placed on both sides of a plurality of resin-impregnated base materials 1' produced by impregnating and drying glass cloth with polyimide resin. Gat
An i-clad laminate A was manufactured. The dielectric constant of this laminate is 3.
It was 6. The peel strength between the resin-impregnated substrates 1.1' was 4.7 kg/am''.
尚、上記いずれの実施例における積層板も誘電正接は小
さかった。Note that the dielectric loss tangent of the laminates in any of the above examples was small.
（比較例）
フッ素樹脂ａｍ布に表面処理を施さなかった以外は実施
例１と同様にして積層板を製造した。誘電率は３．０で
あった。引きはがし強度は０．９ｋｇ／ａｍ２であった
。(Comparative Example) A laminate was manufactured in the same manner as in Example 1 except that the fluororesin AM cloth was not subjected to surface treatment. The dielectric constant was 3.0. The peel strength was 0.9 kg/am2.
［発明の効果］
本発明にあっては、フッ素樹脂繊維布の表面を表面処理
剤で粗化した後に樹脂ワニスを含浸し乾燥して樹脂含浸
基材を形成し、この樹脂含浸基材を複数枚積層するので
、誘電率が小さく、高周波特性が良好となり、プリント
配線板として使用した場合に高周波クロックを用いた高
周波演算回路、通信機回路の文装が可能となり、しかも
フッ素樹脂ａ維布の表面が粗化されているので、樹脂含
浸基材間の引きはがし強度も大きくなり、眉間剥離など
生じなく実用性の高い積層板を製造することができるも
のである。[Effect of the invention] In the present invention, the surface of a fluororesin fiber cloth is roughened with a surface treatment agent, and then impregnated with a resin varnish and dried to form a resin-impregnated base material, and a plurality of resin-impregnated base materials are formed. Since the sheets are laminated, the dielectric constant is small and the high frequency characteristics are good. When used as a printed wiring board, it is possible to design high frequency arithmetic circuits and communication circuits using high frequency clocks. Since the surface is roughened, the peel strength between the resin-impregnated base materials is increased, and a highly practical laminate can be manufactured without causing peeling between the eyebrows.
第１図は本発明の一実施例を示す概略分解断面図、第２
図は同上の他の実施例を示す概略分解断面図であって、
Ａは積層板、１は樹脂含浸基材、２は金１４Ｍである。FIG. 1 is a schematic exploded cross-sectional view showing one embodiment of the present invention, and FIG.
The figure is a schematic exploded sectional view showing another embodiment same as above,
A is a laminate, 1 is a resin-impregnated base material, and 2 is gold 14M.
Claims (2)
後に樹脂ワニスを含浸し乾燥して樹脂含浸基材を形成し
、この樹脂含浸基材を複数枚積層することを特徴とする
積層板の製造方法。(1) Lamination characterized by roughening the surface of a fluororesin fiber cloth with a surface treatment agent, impregnating it with a resin varnish and drying it to form a resin-impregnated base material, and laminating a plurality of sheets of this resin-impregnated base material. Method of manufacturing the board.
樹脂ワニスであることを特徴とする特許請求の範囲第１
項記載の積層板の製造方法。(2) Claim 1, characterized in that the resin varnish is a polyimide resin varnish or an epoxy resin varnish.
2. Method for manufacturing a laminate as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898686A JPS62295930A (en) | 1986-06-14 | 1986-06-14 | Preparation of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898686A JPS62295930A (en) | 1986-06-14 | 1986-06-14 | Preparation of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62295930A true JPS62295930A (en) | 1987-12-23 |
Family
ID=15234809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13898686A Pending JPS62295930A (en) | 1986-06-14 | 1986-06-14 | Preparation of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62295930A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243230A (en) * | 1988-04-30 | 1990-02-13 | Daikin Ind Ltd | Composite sheet and laminate |
| JPH03218690A (en) * | 1990-01-24 | 1991-09-26 | Tomoegawa Paper Co Ltd | Printed board basic sheet |
-
1986
- 1986-06-14 JP JP13898686A patent/JPS62295930A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243230A (en) * | 1988-04-30 | 1990-02-13 | Daikin Ind Ltd | Composite sheet and laminate |
| JPH03218690A (en) * | 1990-01-24 | 1991-09-26 | Tomoegawa Paper Co Ltd | Printed board basic sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62295930A (en) | Preparation of laminated sheet | |
| CN114103307A (en) | Low-warpage thermosetting resin copper-clad plate and preparation method thereof | |
| JP2501331B2 (en) | Laminate | |
| JPH0258887A (en) | Aluminum based copper-clad lamination board | |
| JPH01163059A (en) | Metal foil clad laminated sheet | |
| JPH01313998A (en) | Manufacture of metal composite laminated board | |
| JPH04171796A (en) | Low dielectric constant wiring board | |
| JPS63199636A (en) | Laminated board | |
| JPS59232846A (en) | Laminated board for electric wiring board and manufacture thereof | |
| JPH0219989B2 (en) | ||
| JPH03129796A (en) | Manufacture of printed circuit board | |
| JPS62294546A (en) | Laminated board | |
| JPH0584214B2 (en) | ||
| JPH0334677B2 (en) | ||
| JPH02130146A (en) | Electrical laminate | |
| JPS63199635A (en) | Laminated board | |
| JPS62295495A (en) | Multilayer printed interconnection board | |
| KR101473859B1 (en) | Prepreg, prepreg laminates, and metal clad laminates and print wiring board having the prepreg or the prepreg laminates | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JPS63224935A (en) | Laminated board | |
| JP3207332B2 (en) | Manufacturing method of laminated board | |
| JP2000049457A (en) | Manufacture of multilayer board | |
| JPS589755B2 (en) | New copper clad laminate | |
| JPH01264811A (en) | Manufacture of electrical laminate | |
| JPH06260734A (en) | Laminated board for printed wiring board |