JPS58176944A - 試験方法 - Google Patents
試験方法Info
- Publication number
- JPS58176944A JPS58176944A JP57059086A JP5908682A JPS58176944A JP S58176944 A JPS58176944 A JP S58176944A JP 57059086 A JP57059086 A JP 57059086A JP 5908682 A JP5908682 A JP 5908682A JP S58176944 A JPS58176944 A JP S58176944A
- Authority
- JP
- Japan
- Prior art keywords
- test
- good
- parallel
- chip
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000005259 measurement Methods 0.000 claims description 6
- 238000010998 test method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 32
- 238000013142 basic testing Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57059086A JPS58176944A (ja) | 1982-04-09 | 1982-04-09 | 試験方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57059086A JPS58176944A (ja) | 1982-04-09 | 1982-04-09 | 試験方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58176944A true JPS58176944A (ja) | 1983-10-17 |
| JPS6217376B2 JPS6217376B2 (enExample) | 1987-04-17 |
Family
ID=13103174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57059086A Granted JPS58176944A (ja) | 1982-04-09 | 1982-04-09 | 試験方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58176944A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010743A (ja) * | 1983-06-30 | 1985-01-19 | Nec Home Electronics Ltd | 半導体素子特性測定方法 |
| JPS60254626A (ja) * | 1984-05-30 | 1985-12-16 | Sharp Corp | ウエハテスト方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487659A (ja) * | 1990-07-27 | 1992-03-19 | Mochizuki Kiko Seisakusho:Kk | 長尺薄葉突板シートの塗装方法並びに装置 |
| JPH0487660A (ja) * | 1990-07-27 | 1992-03-19 | Mochizuki Kiko Seisakusho:Kk | 長尺シート状弾性体の塗装方法並びに装置 |
| CN100430925C (zh) * | 2005-06-30 | 2008-11-05 | 东北大学 | 一种基于嵌入式操作的管理系统及装置 |
-
1982
- 1982-04-09 JP JP57059086A patent/JPS58176944A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010743A (ja) * | 1983-06-30 | 1985-01-19 | Nec Home Electronics Ltd | 半導体素子特性測定方法 |
| JPS60254626A (ja) * | 1984-05-30 | 1985-12-16 | Sharp Corp | ウエハテスト方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6217376B2 (enExample) | 1987-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5519333A (en) | Elevated voltage level IDDQ failure testing of integrated circuits | |
| US5654632A (en) | Method for inspecting semiconductor devices on a wafer | |
| JP2004117340A (ja) | 一つのハンドラに二つ以上のテストボードを有するテスト装備及びそのテスト方法 | |
| JPS58176944A (ja) | 試験方法 | |
| US6281694B1 (en) | Monitor method for testing probe pins | |
| US6710616B1 (en) | Wafer level dynamic burn-in | |
| JP3040233B2 (ja) | 半導体装置の検査方法 | |
| JPS6111465B2 (enExample) | ||
| JPH0252446A (ja) | 集積回路の試験装置 | |
| JPS5821838A (ja) | ウエハテストシステム | |
| Yanagita et al. | Realization of “skeleton wafer” testing for electrical failure analysis | |
| KR0177987B1 (ko) | 복수 개의 반도체 칩 테스트 방법 | |
| US20050122124A1 (en) | Semiconductor manufacturing device and semiconductor manufacturing method | |
| JP2004266017A (ja) | 半導体ウエハの検査方法 | |
| JP3232588B2 (ja) | Ic並列試験システム | |
| JP2001083211A (ja) | 半導体検査装置および半導体検査方法 | |
| JPH01116460A (ja) | 電子装置の検査方法 | |
| JPS6381941A (ja) | 検査装置 | |
| JPH04241439A (ja) | Icテスト・システム | |
| US20050050422A1 (en) | Semiconductor integrated circuit | |
| JPS62294984A (ja) | 半導体検査装置 | |
| CN113030701A (zh) | 一种射频器件的功率承载力的测量方法 | |
| JPS6371669A (ja) | 電子回路装置の検査方法 | |
| JPH02240580A (ja) | 半導体チップの特性測定装置 | |
| JPH042974A (ja) | 半導体装置のテスト方法 |