JPS6217376B2 - - Google Patents

Info

Publication number
JPS6217376B2
JPS6217376B2 JP57059086A JP5908682A JPS6217376B2 JP S6217376 B2 JPS6217376 B2 JP S6217376B2 JP 57059086 A JP57059086 A JP 57059086A JP 5908682 A JP5908682 A JP 5908682A JP S6217376 B2 JPS6217376 B2 JP S6217376B2
Authority
JP
Japan
Prior art keywords
test
chips
parallel
wafer
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57059086A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58176944A (ja
Inventor
Atsushi Nigorikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57059086A priority Critical patent/JPS58176944A/ja
Publication of JPS58176944A publication Critical patent/JPS58176944A/ja
Publication of JPS6217376B2 publication Critical patent/JPS6217376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP57059086A 1982-04-09 1982-04-09 試験方法 Granted JPS58176944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57059086A JPS58176944A (ja) 1982-04-09 1982-04-09 試験方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57059086A JPS58176944A (ja) 1982-04-09 1982-04-09 試験方法

Publications (2)

Publication Number Publication Date
JPS58176944A JPS58176944A (ja) 1983-10-17
JPS6217376B2 true JPS6217376B2 (enExample) 1987-04-17

Family

ID=13103174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57059086A Granted JPS58176944A (ja) 1982-04-09 1982-04-09 試験方法

Country Status (1)

Country Link
JP (1) JPS58176944A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487660A (ja) * 1990-07-27 1992-03-19 Mochizuki Kiko Seisakusho:Kk 長尺シート状弾性体の塗装方法並びに装置
JPH0487659A (ja) * 1990-07-27 1992-03-19 Mochizuki Kiko Seisakusho:Kk 長尺薄葉突板シートの塗装方法並びに装置
CN100430925C (zh) * 2005-06-30 2008-11-05 东北大学 一种基于嵌入式操作的管理系统及装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010743A (ja) * 1983-06-30 1985-01-19 Nec Home Electronics Ltd 半導体素子特性測定方法
JPS60254626A (ja) * 1984-05-30 1985-12-16 Sharp Corp ウエハテスト方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487660A (ja) * 1990-07-27 1992-03-19 Mochizuki Kiko Seisakusho:Kk 長尺シート状弾性体の塗装方法並びに装置
JPH0487659A (ja) * 1990-07-27 1992-03-19 Mochizuki Kiko Seisakusho:Kk 長尺薄葉突板シートの塗装方法並びに装置
CN100430925C (zh) * 2005-06-30 2008-11-05 东北大学 一种基于嵌入式操作的管理系统及装置

Also Published As

Publication number Publication date
JPS58176944A (ja) 1983-10-17

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