JPS58168232A - 平行平板型ドライエツチング装置 - Google Patents

平行平板型ドライエツチング装置

Info

Publication number
JPS58168232A
JPS58168232A JP57051499A JP5149982A JPS58168232A JP S58168232 A JPS58168232 A JP S58168232A JP 57051499 A JP57051499 A JP 57051499A JP 5149982 A JP5149982 A JP 5149982A JP S58168232 A JPS58168232 A JP S58168232A
Authority
JP
Japan
Prior art keywords
electrode
etching
sample
quartz plate
samples
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57051499A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0324777B2 (enExample
Inventor
Hideki Fujiwara
英樹 藤原
Niwaji Majima
庭司 間島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57051499A priority Critical patent/JPS58168232A/ja
Publication of JPS58168232A publication Critical patent/JPS58168232A/ja
Publication of JPH0324777B2 publication Critical patent/JPH0324777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
JP57051499A 1982-03-30 1982-03-30 平行平板型ドライエツチング装置 Granted JPS58168232A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57051499A JPS58168232A (ja) 1982-03-30 1982-03-30 平行平板型ドライエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57051499A JPS58168232A (ja) 1982-03-30 1982-03-30 平行平板型ドライエツチング装置

Publications (2)

Publication Number Publication Date
JPS58168232A true JPS58168232A (ja) 1983-10-04
JPH0324777B2 JPH0324777B2 (enExample) 1991-04-04

Family

ID=12888664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57051499A Granted JPS58168232A (ja) 1982-03-30 1982-03-30 平行平板型ドライエツチング装置

Country Status (1)

Country Link
JP (1) JPS58168232A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62152435U (enExample) * 1986-03-19 1987-09-28

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5241101A (en) * 1975-09-30 1977-03-30 Komatsu Mfg Co Ltd Boring device
JPS5461474A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Plasma disposal unit
JPS5647950U (enExample) * 1979-09-19 1981-04-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5241101A (en) * 1975-09-30 1977-03-30 Komatsu Mfg Co Ltd Boring device
JPS5461474A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Plasma disposal unit
JPS5647950U (enExample) * 1979-09-19 1981-04-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62152435U (enExample) * 1986-03-19 1987-09-28

Also Published As

Publication number Publication date
JPH0324777B2 (enExample) 1991-04-04

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