JPS5816592A - 印刷回路板、金属張り積層板中間製品及びそれらの製造方法 - Google Patents
印刷回路板、金属張り積層板中間製品及びそれらの製造方法Info
- Publication number
- JPS5816592A JPS5816592A JP57055231A JP5523182A JPS5816592A JP S5816592 A JPS5816592 A JP S5816592A JP 57055231 A JP57055231 A JP 57055231A JP 5523182 A JP5523182 A JP 5523182A JP S5816592 A JPS5816592 A JP S5816592A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- layer
- substrate
- metal
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 34
- 239000010410 layer Substances 0.000 claims description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 62
- 229910052802 copper Inorganic materials 0.000 claims description 60
- 239000010949 copper Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 60
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 238000000576 coating method Methods 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 32
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000000047 product Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 239000011888 foil Substances 0.000 description 6
- 239000013067 intermediate product Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- YNWDKZIIWCEDEE-UHFFFAOYSA-N pantoprazole sodium Chemical compound [Na+].COC1=CC=NC(CS(=O)C=2[N-]C3=CC=C(OC(F)F)C=C3N=2)=C1OC YNWDKZIIWCEDEE-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000011410 subtraction method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25101881A | 1981-04-03 | 1981-04-03 | |
| US251018 | 1981-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5816592A true JPS5816592A (ja) | 1983-01-31 |
Family
ID=22950136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57055231A Pending JPS5816592A (ja) | 1981-04-03 | 1982-04-02 | 印刷回路板、金属張り積層板中間製品及びそれらの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5816592A (it) |
| FR (1) | FR2503523A1 (it) |
| GB (1) | GB2096402A (it) |
| IT (1) | IT1150519B (it) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH021198A (ja) * | 1988-03-10 | 1990-01-05 | Yamaha Motor Co Ltd | めっき型熱電対 |
| JPH02122691A (ja) * | 1988-11-01 | 1990-05-10 | Shinko Electric Ind Co Ltd | 回路基板の製造方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4650545A (en) * | 1985-02-19 | 1987-03-17 | Tektronix, Inc. | Polyimide embedded conductor process |
| GB8824826D0 (en) * | 1988-10-24 | 1988-11-30 | Moran P | Moulded circuit board |
| GB8913450D0 (en) * | 1989-06-12 | 1989-08-02 | Philips Electronic Associated | Electrical device manufacture,particularly infrared detector arrays |
| US5194698A (en) * | 1990-09-11 | 1993-03-16 | Hughes Aircraft Company | Apparatus and method using a permanent mandrel for manufacture of electrical circuitry |
| JP3643743B2 (ja) * | 2000-01-28 | 2005-04-27 | 三洋電機株式会社 | 実装基板 |
| EP1509070A3 (en) * | 2003-08-22 | 2007-04-25 | Tyco Electronics Nederland B.V. | Method for producing an electrical conductor element and electrical conductor element |
| CN101146407A (zh) * | 2006-09-15 | 2008-03-19 | 李东明 | 印刷电路板载板电路图形转移成型工艺 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL108173C (it) * | 1954-06-25 | |||
| FR1343871A (fr) * | 1961-11-13 | 1963-11-22 | Ncr Co | Procédé de fabrication de circuits imprimés |
| JPS53115069A (en) * | 1977-03-18 | 1978-10-07 | Nippon Mining Co | Method of producing printed circuit board |
| US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
-
1982
- 1982-04-02 IT IT20554/82A patent/IT1150519B/it active
- 1982-04-02 GB GB8209890A patent/GB2096402A/en not_active Withdrawn
- 1982-04-02 FR FR8205751A patent/FR2503523A1/fr active Pending
- 1982-04-02 JP JP57055231A patent/JPS5816592A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH021198A (ja) * | 1988-03-10 | 1990-01-05 | Yamaha Motor Co Ltd | めっき型熱電対 |
| JPH02122691A (ja) * | 1988-11-01 | 1990-05-10 | Shinko Electric Ind Co Ltd | 回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2503523A1 (fr) | 1982-10-08 |
| GB2096402A (en) | 1982-10-13 |
| IT1150519B (it) | 1986-12-10 |
| IT8220554A0 (it) | 1982-04-02 |
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