GB8824826D0 - Moulded circuit board - Google Patents

Moulded circuit board

Info

Publication number
GB8824826D0
GB8824826D0 GB888824826A GB8824826A GB8824826D0 GB 8824826 D0 GB8824826 D0 GB 8824826D0 GB 888824826 A GB888824826 A GB 888824826A GB 8824826 A GB8824826 A GB 8824826A GB 8824826 D0 GB8824826 D0 GB 8824826D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
moulded circuit
moulded
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB888824826A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MORAN P
Original Assignee
MORAN P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MORAN P filed Critical MORAN P
Priority to GB888824826A priority Critical patent/GB8824826D0/en
Publication of GB8824826D0 publication Critical patent/GB8824826D0/en
Priority to GB8923876A priority patent/GB2229864B/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB888824826A 1988-10-24 1988-10-24 Moulded circuit board Pending GB8824826D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB888824826A GB8824826D0 (en) 1988-10-24 1988-10-24 Moulded circuit board
GB8923876A GB2229864B (en) 1988-10-24 1989-10-24 Moulded circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888824826A GB8824826D0 (en) 1988-10-24 1988-10-24 Moulded circuit board

Publications (1)

Publication Number Publication Date
GB8824826D0 true GB8824826D0 (en) 1988-11-30

Family

ID=10645674

Family Applications (2)

Application Number Title Priority Date Filing Date
GB888824826A Pending GB8824826D0 (en) 1988-10-24 1988-10-24 Moulded circuit board
GB8923876A Expired - Fee Related GB2229864B (en) 1988-10-24 1989-10-24 Moulded circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8923876A Expired - Fee Related GB2229864B (en) 1988-10-24 1989-10-24 Moulded circuit board

Country Status (1)

Country Link
GB (2) GB8824826D0 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538555B2 (en) 1998-03-13 2003-03-25 Mannesmann Vdo Ag Throttle valve having potentiometer with supporting plate
DE19810844A1 (en) * 1998-03-13 1999-09-23 Mannesmann Vdo Ag Carrier plate fixing for choke potentiometer
AU2003226575A1 (en) * 2002-04-11 2003-10-20 Koninklijke Philips Electronics N.V. Method of manufacturing an electronic device
WO2004016055A1 (en) * 2002-08-05 2004-02-19 Koninklijke Philips Electronics N.V. An electronic product, a body and a method of manufacturing
EP1509070A3 (en) * 2003-08-22 2007-04-25 Tyco Electronics Nederland B.V. Method for producing an electrical conductor element and electrical conductor element
CN100543884C (en) * 2003-08-22 2009-09-23 泰科电子荷兰公司 The method of production electrical conductive elements and electrical conductive elements
JP5143424B2 (en) 2003-09-08 2013-02-13 奇美電子股▲ふん▼有限公司 Body and electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2503523A1 (en) * 1981-04-03 1982-10-08 Gen Electric PRINTED CIRCUIT, LAMINATED PRODUCT FOR MANUFACTURING SUCH CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
US4650545A (en) * 1985-02-19 1987-03-17 Tektronix, Inc. Polyimide embedded conductor process
ATE83883T1 (en) * 1985-09-04 1993-01-15 Ufe Inc MANUFACTURE OF PRINTED CIRCUITS.

Also Published As

Publication number Publication date
GB2229864A (en) 1990-10-03
GB8923876D0 (en) 1989-12-13
GB2229864B (en) 1993-05-26

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