IT1150519B - Procedimento per fabbricare un pannello di circuito stampato e pannello laminato a rivestimento metallico ottenuto da esso - Google Patents
Procedimento per fabbricare un pannello di circuito stampato e pannello laminato a rivestimento metallico ottenuto da essoInfo
- Publication number
- IT1150519B IT1150519B IT20554/82A IT2055482A IT1150519B IT 1150519 B IT1150519 B IT 1150519B IT 20554/82 A IT20554/82 A IT 20554/82A IT 2055482 A IT2055482 A IT 2055482A IT 1150519 B IT1150519 B IT 1150519B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacturing
- printed circuit
- panel
- coated laminated
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25101881A | 1981-04-03 | 1981-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8220554A0 IT8220554A0 (it) | 1982-04-02 |
IT1150519B true IT1150519B (it) | 1986-12-10 |
Family
ID=22950136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20554/82A IT1150519B (it) | 1981-04-03 | 1982-04-02 | Procedimento per fabbricare un pannello di circuito stampato e pannello laminato a rivestimento metallico ottenuto da esso |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5816592A (it) |
FR (1) | FR2503523A1 (it) |
GB (1) | GB2096402A (it) |
IT (1) | IT1150519B (it) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4650545A (en) * | 1985-02-19 | 1987-03-17 | Tektronix, Inc. | Polyimide embedded conductor process |
JP2642663B2 (ja) * | 1988-03-10 | 1997-08-20 | ヤマハ発動機株式会社 | めっき型熱電対 |
GB8824826D0 (en) * | 1988-10-24 | 1988-11-30 | Moran P | Moulded circuit board |
JPH02122691A (ja) * | 1988-11-01 | 1990-05-10 | Shinko Electric Ind Co Ltd | 回路基板の製造方法 |
GB8913450D0 (en) * | 1989-06-12 | 1989-08-02 | Philips Electronic Associated | Electrical device manufacture,particularly infrared detector arrays |
US5194698A (en) * | 1990-09-11 | 1993-03-16 | Hughes Aircraft Company | Apparatus and method using a permanent mandrel for manufacture of electrical circuitry |
JP3643743B2 (ja) * | 2000-01-28 | 2005-04-27 | 三洋電機株式会社 | 実装基板 |
EP1509070A3 (en) * | 2003-08-22 | 2007-04-25 | Tyco Electronics Nederland B.V. | Method for producing an electrical conductor element and electrical conductor element |
CN101146407A (zh) * | 2006-09-15 | 2008-03-19 | 李东明 | 印刷电路板载板电路图形转移成型工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL108173C (it) * | 1954-06-25 | |||
FR1343871A (fr) * | 1961-11-13 | 1963-11-22 | Ncr Co | Procédé de fabrication de circuits imprimés |
JPS53115069A (en) * | 1977-03-18 | 1978-10-07 | Nippon Mining Co | Method of producing printed circuit board |
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
-
1982
- 1982-04-02 GB GB8209890A patent/GB2096402A/en not_active Withdrawn
- 1982-04-02 JP JP57055231A patent/JPS5816592A/ja active Pending
- 1982-04-02 IT IT20554/82A patent/IT1150519B/it active
- 1982-04-02 FR FR8205751A patent/FR2503523A1/fr active Pending
Also Published As
Publication number | Publication date |
---|---|
IT8220554A0 (it) | 1982-04-02 |
JPS5816592A (ja) | 1983-01-31 |
FR2503523A1 (fr) | 1982-10-08 |
GB2096402A (en) | 1982-10-13 |
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