IT8220554A0 - Procedimento per fabbricare un pannello di circuito stampato e pannello laainato a rivestimento metallico ottenuto da esso. - Google Patents

Procedimento per fabbricare un pannello di circuito stampato e pannello laainato a rivestimento metallico ottenuto da esso.

Info

Publication number
IT8220554A0
IT8220554A0 IT8220554A IT2055482A IT8220554A0 IT 8220554 A0 IT8220554 A0 IT 8220554A0 IT 8220554 A IT8220554 A IT 8220554A IT 2055482 A IT2055482 A IT 2055482A IT 8220554 A0 IT8220554 A0 IT 8220554A0
Authority
IT
Italy
Prior art keywords
panel
lainated
metallic
coated
procedure
Prior art date
Application number
IT8220554A
Other languages
English (en)
Other versions
IT1150519B (it
Inventor
Joseph David Cargioli
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IT8220554A0 publication Critical patent/IT8220554A0/it
Application granted granted Critical
Publication of IT1150519B publication Critical patent/IT1150519B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
IT20554/82A 1981-04-03 1982-04-02 Procedimento per fabbricare un pannello di circuito stampato e pannello laminato a rivestimento metallico ottenuto da esso IT1150519B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25101881A 1981-04-03 1981-04-03

Publications (2)

Publication Number Publication Date
IT8220554A0 true IT8220554A0 (it) 1982-04-02
IT1150519B IT1150519B (it) 1986-12-10

Family

ID=22950136

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20554/82A IT1150519B (it) 1981-04-03 1982-04-02 Procedimento per fabbricare un pannello di circuito stampato e pannello laminato a rivestimento metallico ottenuto da esso

Country Status (4)

Country Link
JP (1) JPS5816592A (it)
FR (1) FR2503523A1 (it)
GB (1) GB2096402A (it)
IT (1) IT1150519B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4650545A (en) * 1985-02-19 1987-03-17 Tektronix, Inc. Polyimide embedded conductor process
JP2642663B2 (ja) * 1988-03-10 1997-08-20 ヤマハ発動機株式会社 めっき型熱電対
GB8824826D0 (en) * 1988-10-24 1988-11-30 Moran P Moulded circuit board
JPH02122691A (ja) * 1988-11-01 1990-05-10 Shinko Electric Ind Co Ltd 回路基板の製造方法
GB8913450D0 (en) * 1989-06-12 1989-08-02 Philips Electronic Associated Electrical device manufacture,particularly infrared detector arrays
US5194698A (en) * 1990-09-11 1993-03-16 Hughes Aircraft Company Apparatus and method using a permanent mandrel for manufacture of electrical circuitry
JP3643743B2 (ja) * 2000-01-28 2005-04-27 三洋電機株式会社 実装基板
EP1509070A3 (en) * 2003-08-22 2007-04-25 Tyco Electronics Nederland B.V. Method for producing an electrical conductor element and electrical conductor element
CN101146407A (zh) * 2006-09-15 2008-03-19 李东明 印刷电路板载板电路图形转移成型工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (it) * 1954-06-25
FR1343871A (fr) * 1961-11-13 1963-11-22 Ncr Co Procédé de fabrication de circuits imprimés
JPS53115069A (en) * 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product

Also Published As

Publication number Publication date
IT1150519B (it) 1986-12-10
JPS5816592A (ja) 1983-01-31
FR2503523A1 (fr) 1982-10-08
GB2096402A (en) 1982-10-13

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