JPS58159362A - 多層混成集積回路装置 - Google Patents

多層混成集積回路装置

Info

Publication number
JPS58159362A
JPS58159362A JP57043261A JP4326182A JPS58159362A JP S58159362 A JPS58159362 A JP S58159362A JP 57043261 A JP57043261 A JP 57043261A JP 4326182 A JP4326182 A JP 4326182A JP S58159362 A JPS58159362 A JP S58159362A
Authority
JP
Japan
Prior art keywords
substrate
bent
integrated circuit
hybrid integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57043261A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347271B2 (enExample
Inventor
Yoshio Miura
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP57043261A priority Critical patent/JPS58159362A/ja
Publication of JPS58159362A publication Critical patent/JPS58159362A/ja
Publication of JPS6347271B2 publication Critical patent/JPS6347271B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/68—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H10W72/5449—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57043261A 1982-03-17 1982-03-17 多層混成集積回路装置 Granted JPS58159362A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57043261A JPS58159362A (ja) 1982-03-17 1982-03-17 多層混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57043261A JPS58159362A (ja) 1982-03-17 1982-03-17 多層混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS58159362A true JPS58159362A (ja) 1983-09-21
JPS6347271B2 JPS6347271B2 (enExample) 1988-09-21

Family

ID=12658903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57043261A Granted JPS58159362A (ja) 1982-03-17 1982-03-17 多層混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS58159362A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008248635A (ja) * 2007-03-30 2008-10-16 Alpha Corp ハンドル装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008248635A (ja) * 2007-03-30 2008-10-16 Alpha Corp ハンドル装置

Also Published As

Publication number Publication date
JPS6347271B2 (enExample) 1988-09-21

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