JPS5814593A - 立体的チップ実装方法 - Google Patents

立体的チップ実装方法

Info

Publication number
JPS5814593A
JPS5814593A JP11170381A JP11170381A JPS5814593A JP S5814593 A JPS5814593 A JP S5814593A JP 11170381 A JP11170381 A JP 11170381A JP 11170381 A JP11170381 A JP 11170381A JP S5814593 A JPS5814593 A JP S5814593A
Authority
JP
Japan
Prior art keywords
chip
chip mounting
land
drilling
mounting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11170381A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0355994B2 (enrdf_load_stackoverflow
Inventor
英夫 町田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYUUOU MEIBAN KOGYO KK
CHUO MEIBAN Manufacturing CO
Original Assignee
CHIYUUOU MEIBAN KOGYO KK
CHUO MEIBAN Manufacturing CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYUUOU MEIBAN KOGYO KK, CHUO MEIBAN Manufacturing CO filed Critical CHIYUUOU MEIBAN KOGYO KK
Priority to JP11170381A priority Critical patent/JPS5814593A/ja
Publication of JPS5814593A publication Critical patent/JPS5814593A/ja
Publication of JPH0355994B2 publication Critical patent/JPH0355994B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP11170381A 1981-07-17 1981-07-17 立体的チップ実装方法 Granted JPS5814593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11170381A JPS5814593A (ja) 1981-07-17 1981-07-17 立体的チップ実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11170381A JPS5814593A (ja) 1981-07-17 1981-07-17 立体的チップ実装方法

Publications (2)

Publication Number Publication Date
JPS5814593A true JPS5814593A (ja) 1983-01-27
JPH0355994B2 JPH0355994B2 (enrdf_load_stackoverflow) 1991-08-27

Family

ID=14568011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11170381A Granted JPS5814593A (ja) 1981-07-17 1981-07-17 立体的チップ実装方法

Country Status (1)

Country Link
JP (1) JPS5814593A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964867A (enrdf_load_stackoverflow) * 1972-10-31 1974-06-24
JPS5527664A (en) * 1978-08-18 1980-02-27 Matsushita Electric Industrial Co Ltd Method of mounting leadless part

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964867A (enrdf_load_stackoverflow) * 1972-10-31 1974-06-24
JPS5527664A (en) * 1978-08-18 1980-02-27 Matsushita Electric Industrial Co Ltd Method of mounting leadless part

Also Published As

Publication number Publication date
JPH0355994B2 (enrdf_load_stackoverflow) 1991-08-27

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