JPH0217955B2 - - Google Patents

Info

Publication number
JPH0217955B2
JPH0217955B2 JP17992881A JP17992881A JPH0217955B2 JP H0217955 B2 JPH0217955 B2 JP H0217955B2 JP 17992881 A JP17992881 A JP 17992881A JP 17992881 A JP17992881 A JP 17992881A JP H0217955 B2 JPH0217955 B2 JP H0217955B2
Authority
JP
Japan
Prior art keywords
hole
metal plate
metal
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17992881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5880897A (ja
Inventor
Seiichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP17992881A priority Critical patent/JPS5880897A/ja
Publication of JPS5880897A publication Critical patent/JPS5880897A/ja
Publication of JPH0217955B2 publication Critical patent/JPH0217955B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP17992881A 1981-11-09 1981-11-09 金属芯プリント配線板の製造方法 Granted JPS5880897A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17992881A JPS5880897A (ja) 1981-11-09 1981-11-09 金属芯プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17992881A JPS5880897A (ja) 1981-11-09 1981-11-09 金属芯プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS5880897A JPS5880897A (ja) 1983-05-16
JPH0217955B2 true JPH0217955B2 (enrdf_load_stackoverflow) 1990-04-24

Family

ID=16074372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17992881A Granted JPS5880897A (ja) 1981-11-09 1981-11-09 金属芯プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS5880897A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144991A (ja) * 1984-01-05 1985-07-31 松下電工株式会社 金属ベ−ス回路板
JPH0758825B2 (ja) * 1985-10-30 1995-06-21 株式会社東芝 配線基板
JPS6465895A (en) * 1987-09-07 1989-03-13 Hitachi Cable Mesh-shaped metal core substrate
JPH085559Y2 (ja) * 1987-09-14 1996-02-14 沖電気工業株式会社 プリント基板
JPH01319995A (ja) * 1988-06-21 1989-12-26 Ibiden Co Ltd 電子部品搭載用基板及びその製造方法
JPH0770836B2 (ja) * 1989-05-25 1995-07-31 松下電工株式会社 電気積層板とその製造方法
JP2013122961A (ja) * 2011-12-09 2013-06-20 Ngk Spark Plug Co Ltd 配線基板、配線基板の製造方法

Also Published As

Publication number Publication date
JPS5880897A (ja) 1983-05-16

Similar Documents

Publication Publication Date Title
JPH0376794B2 (enrdf_load_stackoverflow)
US7353590B2 (en) Method of forming printed circuit card
JPH0217955B2 (enrdf_load_stackoverflow)
JPS60148188A (ja) フレキシブルな基板部分に接点を形成する方法
JP5317491B2 (ja) プリント配線板の製造方法
CN112752443A (zh) 一种台阶位置含邦定结构的印制电路板的加工方法
US4882000A (en) Method of manufacturing printed circuit boards
JPH05275852A (ja) 金属芯入りプリント配線板及びその製造方法
JP2797871B2 (ja) プリント配線板の製造方法
JP2749685B2 (ja) 回路基板の製造方法
JPH0249494A (ja) 多層プリント配線板の製造方法
JPH0378794B2 (enrdf_load_stackoverflow)
JPH08125303A (ja) 両面スルーホールプリント回路板
JPH03229488A (ja) プリント配線基板の製造方法
JPH02265296A (ja) 印刷配線基板の製造方法
JPS6355879B2 (enrdf_load_stackoverflow)
JPH0373593A (ja) フレキシブルプリント配線板の製造方法
JPS60111489A (ja) 電子部品塔載用基板およびその製造方法
JPH0336319B2 (enrdf_load_stackoverflow)
JPS5857789A (ja) 金属芯プリント配線板の製造方法およびその素材
JPS63124597A (ja) 印刷配線板の製造方法
JPS624000B2 (enrdf_load_stackoverflow)
JPH0734445B2 (ja) Ｉｃ搭載用可撓性回路基板の製造法
JPH0144036B2 (enrdf_load_stackoverflow)
JPS62102908A (ja) 印刷配線板の製造方法