JPH0413874B2 - - Google Patents

Info

Publication number
JPH0413874B2
JPH0413874B2 JP57178663A JP17866382A JPH0413874B2 JP H0413874 B2 JPH0413874 B2 JP H0413874B2 JP 57178663 A JP57178663 A JP 57178663A JP 17866382 A JP17866382 A JP 17866382A JP H0413874 B2 JPH0413874 B2 JP H0413874B2
Authority
JP
Japan
Prior art keywords
recess
plating layer
hole
organic resin
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57178663A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5967686A (ja
Inventor
Hiromi Ogawa
Osamu Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP57178663A priority Critical patent/JPS5967686A/ja
Publication of JPS5967686A publication Critical patent/JPS5967686A/ja
Priority to JP3074134A priority patent/JPH0555401A/ja
Publication of JPH0413874B2 publication Critical patent/JPH0413874B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP57178663A 1982-10-12 1982-10-12 プリント配線基板とその製造方法 Granted JPS5967686A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57178663A JPS5967686A (ja) 1982-10-12 1982-10-12 プリント配線基板とその製造方法
JP3074134A JPH0555401A (ja) 1982-10-12 1991-03-13 プリント配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57178663A JPS5967686A (ja) 1982-10-12 1982-10-12 プリント配線基板とその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP7413391A Division JPH04340293A (ja) 1991-03-13 1991-03-13 プリント配線基板の製造方法
JP3074134A Division JPH0555401A (ja) 1982-10-12 1991-03-13 プリント配線基板

Publications (2)

Publication Number Publication Date
JPS5967686A JPS5967686A (ja) 1984-04-17
JPH0413874B2 true JPH0413874B2 (enrdf_load_stackoverflow) 1992-03-11

Family

ID=16052392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57178663A Granted JPS5967686A (ja) 1982-10-12 1982-10-12 プリント配線基板とその製造方法

Country Status (1)

Country Link
JP (1) JPS5967686A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132641U (ja) * 1983-02-25 1984-09-05 日本電気株式会社 半導体装置用基板
JPS60116191A (ja) * 1983-11-29 1985-06-22 イビデン株式会社 電子部品搭載用基板の製造方法
JPS6134989A (ja) * 1984-07-25 1986-02-19 イビデン株式会社 電子部品搭載用基板
JPS61172393A (ja) * 1985-01-26 1986-08-04 イビデン株式会社 電子部品搭載用基板およびその製造方法
JPS6235654A (ja) * 1985-08-09 1987-02-16 Asaka Denshi Kk プリント基板用素子部品およびその製造方法
JPS6484698A (en) * 1987-09-26 1989-03-29 Matsushita Electric Works Ltd Manufacture of multilayer circuit board
JPH01145164U (enrdf_load_stackoverflow) * 1988-03-28 1989-10-05
JP2015095473A (ja) * 2013-11-08 2015-05-18 アイシン精機株式会社 電子部品モジュール

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247692A (en) * 1975-10-14 1977-04-15 Minolta Camera Co Ltd Printed circuit board for holding light emitting element
JPS56110292A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Semiconductor device
US4278707A (en) * 1980-05-19 1981-07-14 Hewlett-Packard Company Method for coating the edge of a printed circuit board to improve its moisture resistance

Also Published As

Publication number Publication date
JPS5967686A (ja) 1984-04-17

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