JPH0546118B2 - - Google Patents
Info
- Publication number
- JPH0546118B2 JPH0546118B2 JP7413391A JP7413391A JPH0546118B2 JP H0546118 B2 JPH0546118 B2 JP H0546118B2 JP 7413391 A JP7413391 A JP 7413391A JP 7413391 A JP7413391 A JP 7413391A JP H0546118 B2 JPH0546118 B2 JP H0546118B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- plating layer
- hole
- organic resin
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 76
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 20
- 239000010931 gold Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000006023 eutectic alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- DZCLVBQEPZQZNN-UHFFFAOYSA-N copper;phenol Chemical compound [Cu].OC1=CC=CC=C1 DZCLVBQEPZQZNN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7413391A JPH04340293A (ja) | 1991-03-13 | 1991-03-13 | プリント配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7413391A JPH04340293A (ja) | 1991-03-13 | 1991-03-13 | プリント配線基板の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57178663A Division JPS5967686A (ja) | 1982-10-12 | 1982-10-12 | プリント配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04340293A JPH04340293A (ja) | 1992-11-26 |
| JPH0546118B2 true JPH0546118B2 (enrdf_load_stackoverflow) | 1993-07-13 |
Family
ID=13538388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7413391A Granted JPH04340293A (ja) | 1991-03-13 | 1991-03-13 | プリント配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04340293A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002112516A (ja) * | 2000-09-28 | 2002-04-12 | Mitsubishi Electric Corp | ブラシレスモータ |
| JP2002299784A (ja) * | 2001-03-29 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 基板の接続構造とその製造方法 |
| KR20040021040A (ko) * | 2002-09-02 | 2004-03-10 | 박종진 | 고출력 증폭기용 알에프 피씨비 기판 제조방법 |
-
1991
- 1991-03-13 JP JP7413391A patent/JPH04340293A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04340293A (ja) | 1992-11-26 |
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