JPS5814553A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5814553A
JPS5814553A JP11189181A JP11189181A JPS5814553A JP S5814553 A JPS5814553 A JP S5814553A JP 11189181 A JP11189181 A JP 11189181A JP 11189181 A JP11189181 A JP 11189181A JP S5814553 A JPS5814553 A JP S5814553A
Authority
JP
Japan
Prior art keywords
resin
semiconductor chip
mold
package
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11189181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6336139B2 (OSRAM
Inventor
Tetsushi Wakabayashi
哲史 若林
Kaoru Tachibana
薫 立花
Eiji Aoki
英二 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11189181A priority Critical patent/JPS5814553A/ja
Publication of JPS5814553A publication Critical patent/JPS5814553A/ja
Publication of JPS6336139B2 publication Critical patent/JPS6336139B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP11189181A 1981-07-17 1981-07-17 半導体装置 Granted JPS5814553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11189181A JPS5814553A (ja) 1981-07-17 1981-07-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11189181A JPS5814553A (ja) 1981-07-17 1981-07-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS5814553A true JPS5814553A (ja) 1983-01-27
JPS6336139B2 JPS6336139B2 (OSRAM) 1988-07-19

Family

ID=14572726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11189181A Granted JPS5814553A (ja) 1981-07-17 1981-07-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS5814553A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4697203A (en) * 1984-06-04 1987-09-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and manufacturing method therefor
JPS62185787U (OSRAM) * 1986-05-16 1987-11-26
US6555447B2 (en) 1999-06-08 2003-04-29 Kulicke & Soffa Investments, Inc. Method for laser scribing of wafers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584951A (ja) * 1981-07-01 1983-01-12 Toshiba Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584951A (ja) * 1981-07-01 1983-01-12 Toshiba Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4697203A (en) * 1984-06-04 1987-09-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and manufacturing method therefor
US4769344A (en) * 1984-06-04 1988-09-06 Mitsubishi Denki Kabushiki Kaisha Method of resin encapsulating a semiconductor device
JPS62185787U (OSRAM) * 1986-05-16 1987-11-26
US6555447B2 (en) 1999-06-08 2003-04-29 Kulicke & Soffa Investments, Inc. Method for laser scribing of wafers

Also Published As

Publication number Publication date
JPS6336139B2 (OSRAM) 1988-07-19

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