JPS58138057A - Ｉｃカ−ド - Google Patents

Ｉｃカ−ド

Info

Publication number
JPS58138057A
JPS58138057A JP57020917A JP2091782A JPS58138057A JP S58138057 A JPS58138057 A JP S58138057A JP 57020917 A JP57020917 A JP 57020917A JP 2091782 A JP2091782 A JP 2091782A JP S58138057 A JPS58138057 A JP S58138057A
Authority
JP
Japan
Prior art keywords
card
module
chip
concave section
polyvinyl chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57020917A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347265B2 (enrdf_load_stackoverflow
Inventor
Seiichi Nishikawa
誠一 西川
Koichi Okada
浩一 岡田
Teruaki Jo
輝明 城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP57020917A priority Critical patent/JPS58138057A/ja
Publication of JPS58138057A publication Critical patent/JPS58138057A/ja
Publication of JPS6347265B2 publication Critical patent/JPS6347265B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57020917A 1982-02-12 1982-02-12 Ｉｃカ−ド Granted JPS58138057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57020917A JPS58138057A (ja) 1982-02-12 1982-02-12 Ｉｃカ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57020917A JPS58138057A (ja) 1982-02-12 1982-02-12 Ｉｃカ−ド

Publications (2)

Publication Number Publication Date
JPS58138057A true JPS58138057A (ja) 1983-08-16
JPS6347265B2 JPS6347265B2 (enrdf_load_stackoverflow) 1988-09-21

Family

ID=12040571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57020917A Granted JPS58138057A (ja) 1982-02-12 1982-02-12 Ｉｃカ−ド

Country Status (1)

Country Link
JP (1) JPS58138057A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914084A (ja) * 1982-07-15 1984-01-24 Toppan Printing Co Ltd Ｉｃ等を内蔵するカ−ドの製造方法
JPS5990184A (ja) * 1982-09-27 1984-05-24 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン デ−タカ−ドおよびその製造方法
JPS59170982A (ja) * 1982-12-28 1984-09-27 ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−ハ− 多層のｉｄカ−ドおよびその製造方法
JPS60126864U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
JPS60126863U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
JPS611850U (ja) * 1984-06-08 1986-01-08 松島工業株式会社 半導体素子
JPS6121097U (ja) * 1984-03-09 1986-02-06 ソニー株式会社 回路装置
JPS63132460A (ja) * 1986-11-21 1988-06-04 Mitsubishi Electric Corp 薄型半導体モジユ−ル基板
JPH03114789A (ja) * 1989-09-29 1991-05-15 Mitsubishi Electric Corp 半導体装置カード
US5048179A (en) * 1986-05-23 1991-09-17 Ricoh Company, Ltd. IC chip mounting method
US5736781A (en) * 1993-10-18 1998-04-07 Oki Electric Industry Co., Ltd. IC module and a data carrier employing the same
JP2005535105A (ja) * 2002-04-18 2005-11-17 エフシーアイ チップカード用電子マイクロサーキットのコンディショニング方法と、この方法により製造される電子マイクロサーキットモジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0380359U (enrdf_load_stackoverflow) * 1989-12-07 1991-08-16

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914084A (ja) * 1982-07-15 1984-01-24 Toppan Printing Co Ltd Ｉｃ等を内蔵するカ−ドの製造方法
JPS5990184A (ja) * 1982-09-27 1984-05-24 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン デ−タカ−ドおよびその製造方法
JPS59170982A (ja) * 1982-12-28 1984-09-27 ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−ハ− 多層のｉｄカ−ドおよびその製造方法
JPS60126864U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
JPS60126863U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
JPS6121097U (ja) * 1984-03-09 1986-02-06 ソニー株式会社 回路装置
JPS611850U (ja) * 1984-06-08 1986-01-08 松島工業株式会社 半導体素子
US5048179A (en) * 1986-05-23 1991-09-17 Ricoh Company, Ltd. IC chip mounting method
JPS63132460A (ja) * 1986-11-21 1988-06-04 Mitsubishi Electric Corp 薄型半導体モジユ−ル基板
JPH03114789A (ja) * 1989-09-29 1991-05-15 Mitsubishi Electric Corp 半導体装置カード
US5736781A (en) * 1993-10-18 1998-04-07 Oki Electric Industry Co., Ltd. IC module and a data carrier employing the same
JP2005535105A (ja) * 2002-04-18 2005-11-17 エフシーアイ チップカード用電子マイクロサーキットのコンディショニング方法と、この方法により製造される電子マイクロサーキットモジュール

Also Published As

Publication number Publication date
JPS6347265B2 (enrdf_load_stackoverflow) 1988-09-21

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