JPS58124248A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58124248A
JPS58124248A JP57006016A JP601682A JPS58124248A JP S58124248 A JPS58124248 A JP S58124248A JP 57006016 A JP57006016 A JP 57006016A JP 601682 A JP601682 A JP 601682A JP S58124248 A JPS58124248 A JP S58124248A
Authority
JP
Japan
Prior art keywords
glass
melting point
low melting
pellet
point glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57006016A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347264B2 (enExample
Inventor
Kazuo Horiuchi
和雄 堀内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57006016A priority Critical patent/JPS58124248A/ja
Publication of JPS58124248A publication Critical patent/JPS58124248A/ja
Publication of JPS6347264B2 publication Critical patent/JPS6347264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Die Bonding (AREA)
JP57006016A 1982-01-20 1982-01-20 半導体装置 Granted JPS58124248A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57006016A JPS58124248A (ja) 1982-01-20 1982-01-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57006016A JPS58124248A (ja) 1982-01-20 1982-01-20 半導体装置

Publications (2)

Publication Number Publication Date
JPS58124248A true JPS58124248A (ja) 1983-07-23
JPS6347264B2 JPS6347264B2 (enExample) 1988-09-21

Family

ID=11626897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57006016A Granted JPS58124248A (ja) 1982-01-20 1982-01-20 半導体装置

Country Status (1)

Country Link
JP (1) JPS58124248A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991007776A1 (en) * 1989-11-15 1991-05-30 Olin Corporation A method for housing a tape-bonded electronic device and the package employed
US5496619A (en) * 1992-05-14 1996-03-05 Matsushita Electric Industrial Co., Ltd. Assembly formed from conductive paste and insulating paste

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110772A (enExample) * 1974-02-08 1975-09-01
JPS5230352A (en) * 1975-09-04 1977-03-08 Nippon Telegr & Teleph Corp <Ntt> Micro program control method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110772A (enExample) * 1974-02-08 1975-09-01
JPS5230352A (en) * 1975-09-04 1977-03-08 Nippon Telegr & Teleph Corp <Ntt> Micro program control method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991007776A1 (en) * 1989-11-15 1991-05-30 Olin Corporation A method for housing a tape-bonded electronic device and the package employed
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
US5496619A (en) * 1992-05-14 1996-03-05 Matsushita Electric Industrial Co., Ltd. Assembly formed from conductive paste and insulating paste

Also Published As

Publication number Publication date
JPS6347264B2 (enExample) 1988-09-21

Similar Documents

Publication Publication Date Title
US3591839A (en) Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
JPS58124248A (ja) 半導体装置
JPS58143541A (ja) 半導体装置
JPS62174956A (ja) プラスチツク・モ−ルド型半導体装置
JPS5910229A (ja) 半導体装置およびその製造方法
JPS5992552A (ja) 半導体装置
JPS54129880A (en) Manufacture for semiconductor device
JPH0520903B2 (enExample)
JPH0332048A (ja) 半導体装置
JPS6221244A (ja) 半導体装置
JPS5816550A (ja) 半導体装置
JPH01238129A (ja) 樹脂封止型半導体装置
JP2753363B2 (ja) 半導体装置
JPS58100436A (ja) 半導体装置の製造方法
JPS5936947A (ja) 半導体装置
JPS6127641A (ja) 集積回路装置の製造方法
JPH02189939A (ja) 半導体装置の樹脂封止方法
JPS59211252A (ja) 半導体装置
JPS59117238A (ja) 半導体装置の製造方法
JPS6155778B2 (enExample)
JPS6290952A (ja) 半導体装置
JPS60241243A (ja) リ−ドフレ−ム
JPH03283648A (ja) 樹脂封止型半導体装置
JPS6474788A (en) Semiconductor laser
JPS6327029A (ja) 樹脂封止型半導体装置の製造方法