JPS58122759A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58122759A
JPS58122759A JP57004422A JP442282A JPS58122759A JP S58122759 A JPS58122759 A JP S58122759A JP 57004422 A JP57004422 A JP 57004422A JP 442282 A JP442282 A JP 442282A JP S58122759 A JPS58122759 A JP S58122759A
Authority
JP
Japan
Prior art keywords
package
cap
ground terminal
high frequency
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57004422A
Other languages
English (en)
Japanese (ja)
Other versions
JPH044753B2 (enFirst
Inventor
Akihiro Kubota
昭弘 窪田
Junichi Kasai
純一 河西
Tsuyoshi Aoki
強 青木
Michio Ono
小野　道夫
Masao Takehiro
武広　正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57004422A priority Critical patent/JPS58122759A/ja
Publication of JPS58122759A publication Critical patent/JPS58122759A/ja
Publication of JPH044753B2 publication Critical patent/JPH044753B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57004422A 1982-01-14 1982-01-14 半導体装置 Granted JPS58122759A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57004422A JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57004422A JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58122759A true JPS58122759A (ja) 1983-07-21
JPH044753B2 JPH044753B2 (enFirst) 1992-01-29

Family

ID=11583827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57004422A Granted JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58122759A (enFirst)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121653U (ja) * 1984-01-27 1985-08-16 株式会社東芝 半導体装置の外囲器
JPS60180852A (ja) * 1984-02-28 1985-09-14 Kyocera Corp 熱印刷装置
JPS60163751U (ja) * 1984-04-04 1985-10-30 スタンレー電気株式会社 半導体装置
JPS61114564A (ja) * 1984-11-09 1986-06-02 Nec Corp 静電破壊防止機構付きｉｃパツケ−ジ
JPS61195067U (enFirst) * 1985-05-24 1986-12-04
JPS6230356U (enFirst) * 1985-08-07 1987-02-24
FR2774810A1 (fr) * 1998-02-10 1999-08-13 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863657U (enFirst) * 1971-11-22 1973-08-13
JPS51138165A (en) * 1975-05-23 1976-11-29 Mitsubishi Electric Corp Package stracture for thermal resistance and shield

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863657U (enFirst) * 1971-11-22 1973-08-13
JPS51138165A (en) * 1975-05-23 1976-11-29 Mitsubishi Electric Corp Package stracture for thermal resistance and shield

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121653U (ja) * 1984-01-27 1985-08-16 株式会社東芝 半導体装置の外囲器
JPS60180852A (ja) * 1984-02-28 1985-09-14 Kyocera Corp 熱印刷装置
JPS60163751U (ja) * 1984-04-04 1985-10-30 スタンレー電気株式会社 半導体装置
JPS61114564A (ja) * 1984-11-09 1986-06-02 Nec Corp 静電破壊防止機構付きｉｃパツケ−ジ
JPS61195067U (enFirst) * 1985-05-24 1986-12-04
JPS6230356U (enFirst) * 1985-08-07 1987-02-24
FR2774810A1 (fr) * 1998-02-10 1999-08-13 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
US6312975B1 (en) 1998-02-10 2001-11-06 Stmicroelectronics S.A. Semiconductor package and method of manufacturing the same
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods

Also Published As

Publication number Publication date
JPH044753B2 (enFirst) 1992-01-29

Similar Documents

Publication Publication Date Title
US4829432A (en) Apparatus for shielding an electrical circuit from electromagnetic interference
US20030218873A1 (en) Structure for fastening a component
JPH10284867A (ja) プリント回路板に装架するための２部品電磁放射遮蔽装置
JPS58122759A (ja) 半導体装置
KR100297225B1 (ko) 방사차폐안테나장치를가진휴대용통신장치
FI72239C (fi) Anordning foer undertryckande av radiofrekventa stoerningar.
JPH08102607A (ja) 無線機へのアンテナ要素装着
US20020054485A1 (en) Apparatus for shielding
JPH09129316A (ja) コネクタ及びコネクタ取り付け構造
JPH1140709A (ja) 半導体実装構造およびその製造方法
JPH0822867A (ja) 電子機構部品とケーブルの接続部の電磁シールド手段
JP3597326B2 (ja) 高周波機器及びそれを用いた電子機器
JP2767998B2 (ja) 電子部品のシールド構造
JPH0644679B2 (ja) 高周波回路装置のシ−ルド構造
KR200162128Y1 (ko) 모니터의 음극선관 전자파 차폐용 실드
JPH1041665A (ja) 高周波数発振器
JP2001223604A (ja) 無線通信モジュール
JPH084744Y2 (ja) 弾性表面波装置
JPH1174669A (ja) 無線周波シールド電子回路基板
JPS607741A (ja) 混成集積回路装置
JP3617684B2 (ja) 回路基板装置
JPH0117835Y2 (enFirst)
JPH10173468A (ja) 弾性表面波装置
JPH05327272A (ja) 電子回路装置
JPH0229755Y2 (enFirst)