JPS58116739A - 膜多結晶体の粒子サイズの制御方法 - Google Patents
膜多結晶体の粒子サイズの制御方法Info
- Publication number
- JPS58116739A JPS58116739A JP21287181A JP21287181A JPS58116739A JP S58116739 A JPS58116739 A JP S58116739A JP 21287181 A JP21287181 A JP 21287181A JP 21287181 A JP21287181 A JP 21287181A JP S58116739 A JPS58116739 A JP S58116739A
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- temperature
- film
- heat treatment
- amorphous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000002245 particle Substances 0.000 title claims abstract description 15
- 239000013078 crystal Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 17
- 230000006911 nucleation Effects 0.000 claims description 20
- 238000010899 nucleation Methods 0.000 claims description 20
- 238000005468 ion implantation Methods 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 2
- 239000002178 crystalline material Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 230000001133 acceleration Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 30
- 150000002500 ions Chemical class 0.000 description 15
- 238000000137 annealing Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 241000208140 Acer Species 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21287181A JPS58116739A (ja) | 1981-12-29 | 1981-12-29 | 膜多結晶体の粒子サイズの制御方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21287181A JPS58116739A (ja) | 1981-12-29 | 1981-12-29 | 膜多結晶体の粒子サイズの制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58116739A true JPS58116739A (ja) | 1983-07-12 |
JPS6244403B2 JPS6244403B2 (enrdf_load_stackoverflow) | 1987-09-21 |
Family
ID=16629652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21287181A Granted JPS58116739A (ja) | 1981-12-29 | 1981-12-29 | 膜多結晶体の粒子サイズの制御方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58116739A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200887A (ja) * | 1984-03-23 | 1985-10-11 | Nippon Sheet Glass Co Ltd | 磁性薄膜の製造方法 |
JPS63185016A (ja) * | 1987-01-27 | 1988-07-30 | Sony Corp | 半導体薄膜の形成方法 |
US5733369A (en) * | 1986-03-28 | 1998-03-31 | Canon Kabushiki Kaisha | Method for forming crystal |
US5846320A (en) * | 1986-03-31 | 1998-12-08 | Canon Kabushiki Kaisha | Method for forming crystal and crystal article obtained by said method |
-
1981
- 1981-12-29 JP JP21287181A patent/JPS58116739A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200887A (ja) * | 1984-03-23 | 1985-10-11 | Nippon Sheet Glass Co Ltd | 磁性薄膜の製造方法 |
US5733369A (en) * | 1986-03-28 | 1998-03-31 | Canon Kabushiki Kaisha | Method for forming crystal |
US5853478A (en) * | 1986-03-28 | 1998-12-29 | Canon Kabushiki Kaisha | Method for forming crystal and crystal article obtained by said method |
US5846320A (en) * | 1986-03-31 | 1998-12-08 | Canon Kabushiki Kaisha | Method for forming crystal and crystal article obtained by said method |
JPS63185016A (ja) * | 1987-01-27 | 1988-07-30 | Sony Corp | 半導体薄膜の形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6244403B2 (enrdf_load_stackoverflow) | 1987-09-21 |
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